Wednesday, November 14, 2018

SK Hynix : Announces 1Ynm 16Gb DDR5 DRAM



(marketscreener.com) SK Hynix Inc. Announces 1Ynm 16Gb DDR5 DRAM2018.11.15 Seoul, November 15, 2018 - SK Hynix Inc. (or 'the Company', www.skhynix.com) announced that it has developed 16Gb (Gigabits) DDR5 (Double Data Rate 5) DRAM, the industry's first DDR5 to meet the JEDEC standards. 
 
The same 1Ynm process technology used for the recently-developed 1Ynm 8Gb DDR4 DRAM was applied to the new DRAM, giving an industry-leading competitive edge for the Company. DDR5 is a next-generation DRAM standard that offers ultra-high speed and high density with reduced power consumption as compared to DDR4, for use in data-intensive applications such as big data, artificial intelligence, and machine learning. SK Hynix successfully lowered the operating voltage from 1.2V to 1.1V, achieving 30% lower power consumption compared to the previous generation, DDR4 DRAM. The new 16Gb DDR5 DRAM supports a data transfer rate of 5200Mbps, about 60% faster compared to 3200Mbps of the previous generation, with which it can process 41.6GB (Gigabytes) of data-11 full-HD video files (3.7GB each)-per second. The Company provided a major chipset maker with RDIMM (Registered Dual In-line Memory Module) and UDIMM (Unbuffered DIMM) for server and PC platforms, with more memory banks-doubled from 16 to 32 banks-in accordance with the JEDEC DDR5 standards. 'Based on technological advancements that allowed the industry's first DDR5 DRAM to meet the JEDEC standards, SK Hynix plans to begin mass producing the product from 2020, when the DDR5 market is expected to open, to actively respond to the demands of clients,' said vice president Joohwan Cho, the Head of Volume Product Design Group. According to IDC, a market research institute, demand for DDR5 is expected to rise from 2020, accounting for 25% of the total DRAM market in 2021 and 44% in 2022.

Source: 4-traders LINK

EpiGaN Increases Production with AIXTRON's MOCVD Equipment


EpiGaN, the Belgian GaN-on-Si and GaN-on-SiC epitaxial wafer provider, has ordered a new AIX G5+ C system from AIXTRON to expand its production capability for large size wafer.
 
The new AIXTRON AIX G5+ C reactor will be installed at EpiGaN’s manufacturing site in Hasselt Belgium in the first quarter of 2019 and start to operate afterwards. The fully automated Planetary® MOCVD system features in-situ chamber cleaning and enables configurations of 8x6 inch or 5x8 inch epitaxial wafers to be automatically loaded and removed by a cassette-to-cassette wafer transfer module.

Source: LEDinside LINK

Tuesday, November 13, 2018

Spin Memory Teams With Applied Materials to Produce a Comprehensive Embedded MRAM Solution

FREMONT, Calif. — Spin Memory, Inc. (Spin Memory), the leading MRAM developer, today announced a commercial agreement with Applied Materials, Inc. (Applied) to create a comprehensive embedded MRAM solution. The solution brings together Applied’s industry-leading deposition and etch capabilities with Spin Memory’s MRAM process IP.

 
 
Key elements of the offering include Applied innovations in PVD and etch process technology, Spin Memory’s revolutionary Precessional Spin CurrentTM (PSCTM) structure (also known as the Spin Polarizer), and industry-leading perpendicular magnetic tunnel junction (pMTJ) technology from both companies. The solution is designed to allow customers to quickly bring up an embedded MRAM manufacturing module and start producing world-class MRAM-enabled products for both non-volatile (flash-like) and SRAM-replacement applications. Spin Memory intends to make the solution commercially available from 2019.

“In the AI and IoT era, the industry needs high-speed, area-efficient non-volatile memory like never before,” said Tom Sparkman, CEO at Spin Memory. “Through our collaboration with Applied Materials, we will bring the next generation of STT-MRAM to market and address this growing need for alternative memory solutions.”

“Our industry is driving a new wave of computing that will result in billions of sensors and a dramatic increase in data generation,” said Steve Ghanayem, senior vice president of New Markets and Alliances at Applied Materials. “As a result, we are seeing a renaissance in hardware innovation, from materials to systems, and we are excited to be teaming up with Spin Memory to help accelerate the availability of a new memory.”
About the PSC

Updated website NCD for ALD technology and equipment

Updated website NCD for ALD technology and equipment: www.ncdtech.co.kr

NCD updated its website with re-formation and company promotional video clip for the introduction and main equipment.


Friday, November 9, 2018

Veeco and ALLOS Collaborate to Advance microLED Tech

Plainview, N.Y., Nov. 8, 2018—Veeco Instruments Inc. (Nasdaq: VECO) and ALLOS Semiconductors GmbH announced today the completion of another phase of their mutual effort to provide the industry with leading GaN-on-Silicon epiwafer technology for microLED production. The purpose of the companies’ most recent collaboration was to demonstrate the reproducibility of ALLOS’ 200 mm GaN-on-Si epiwafer technology on Veeco’s Propel® MOCVD reactor when producing epiwafers for many prominent global consumer electronics companies.

“To bring microLED technology into production, simply presenting champion values for a single metric is insufficient. It is essential to achieve the whole set of specifications for each wafer with excellent repeatability and yield,” said Peo Hansson, Ph.D., senior vice president and general manager of Veeco’s Compound Semiconductor business unit. “This successful joint effort reaffirms the power of combining Veeco’s superior MOCVD expertise with ALLOS’ GaN-on-Silicon epiwafer technology to provide customers a novel, proven and reliable approach to accelerate microLED adoption.” 


Tuesday, November 6, 2018

Leading Provider of Semiconductor Manufacturing Services Selects Veeco's AP300E to Support Aggressive Advanced Packaging Expansion


One of the World’s Largest Outsourced Assembly and Test Providers Names AP300E™ Their Preferred Lithography System Due to Veeco’s Industry-Leading Uptime and Process Performance

Nov. 06, 2018—Veeco Instruments Inc. (Nasdaq: VECO) announced today that one of the world’s largest outsourced assembly and test (OSAT) providers has purchased multiple Veeco AP300E lithography systems. Complementing the OSAT’s previously installed Veeco tools, the AP300E was selected based on its superior uptime, lower total cost of ownership (CoO) and exceptional performance. This purchase is illustrative of continued strong market demand for Veeco’s expanding portfolio of lithography systems, given the tools’ ability to handle next-generation advanced packaging process needs including copper (Cu) pillar, wafer-level packaging (WLP), fan-out WLP (FOWLP) and 3D integrated circuit developments. 
 
 
Veeco AP300, The AP200/300 family of lithography systems is built on Veeco’s customizable Unity Platform™, delivering superior overlay, resolution and side wall profile performance and enabling highly-automated and cost- effective manufacturing. These systems are particularly well suited for copper pillar, fan-out, through-silicon via (TSV) and silicon interposer applications (veeco.com).
The AP300E lithography stepper’s exceptional overlay, resolution, sidewall profile performance and broadband flexibility enable highly automated, cost-effective manufacturing valued by foundries and OSATs for applications such as fan-in WLP, FOWLP, through-silicon via, silicon interposer solder and Cu pillar bumping. Given the exponential market growth expected in mobile, IoT and artificial intelligence (AI) applications, OSATs seek to ensure they are competitively positioned to drive customer acquisition and retention. According to Yole, the equipment and materials market for FOWLP alone will expand at a compound annual growth rate (CAGR) of 43 percent to reach $694 million by 2021.

“Increased mobility, IoT, AI and deep learning are seeing explosive growth in step with global megatrends, all of which are enabled by technologies like 3D integration and advanced packaging,” noted Peter Porshnev, Ph.D., senior vice president and general manager of Veeco’s Ultratech business unit. “As we grow our customer base, Veeco’s experienced team of technologists continues to work closely with OSATs and foundries to deliver industry-leading innovations that directly address their performance, yield and CoO challenges.”

SK Hynix 96-Layer 512Gb TLC NAND

SK Hynix Inc. Launches the World’s First ‘CTF-based 4D NAND Flash’ (96-Layer 512Gb TLC)

Seoul, November 4, 2018 – SK Hynix Inc. (or ‘the Company’, www.skhynix.com) launched the world’s first 96-Layer 512Gb (Gigabit) ‘CTF based 4D (Four-Dimensional) NAND Flash (4D NAND)’ based on its TLC (Triple-Level Cell) arrays, using 3D CTF (Charge Trap Flash) design paired with the PUC (Peri. Under Cell) technology. The Company will start the early stage of mass production of the 96-Layer 4D NAND within this year. A single 512Gb NAND Flash chip can represent 64GB (Gigabytes) storage.



Source : SK Hynix (LINK)

Sunday, November 4, 2018

Foundry investment in 5nm has started according to ASM

Here are some take aways form the ASM International Earnings Call for Q3/2018 [Full transcript by Seeking Alpa, LINK]. Interestingly there was no talk about "The end of Moore´s Law" at all. On the contrary ASM see that Foundry investment in 5nm has started and will increase in 2019 and incearsed number of additional new ALD applications will be deployed.

For ASM the equipment sales were led by their ALD business, but they also recorded healthy sales levels in our other product lines. By industry segment, revenue in the quarter was led by foundry, followed by memory and then logic. Within memory the larger part of sales was related to DRAM investments, while NAND sales decreased compared to the second quarter. 
"The structural outlook for the ALD market remains strong. ALD continues to be a key enabler of Moore's Law. An increasing number of ALD steps will be needed to help create the smaller geometries, new materials, and more complex device architectures that are on our customers' roadmap." 
- Chuck del Prado, President and CEO of ASMI.
  • Spending in the advanced logic segment is clearly higher in 2018 compared to last year.
  • Foundry spending is lower this year and is driven by further 7-nanometer investments as well as the first investments in 5-nanometer. 
  • Investments for the 5-nanometer node are likely to further increase in the course of next year.
  • ASM expectation is that the 5-nanometer foundry node is going to be an important transition for the company, with good opportunities to expand with multiple new ALD applications/layers. 
  • The DRAM segment is to show solid growth for the wafer equipment market in in 2018. For ASM, DRAM is also one of the drivers behind higher sales this year. ASM remain strongly focused on broadening our position in DRAM to new ALD solutions.
  • 3D NAND spending is coming down significantly in the second half of this year. Also, for the full year of 2018 NAND spending is expected to be lower.
  • A recovery in investments in the NAND segment will likely be driven by the transition to the next device generations of 90-plus layers. These next device generations are expected to need an increased number of advanced single wafer ALD applications.

AP Systems to supply Thin Film Encapsulation to Samsung Display QD-OLED line

DIGITimes China reports [LINK] that Samsung Display is building a large-scale quantum dot organic light-emitting diode (QD-OLED) panel pilot production line. The line is scheduled to be finished in December 2018 and will be activated after 6 months (mid 2019). According to the report the supply ration from Korean equipment manufacturers has increased significantly for this line.

As an example the the report claims that AP Systems beat Applied Materials to supply the Thin Film Encapsulation (TFE) equipment. AP Systems has previously supplied TFE equipment for the 8th generation RGB OLED TV panel production line (V1) of Samsung Display. In the past Samsung Display has used TFE equipment supplied by Applied Materials in the 6th generation flexible OLED production line, but has now switched and for its AP Systems in this 8th generation QD-OLED test production line.

Also according to the report, the PECVD equipment will be supplied by Wonik IPS from Korea whereas the blue OLED material evaporation equipment will be supplied by Canon Tokki (Japan) and the red and green QD material inkjet printing machine will come from Kateeva (USA).
The KORONA™ TFE System running PEALD with "Multi-linear Nozzle" technology and ICP antenna design technology (high density/low damage plasma).
For TFE AP Systems are using a Plasma enhanced Atomic Layer Deposition (PEALD) technology on their KORONA™ TFE System. The system is capable of depositing a film structure that acts as a sealant to prevent oxygen and moisture penetration into OLED device. Based on a 1000Å, SiNx/SiOx multi-layer structure the Water Vapor Permeability is less than 5e-5 g/m2/day.
According to AP Systems they can also apply the film as a flexible sealant to realize flexible, rollable, and foldable displays. 


Thursday, November 1, 2018

ASM Internationalreports its 3Q/2018 operating results

ASM International N.V. (Euronext Amsterdam: ASM) today reports its third quarter 2018 operating results (unaudited) in accordance with IFRS [LINK]

  • New orders received of €258 million, at the highest level in history, increased 47% compared to Q2 2018 and were 61% higher compared to Q3 of last year.
  • Net sales for the third quarter 2018 were €196 million, a decrease of 6% compared to the previous quarter and an increase of 10% compared to Q3 last year.
  • Gross profit margin was 40.9% in Q3 2018 compared to 42.1% in the previous quarter and 38.8% in Q3 of last year.
  • Operating result decreased to €28 million compared to the previous quarter. The decrease is mainly the result of the lower sales level.
  • Normalized net earnings for the third quarter 2018 decreased by €20 million compared to Q2 2018.
Additional information:
Quarterly earnings call Q2 2018
Quarterly report Q3 2018
Investor presentation Q3 2018
Annual Report 2017