Saturday, August 19, 2017

OSRAM Opto Semiconductor Acquires MOCVD Systems from AIXTRON

AIXTRON announced that OSRAM Opto Semiconductors has purchased the company's AIX 2800G4-TM Planetary system for the manufacturing of mainly infrared-based high power lasers and LEDs based on gallium arsenide (GaAs).

Source: LEDinside LINK
Photo credit: Aixtron (
From Aixtron Press release: “We are very pleased that OSRAM Opto Semiconductors has selected our AIX 2800G4-TM platform for the production of high power laser and infrared LED devices. Their trust in our AIX 2800G4-TM system confirms our strategy to focus on solutions for the most demanding applications, where superior process performance is mandatory to meet our customer’s requirements. Following the recent qualification of our AIX G5 C platform and achieving this key milestone also with the AIX 2800G4-TM, we are looking forward to further deepen our partnership with one of the most innovative semiconductor manufacturers worldwide”, explains Dr. Frank Schulte, Vice President AIXTRON Europe.

Wednesday, August 16, 2017

BALD News - Don´t miss any atomic level processing news!

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Tuesday, August 15, 2017

Oxford Instruments Plasma Technology announces a new partner in Korea

Oxford Instruments Plasma Technology is delighted to announce that it has signed an Agent Agreement with Woowon Technology Co. Ltd. in Korea. Woowon, established in 1990, are experts in the semiconductor industry, offering a wealth of experience to customers engaged in the development and manufacture of Semiconductor, LED, Solar Energy and MEMS devices.

Source : Nanotechnology Now (LINK)

Wonik IPS looks promising on increased demands for semicon equipment

As reported by Pulse: According to Seoul-based market data provider FnGuide, Wonik IPS’s operating profit for the second quarter ended June is estimated to have been a record-high of 42.1 billion won ($37.4 million). Sales and operating profit for full 2017 are also expected to reach 581.1 billion won and 123.1 billion won, respectively, versus 244.1 billion won and 28.7 billion won last year, according to the data provider. Market analysts forecast the corresponding figures could go higher to 660.8 billion won and 144 billion won next year. 

Wonik IPS, separated from Wonik Holdings in April 2016, runs two mainstay operations. Its semiconductor business manufactures plasma-enhanced chemical vapor deposition (PECVD) and atomic layer deposition (ALD) equipment, while display business is responsible for supplying in-factory delivery equipment. As of last year, sales from its semiconductor business accounted for 70.6 percent of its entire sales while display business for the remainder. 

Thursday, August 10, 2017

Dow & DuPont Set Aug. 31 for Closing of Historic Chemical Merger

Bloomberg reports that: Dow Chemical Co. and DuPont Co., the two largest U.S. chemical makers, have received all the regulatory approvals needed to close their historic merger.

The deal will be completed after the stock market closes on Aug. 31, the companies said in a statement Friday. Shares of DowDuPont Inc. will begin trading Sept. 1 under the ticker DWDP.

KKR puts planned buyout of Hitachi Kokusai on hold

TOKYO (Reuters) - U.S. buyout firm KKR has put on hold a planned acquisition of Hitachi Ltd's chip making equipment and video solution business, the companies said, citing issues over the terms of the deal.

KKR in April agreed to buy Hitachi Kokusai Electric in a deal valuing the company at about $2.3 billion and was due to buy up to 48.33 percent of the company at 2,503 yen per share through a tender offer as a first step in the process. The tender offer was due to start as early as Thursday. 

But a third-party committee reported to board of directors at Hitachi Kokusai Electric that it no longer supported the terms of the planned transaction which could be disadvantageous to minority shareholders of Hitachi Kokusai.

On April 26, when KKR announced the deal, Hitachi Kokusai shares closed at 2,675 yen, 6.9 percent higher than the KKR's offer price. The stock has since risen above that level and closed at 2,894 yen on Wednesday.

KKR said the third-party committee "finds it difficult at the current time to maintain its opinion that the legitimacy and propriety of the tender offer price and share repurchase price are ensured..."

As part of the deal, Hitachi Kokusai was also planning to buy a 51.67 percent stake held by its parent Hitachi at 1,710 yen a share and then cancel the shares.

KKR is also planning to sell a 40 percent stake in Hitachi Kokusai's video solutions business to Hitachi and a Japanese investment fund, Japan Industrial Partners Inc.

KKR said that it would continue discussions with Hitachi Kokusai, Hitachi and Japan Industrial Partners on its plans regarding the tender offer, whether to go ahead with it and its possible timing.

Tuesday, August 8, 2017

Silicon Wafer Shortage Starts in 2018

TECHCET's model shows all slack soon gone from supply-chain for both 300mm and 200mm diameter

San Diego, CA, July 27, 2017:  TECHCET CA—the advisory service firm providing electronic materials information—today announced that the silicon wafer supply for semiconductor device fabrication is forecasted to appreciably lag demand starting next year, and could remain in shortage through the year 2021 despite investments in China. Silicon wafer area demand is forecasted to steadily increase at a CAGR of ~3.1% over the 2016-2021 period to reach over 13,000 million square inches (MSI). Executives of silicon wafer suppliers have stated that average selling prices have remained too low to allow for investment in 300mm expansions, as detailed in a quarterly update to the TECHCET Critical Materials Report™, “Silicon Wafers Market & Supply-Chain."

The silicon wafer supply-chain is dominated by two suppliers--Shin-Etsu Handotai and SUMCO--combining to capture almost two-thirds of the global wafer market in 2016, and the top five representing over 92% of total revenues. The silicon wafer market is maturing as evidenced by recent mergers and acquisitions, the two most notable being the acquisition of SunEdison Semi by GlobalWafers (Taiwan) and the assumption of majority ownership of LG Siltron by SK Holdings (Korea).

"Over the last five years, the average selling price per square inch of semiconductor-grade silicon wafers has declined by about a third and more than a half from the 2007 level," explained Michel Walden, lead author of the report and senior technology analyst with TECHCET. “However, current tightness in the supply-chain has led to greater stability and even price increases in some cases, all of which is likely needed for the long-term health of the wafer suppliers.”

Over the past few years, silicon suppliers decommissioned roughly 25% of the peak capacity for 200 mm wafers. Of the remaining 200 mm capacity, roughly 65 % of the total demand is for epitaxial (epi) wafers, and a series of epi service companies have embraced this opportunity and provide a variety of layer configurations for their customers.

Global suppliers of silicon wafers covered in this report include:
  • GlobalWafers Silicon,
  • LG Siltron,
  • National Silicon Industry Group,
  • Okmetic Ojy,
  • Siltronic,
  • Shin-Etsu Chemical Co. Ltd. (SEH),
  • SUMCO Corp.,
  • SunEdison Semiconductor,
  • Wafer Works, and
  • Zing Semiconductor.

ABOUT TECHCET:  TECHCET CA LLC is an advisory service firm focused on process materials supply-chains, electronic materials technology, and materials market analysis for the semiconductor, display, solar/PV, and LED industries. Since 2000, the company has been responsible for producing the SEMATECH Critical Material Reports, covering silicon wafers, semiconductor gases, wet chemicals, CMP consumables, Photoresists, and ALD/CVD Precursors. For additional information about these reports or CMC Fabs membership please contact Diane Scott or Michel Walden at  +1-480-332-8336, or go to or  +1-480-332-8336, or go to or

Friday, August 4, 2017

Semiconductor Capital Spending Is Forecast to Grow 10.2 Percent in 2017

Gartner Says Worldwide Semiconductor Capital Spending Is Forecast to Grow 10.2 Percent in 2017

(Gartner press release, August 2, 2017) Worldwide semiconductor capital spending is projected to increase 10.2 percent in 2017, to $77.7 billion, according to Gartner, Inc. This growth rate is up from the previous quarter's forecast of 1.4 percent, due to continued aggressive investment in memory and leading-edge logic which is driving spending in wafer-level equipment (see Table 1).

"Spending momentum is more concentrated in 2017 mainly due to strong manufacturing demand in memory and leading-edge logic. The NAND flash shortage was more pronounced in the first quarter of 2017 than the previous forecast, leading to over 20 percent growth of etch and chemical vapor deposition (CVD) segments in 2017 with a strong capacity ramp-up for 3D NAND,"
said Takashi Ogawa, research vice president at Gartner.

According to Gartner's latest view, the next cyclical down cycle will emerge in 2018 to 2019 in capital spending, compared with 2019 to 2020 in the previous quarter's forecast. "Spending on wafer fab equipment will follow a similar cycle with a peak in 2018. While the most likely scenario will still keep positive growth in 2018, there is a concern that the growth will turn negative if the end-user demand in key electronics applications is weaker than expected," said Mr. Ogawa.

Worldwide Semiconductor Capital Spending and Equipment Spending Forecast, 2016-2020(Millions of Dollars)

Thursday, August 3, 2017

Silicon wafer shortage starts in 2018

TECHCET CA, an advisory service firm providing electronic materials information, today announced that the silicon wafer supply for semiconductor device fabrication is forecasted to appreciably lag demand starting next year, and could remain in shortage through the year 2021 despite investments in China. Silicon wafer area demand is forecasted to steadily increase at a CAGR of ~3.1% over the 2016-2021 period to reach over 13,000 million square inches (MSI). Executives of silicon wafer suppliers have stated that average selling prices have remained too low to allow for investment in 300mm expansions, as detailed in a quarterly update to the TECHCET Critical Materials Report, “Silicon Wafers Market & Supply-Chain.”

Full story - Source: Solid State Technology LINK


Tuesday, August 1, 2017

Versum Materials Reports Third Quarter Fiscal 2017 Financial Results

TEMPE, Ariz.-(BUSINESS WIRE)-Versum Materials, Inc. (NYSE: VSM), a leading global materials and equipment supplier to the semiconductor industry, today reported results for the fiscal third quarter ended June 30, 2017. Sales of $290.8 million were up 19.8% from the same quarter a year ago, driven by robust volume growth from both business segments, Delivery Systems.

Source: Blackbird LINK

Sales for the fiscal third quarter ended June 30, 2017 were $206.4 million, up 6.7% from the same quarter a year ago. This increase was led by strong growth in Advanced Materials with flat results in Process Materials due to capacity limitations and unfavorable price/mix. Currency contributed 1% to the increase.

Delivery Systems & Services (DS&S):
Sales for the fiscal third quarter ended June 30, 2017 were $83.5 million, up 69.7% from the same quarter a year ago, primarily driven by continued strong equipment sales growth due to robust demand from the memory market, next generation nodes and growth in China.

San’an Optoelectronics qualifies AIXTRON Showerhead Reactor for production of Deep UV LEDs

Novel process chamber design enables enhanced fabrication of high performance Deep UV LEDs

AIXTRON SE (FSE: AIXA), a worldwide leading provider of deposition equipment to the semiconductor industry, announced today that globally leading Chinese optoelectronics manufacturer San’an has successfully completed the qualification of AIXTRON’s novel Close Coupled Showerhead (CCS) process chamber designed for the production of Deep Ultra Violet (DUV) LEDs.

The new process chamber is based on AIXTRON’S well proven CCS technology. It is the first commercially available MOCVD reactor that offers the extremely high process temperatures as needed for the production of DUV LEDs. The enhanced chamber performance facilitates cost-efficient high volume manufacturing of DUV LEDs as used for water and air purification. The configuration of 19 x 2-inch wafers represents the largest capacity currently available in the market for this high end MOCVD application.

Thursday, July 27, 2017

Memory chip boom - Samsung Q2 operating profit up 73 percent

Samsung Electronics said a memory chip boom that propelled it to record profit in the second quarter is likely to continue in the third, just as revenue is widely expected to benefit from sales of OLED screens to Apple.

The world’s biggest maker of memory chips, smartphones and TVs is set to smash its annual profit record after better-than-forecast performance in its mobile business lifted April-June profit slightly above its early-July guidance, analysts said.

“Looking ahead to the third quarter, the company expects favorable semiconductor conditions to continue,” Samsung said in a statement on Thursday. “Although overall earnings may slightly decline quarter-on-quarter as earnings weaken for the display panel and mobile businesses.”

Source: VentureBeat LINK

Flexible AMOLED capacity to almost double each year until 2020

OLED-Info reports that estimates by IHS that flexible AMOLED production capacity is set to increase from 1.5 million square meters to 20.1 million square meters between 2016 and 2020, which would correspond to a compound annual growth rate of 91%.

Source: OLED-Info (LINK)

The Korean CVD & ALD OEMs stocks are travelling upwards since April 2017 (see below). Surely based on investments by Samsung and SK Hynix for Foundry, DRAM and 3D-NAND but this must also reflect order intake from Korean and Chinese AMOLED 6 Gen lines to some extent.

Recent announcments for Semi orders:

Tes signed 16.75 billion won contract with Samsung Electronics Co Ltd, to provide semiconductor manufacturing system (LINK

Eugene Technology signed a 7.36 billion won contract with SK hynix to provide semiconductor manufacturing equipments (LINK)

Tes signed a 2.8 billion won contract with SK hynix Inc to provide semiconductor manufacturing equipment . (LINK)

Tuesday, July 25, 2017

Micron at Flash Memory Summit 2017

BOISE, Idaho, July 25, 2017 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (NASDAQ:MU) invites you to join industry thought leaders and executives to hear strategic updates from the company on 3D NAND and NVMe technologies at the 2017 Flash Memory Summit, August 8-10, 2017, in Santa Clara, Calif. A premier sponsor, Micron is a global leader delivering solutions for the world's toughest computing and storage challenges.Micron Keynote Address - New Silicon Breakthroughs Help Next Generation Datacenters Meet Key ...

Source: Benzinga  LINK

ASM report strong order intake in ALD for 3D-NAND and Foundry in its 2Q 2017 report

For 2017, the leading ALD equipment manufacturer ASM International expect a clear improvement in the single wafer ALD market and they forecast the single wafer ALD market to reach a size of about USD 1.5 billion by 2020-2021. As a comparasion the ALD market as a whole was estimated to USD 1.4 to 1.5 billion in 2016 (Gartner, VLSI Research, TECHCET), including all segments (e.g. Semi, MEMS, PV, OLED and R&D).

ASM International N.V. (Euronext Amsterdam: ASM) today reports its second quarter 2017 operating results (unaudited) in accordance with IFRS. (LINK)

Investor presentation Q2 2017
  • New orders at €206 million were 1% above the Q1 2017 level and 29% above last year's Q2 level.
  • Net sales for the second quarter 2017 were €202 million, an increase of 40% compared to the previous quarter. Year-on-year net sales increased with 46%.
  • Net earnings of €132 million in the second quarter included a result of €84 million from the 5% sale and dilution of the ASMPT stake.
  • Normalized net earnings for the second quarter 2017 increased by €14 million compared to the first quarter 2017. Operating result increased to €38 million. The financing result included €11 million negative effects from currencies compared to €7 million negative effects in the first quarter. The result from investments decreased with €4 million due to the dilution of our stake in ASMPT. Moreover the ASMPT results in the first quarter included a one-off non-cash gain of €10 million related to the revaluation of the convertible bond.

Commenting on the results, Chuck del Prado, President and Chief Executive Officer of ASM International said: 

"In Q2 we realized sales of €202 million, which was slightly above our guidance and at a historical high quarterly level. The order intake for Q2, at €206 million, came in at the high end of the forecast and was also at the highest level in the company's history. Order intake in ALD was primarily strong from the 3D-NAND and Foundry segments. We also received several Intrepid Epitaxy orders in Q2."

Based on our current assessment, we continue to expect a clear year-on-year improvement in the single wafer ALD market in 2017, with demand in the Logic/Foundry segment remaining healthy and a strong increase in the 3D-NAND segment.

For Q3 we expect a sales level of €170-190 million, on a currency comparable level, while for the second half of 2017 as a whole we expect a sales level higher than in the first half of 2017. After the very strong orders in the past two quarters we expect order intake in Q3 at a still healthy level of €150-170 million, on a currency comparable level.

Monday, July 24, 2017

Apple to setup a 2.5-Gen OLED R&D production line in Taiwan

According to OLED-Info referring to reports from Korea, Apple ordered a 2.5-Gen OLED evaporation (CVD) equipment from Sunic System in order to build an OLED pilot line in Taiwan. The report suggests that Apple wants to develop in-house OLED technologies which will allow it to reduce its reliance on Samsung Display.

Norwegian CrayoNano Selects Veeco MOCVD System for Nanowire on Graphene Development

PLAINVIEW, NY -- (Marketwired) -- 07/24/17 -- Veeco Instruments Inc. (NASDAQ: VECO) announced today that CrayoNano AS, research leader for ultraviolet short wavelength light emitting diodes (UV-C LEDs), has ordered the Propel® Power Gallium Nitride (GaN) Metal Organic Chemical Vapor Deposition (MOCVD) System. CrayoNano will use the system to grow semiconductor nanowires on graphene for water disinfection, air purification, food processing and life science applications. 
UV-C LEDs are free of harmful mercury compared to typically 20-200 milligrams of mercury found in traditional UV lamps used in these applications. They also require minimal energy to operate and have longer life cycles compared to other purification and disinfection lighting methods. The value of the global market for UV-C LEDs used in sterilization and purification equipment is growing at a CAGR of 56% from US$28 million in 2016 to US$257 million in 2021, according to the 2016~2021 UV LED and IR LED Application Market Report by LEDinside, a division of TrendForce.

Saturday, July 22, 2017

Veeco CNT ships its 500th ALD system

As reported by Solid State Technology: Veeco Instruments (Veeco) recently announced that Veeco CNT—formerly known as Ultratech/Cambridge Nanotech—shipped its 500th Atomic Layer Deposition (ALD) system to the North Carolina State University. The Veeco CNT Fiji G2 ALD system will enable the University to perform research for next-generation electronic devices including wearables and sensors. Veeco announced the overall acquisition of Ultratech on May 26 of this year. Executive technologists from Veeco discussed the evolution of ALD technology with Solid State Technology in an exclusive interview just prior to SEMICON West 2017.

Please find the article and interview by Ed Korczynski here (LINK)

Evolution of Atomic-Layer Deposition (ALD) technology starts with single-wafer thermal chambers, adds plasma energy, and then goes to batch processing for manufacturing. (Source: Veeco CNT, used with permision).

Sunday, July 16, 2017

Oxford Instruments using NPL's non-destructive quality control method to commercialize wafer-scale fabrication of 2D molybdenum disulphide

UK-based Oxford Instruments says that a world-first non-destructive quality control method developed by the UK's National Physical Laboratory (NPL) has enabled it to commercialize wafer-scale fabrication technology for the two-dimensional (2D) semiconducting material molybdenum disulphide (MoS2)...

Source: Semiconductor Today LINK

Veeco Announces Date for 2Q/2017 Financial Results and Conference Call

PLAINVIEW, NY--(Marketwired - July 13, 2017) - Veeco Instruments Inc. (NASDAQ: VECO) plans to release its second quarter 2017 financial results after the market close on Thursday, August 3, 2017. The company will host a conference call to review these results starting at 5:00pm ET that day.
Source: Marketwired LINK

Introducing the FlexAL-2D the ALD Plasma Processing System for 2D Materials

Oxford Instruments’ ALD and 2D technical specialists have teamed up with Eindhoven University of Technology research teams to develop the innovative FlexAL-2D for atomic layer deposition (ALD) of 2D transition metal dichalcogenides for nanodevice applications.

Source: AZoNano LINK

Versum Materials 3Q/2017 Earnings Conference on Tuesday August 1, 2017

( Versum Materials, Inc. (NYSE:VSM), a leading global materials supplier to the semiconductor industry, announced today that it plans to release its third quarter fiscal 2017 financial results on Tuesday August 1, 2017, pre-market open. Management will review the results during a conference call and audio-only...

Source: 4-traders LINK

Thursday, July 13, 2017

ASM International will report operating results for the 2017/2Q Tuesday, July 25, 2017

ASM International N.V. (Euronext Amsterdam: ASM) will report operating results for the 2017 second quarter ended June 30, 2017 at approximately:

18:00 p.m. Continental European Time - Tuesday, July 25, 2017.
12:00 a.m. (noon) US Eastern Time - Tuesday, July 25, 2017.

ASM International will host an investor conference call and webcast on Wednesday, July 26, 2017 at 15:00 Continental European Time (9:00 a.m. - US Eastern Time).

A simultaneous audio webcast and replay will be accessible at

ASM International NV (ASMIY) Investor Presentation - Slideshow

,| ASM International N.V. (ASMIY)
The following slide deck was published by ASM International N.V. in conjunction with a recent investor relations event (SeekingAlpha).

Direct link to pdf-verion at ASM web (LINK)

ASM introduce the Intrepid® ES(TM) 300mm epitaxy tool for logic and memory high-volume production applications

ASM International N.V. (Euronext Amsterdam: ASM) today introduced the Intrepid® ES(TM) 300mm epitaxy (epi) tool for advanced-node CMOS logic and memory high-volume production applications. Intrepid ES introduces innovative closed loop reactor control technology that enables optimal within wafer and wafer-to-wafer process performance, critical for today's advanced transistors and memories. Furthermore, Intrepid ES reduces the cost per wafer significantly for a 7nm epi process compared with prior node processes. The new tool has been qualified for production at a leading-edge foundry customer, and is targeting production applications in other industry segments as well. To date, over 40 reactors have been delivered. 
ASM Epi roadmap as presented at the latest ASMI Analyst and Investor Technology Seminar (

Tuesday, July 11, 2017

IC Deposition Materials Market Forecast of $1.2B by 2021

Precursors for metals and dielectrics in strong demand for finFETs and 3D-NAND

San Diego, CA, July 11, 2017: TECHCET CA—the advisory service firm providing electronic materials information—today announced that specialty chemical precursor market for the deposition of dielectrics and metals in integrated circuit (IC) fabrication is forecasted to increase at ~10% CAGR through the year 2021. TECHCET’s proprietary Wafer Forecast Model (WFM) shows that 3D-NAND devices are expected to grow at a rapid pace from 2016 and become one of the top three market segments by 2020. Logic ICs will continue to evolve, from 3D finFET devices to Gate-All-Around Nano-Wires (GAA-NW), enabled by new critical materials and manufacturing processes as detailed in new reports from TECHCET, “Advanced Insulating Dielectric Precursors,” and "ALD/CVD High-k & Metal Precursors." 

Precursors tracked by TECHCET for ALD/CVD of metal and high-k dielectric films on IC wafers include sources of aluminum, cobalt, hafnium, tantalum, titanium, tungsten, and zirconium. The total market for 2017 is now estimated to be US$435M, growing to US$638M in 2021. The top-2 suppliers are estimated to hold more than half of the total available market, with many players competing to supply the next enabling molecule. In particular, cobalt precursor demand is forecasted to reach >$80M in 2021 as foundries transition to below 14nm-node processing. As a potential conflict mineral, TECHCET tracks the sub-suppliers of cobalt.

“Metal precursors have had double-digit growth over an extended period of time, and we expect that to continue as the IC industry transitions to 10nm- and 7nm-node logic and 3D-NAND fabrication, with an average long term CAGR of 11% over 2013 to 2021,” says Dr. Jonas Sundqvist, lead author of the report, senior technology analyst with TECHCET and researcher with Fraunhofer IKTS. “Dielectric precursors growth today is clearly driven by dielectric PEALD deposition in multiple patterning, and by dielectric CVD in 3D-NAND.”

Precursors tracked by TECHCET for ALD/CVD/SOD of advanced dielectric films on IC wafers include multiple sources of silicon. The total market for 2017 is now estimated to be just over US$400M, growing to US$560M in 2021. Current growth over 10% is expected to slow slightly to be in the 8-10% range over 2019-2021. Anticipated near-term developments include transitions from CVD to ALD for several IC fab modules.

Global Suppliers of Critical Materials covered in this report include:

Air Liquide,
Dow Corning,
H.C. Starck,
Merck EMD,
Nanmat Technology,
Norquay Technology,
Nanogen Solutions,
TCI Chemicals,
Tri-Chemical Laboratories,
UP Chemical,
Versum Materials,
Wonik Materials.

Purchase Reports Here:

ABOUT TECHCET: TECHCET CA LLC is an advisory service firm focused on process materials supply-chains, electronic materials technology, and materials market analysis for the semiconductor, display, solar/PV, and LED industries. Since 2000, the company has been responsible for producing the SEMATECH Critical Material Reports, covering silicon wafers, semiconductor gases, wet chemicals, CMP consumables, Photoresists, and ALD/CVD Precursors. For additional information about these reports or CMC Fabs membership please contact Diane Scott or Michel Walden at +1-480-332-8336, or go to or +1-480-332-8336, or go to or

Monday, July 3, 2017

Apple A10X using TSMC 10nm FF has been analyzed by Techinsight

According to reverse engineering by Techinsight, the Apple A10X is confirmed to be built on TSMC’s 10 FF process. The die size is a full node shrink as copared to the previous A9X, which was fabed using the TSMC 16nm FF.

As reported by Techinsight, Samsung was however first on using 10nm for their Samsung Galaxy S8.

Source: Techinsight LINK

Sunday, July 2, 2017

China DRAM startup to enter 19nm chip production in February 2018

DIGITIMES reports that China DRAM startup to enter 19nm chip production in February 2018.

Hefei Rui-Li (transliterated from Chinese) Integrated Circuit will start making DRAM chips using 19nm process technology around the end of February 2018, according to industry sources.

Formerly named Hefei Chang Xin, Rui-Li IC will start installing equipment at its new 12-inch fab at the end of 2017 which is ahead of schedule, said the sources. Rui-Li has started negotiating with silicon wafer providers to ensure a sufficient supply.


Toshiba Memory Corporation Announces 96-Layer 3D Flash Memory

TOKYO-Toshiba Memory Corporation, the world leader in memory solutions, today announced that it has developed a prototype sample of 96-layer BiCS FLASH™ three-dimensional (3D) flash memory with a stacked structure*1, with 3-bit-per-cell (triple-level cell, TLC) technology. Samples of the new 96-layer product, which is a 256 gigabit (32 gigabytes) device, are scheduled for release in the second half of 2017 and mass production is targeted for 2018. The new device meets market demands and performance specifications for applications that include enterprise and consumer SSD, smartphones, tablets and memory cards.
Source: Toshiba LINK

Wednesday, June 28, 2017

German Cartel Office sides with ASML

ASML has obtained all necessary regulatory approvals to complete the acquisition of a 24.9 percent minority stake in Carl Zeiss SMT.

Source: Evertiq LINK

Entegris Increases Manufacturing Capacity For High-Performance Materials

BILLERICA, Mass., June 28, 2017 /PRNewswire/ -- Entegris, Inc. (NASDAQ: ENTG), a leader in specialty chemicals and advanced materials solutions for the microelectronics and other industries, announced today that Poco Graphite, a wholly-owned subsidiary of Entegris, Inc., is expanding its capacity to produce graphite material and specialty coatings for semiconductor and high-performance industrial applications by securing the use of the former small diameter graphite electrode factory of Superior Graphite Co. in Russellville, Arkansas. As part of the agreement, Poco Graphite will have access to the assets of the facility, as well as the current workforce.

Monday, June 26, 2017

Umicore inaugurates new production facility in Germany

Umicore reports: Umicore’s business unit Precious Metals Chemistry inaugurated today its innovative production unit for advanced metal organic precursor technologies used in the semiconductor and LED markets, respectively TMGa (Trimethylgallium) and TEGa (Triethylgallium). The event was attended by European and overseas customers as well as local and regional politicians. The guest of honour was Dr. Barbara Hendricks, Germanys Federal Minister for the Environment, Nature Conservation, Building and Nuclear Safety.
Umicore TMGa (Trimethylgallium) and TEGa (Triethylgallium) facility in Hanau, Germany (photos supplied by Umicore).
Umicore’s TMGa manufacturing process is innovative and unique. It offers a more sustainable and ecological production method by minimizing hazardous side streams and material losses and optimizing yield to nearly 100%. This makes it superior to all existing manufacturing methods in the industry.

Umicore TMGa (Trimethylgallium) and TEGa (Triethylgallium) facility in Hanau, Germany (photos supplied by Umicore).
Dr Lothar Mussmann, Vice-President of Umicore Precious Metals Chemistry said “I am proud that this patented innovation has now become a world-class and industrial scale manufacturing plant. It will provide benefits for our customers and the environment and underlines Umicore’s position as a pioneer in sustainable technologies.”
Umicore TMGa (Trimethylgallium) and TEGa (Triethylgallium) facility in Hanau, Germany (photos supplied by Umicore). 

Umicore Precious Metals Chemistry is the only European manufacturer of TMGa and TEGa and supplies customers across the world from its Hanau manufacturing base. Umicore Precious Metals Chemistry helps to reduce cost of ownership through its innovative approach to process chemistry and its collaborative approach with customers and end users.

Sunday, June 25, 2017

TECHCET Advanced Dielectric Precursors CMR™ – Just Released!

The Dielectric Precursors Critical Materials Report (CMR) provide detailed market, supply chain and technology trend information required for anyone developing strategy for their business, be it a materials supplier or semiconductor chip manufacturer. Precursor types include, gapfill, ILD, low K, and multi-patterning. The report is written by Jonas Sundqvist and edited by Ed Korczynski.

Full table of contents : LINK

TECHCET Reports can be Included with CMC Membership – Click Here for Info!


Thursday, June 22, 2017

Yole Développment is releaseing the Emerging Non-Volatile Memory 2017 June 28

Yole Développment: The key emerging non-volatile technologies like phase-change memory (PCM), magnetoresistive random access memory (MRAM) and resistive random access memory (RRAM) have long development histories. Yet, their adoption remains restricted to niche markets due to various factors. Available products have limited density, and the introduction of high density products by emerging NVM pioneers has been delayed. There are manufacturing challenges due to the introduction of new materials and process steps. Meanwhile, mainstream memory technologies are continuously improving in terms of density and cost. Finally, there has been an absence of a killer application that would challenge dynamic random access memory (DRAM) and NAND flash memory. [read further, LINK] - Thanks to Terry Francis for sharing this one!

 Time to market for differen memory technologies  (Yole Développment, LINK)

Wednesday, June 21, 2017

ASML in Chinese training initiative for semiconductor growth

ASML, one of the worlds largest equipment suppliers to computer chipmakers, will team up with a public Chinese research consortium to open an education centre in Shanghai, it said on Wednesday.ASML and the Shanghai Integrated Circuit Research and Development Center plan to equip an existing clean room in Shanghai with ASML equipment to train a larger workforce capable of servicing ASMLs lithography systems in existing and new fabrication plants.Shanghai is centrally located for Chinas chip industry. The move is in line with Chinese ambitions to expand semiconductor manufacturing capacity significantly under its current five-year economic development plan.

Source: Reuters LINK

Tuesday, June 20, 2017

SK Hynix's Consortium as Preferred Bidder for Toshiba chip business

SEOUL, June 21 (Korea Bizwire) - A global consortium including South Korea's SK hyinx Inc. was tapped as the preferred bidder for the sale of the memory arm of Japanese tech giant Toshiba Corp., industry sources said Wednesday. Toshiba earlier put its stake in its memory operations up for sale as it struggles with losses from its nuclear power business in the United States. The consortium, also including Japanese players and U.S. Bain Capital, [...]The post Toshiba Taps SK Hynix's Consortium as Preferred Bi...

Source: The Korea Bizwire LINK

Beneq in 2016 - A Successful Strategic Transformation

Beneq’s financial figures from 2016 show growth, encouraging signs of transformation, and positive development in industrial ALD solutions. Beneq corporation turnover grew to 22,2 million euros in 2016. And Beneq is a truly global company: 98% of the company turnover came from outside Finland.
The year 2016 was a transformation year for Beneq in many ways. In Thin Film Solutions, there was a shift from traditional ALD research equipment towards large-scale industrial ALD equipment and thin film services – a trend which has continued during 2017. The equipment business order flow in the first quarter of 2017 was 70% higher than during Q1/2016 with several new industrial ALD customers and repeat orders from customers who are expanding ALD-based industrial production.
For the Thin Film Solutions business unit, major development areas are industrial ALD equipment and continuous large-area ALD processes based on Beneq’s pioneering Spatial ALD technology, which allows fast low-cost processing of materials in industries that require extremely precise coatings and high capacity, such as OLED and flexible electronics markets.

Monday, June 19, 2017

BASF boosts precious metals recycling capabilities

Company completes installation of equipment at Seneca, South Carolina, plant.

ISELIN, NJ, June 1, 2017 – BASF has completed the installation and start-up of new high-performance equipment at its Seneca, South Carolina operation, which will more than double the precious metals milling and sampling production capacity there.

The Seneca site serves as BASF’s global production hub for the recycling of end-of-life automotive and chemical catalysts, allowing for the efficient recovery and recycling of platinum group metals (PGMs.)

An operator at the Seneca, South Carolina, site recycles precious metals from a scrapped catalytic convertor. The site serves as BASF’s global production hub for the recycling of end-of-life automotive and chemical catalysts, allowing for the efficient recovery and recycling of the precious metals contained inside. This creates a sustainable secondary supply source for such limited global resources. (Credit: BASF press photo)

TECHCET ALD/CVD High-k & Metal Precursors CMR™ – Just Released!

The TECHCET ALD/CVD High-k & Metal Precursors Critical Materials Report provides information on the applications, IP-filing and markets associated with front end and back end of line precursors used to produce high-k dielectrics, metals, meatl oxides and nitrides by atomic layer deposition (ALD) and chemical vapor depsotion (CVD) metal oxides and nitrides. The report is written by Jonas Sundqvist and edited by Lita Shon-Roy.

Full table of contents : LINK

TECHCET Reports can be Included with CMC Membership – Click Here for Info!


Saturday, June 17, 2017

Nanya sells partial stake in Micron

Taiwan-based DRAM chipmaker Nanya Technology has announced the sale of part of its stake in US-based Micron Technology, with an aim to increase the company's working capital and repay loans.


Friday, June 16, 2017

Samsung Display seeks final approval for its $7 billion A4 flexible OLED fab

Samsung Display seeks final approval for its $7 billion A4 flexible OLED fab, which will start making flexible OLEDs in 2019

Source: OLED-Info LINK

Thursday, June 15, 2017

Applied Materials will be presenting processing for flexible electronics at 2017FLEX

Applied Materials speakers to highlight technologies moving flexible electronics from a vision to a reality at 2017FLEX.

On Tuesday, June 20 at 8:00 am PDT, Dr. Brian Shieh, VP and GM of Applied’s Display and Flexible Technology group will deliver a keynote talk on technology inflections in the display industry. In keeping with the conference theme, “Flexible Electronics – Accelerating to Manufacturing,” Brian will focus on the process technologies that are critical to moving flexible displays from a vision to a reality.

On Tuesday afternoon at 2:15 pm PDT, Mani Thothadri, senior director of New Business and Strategic Initiatives in the Display and Flexible Technology group will discuss R2R processing inflections for the display and IoT industries. Mani will explore how creating flexible form factors for next-generation consumer electronic devices requires the use of polymeric films. Most of these polymeric materials are manufactured in the form of a roll, resulting in the increased utilization of R2R processing. He will also discuss how Applied is developing R2R technologies for next-generation, large-area flexible electronics applications.
Source: Applied Materials Blog LINK

More information can be found in this flyer from Applied Materials Flexible Electronics Brochure(5.0MB)

 Applied Materials Web Product Portfolio (Source: Applied Materials)

Wednesday, June 14, 2017

Robert Bosch to invest 1 billion euros in Dresden semiconductor plant

FRANKFURT (Reuters) - Robert Bosch, is investing 1 billion euros ($1.12 billion) in a semiconductor plant in Germany, a company source told Reuters, highlighting the world's largest car parts supplier's ambitions in self-drive cars and the industrial Internet.

Source: Reuters LINK

Picture Credit : Bosch

Bosch plans €1 billion investment in German chip production hours ago
Bosch plans €1 billion investment in German chip production ... to make a record investment into a semiconductor plant in Dresden, Germany.

Bosch to build new semiconductor fab in Dresden

eeNews Europe-14 hours ago
The news was spread by a Dresden local newspaper. Bosch so far did not issue a press release, and the company's press office was closed for ...

Bosch Goes Big on German Chip Production

Handelsblatt Global Edition (subscription)-14 Jun 2017
The world's largest car-parts maker is set to invest a record sum into a semi-conductor plant in Dresden, German media reports. The move ...

SK Hynix joins last-minute bid for Toshiba

TOKYO/SEOUL (Reuters) - South Korea's SK Hynix Inc has joined a last-minute bid for Toshiba Corp's semiconductor business, countering a $20 billion offer from U.S. chipmaker Broadcom Ltd , people familiar with the matter said on Wednesday.
Source: Reuters LINK

Tuesday, June 13, 2017

GLOBALFOUNDRIES on Track to Deliver Leading-Performance 7nm FinFET Technology

Santa Clara, Calif., June 13, 2017 – GLOBALFOUNDRIES today announced the availability of its 7nm Leading-Performance (7LP) FinFET semiconductor technology, delivering a 40 percent generational performance boost to meet the needs of applications such as premium mobile processors, cloud servers and networking infrastructure. Design kits are available now, and the first customer products based on 7LP are expected to launch in the first half of 2018, with volume production ramping in the second half of 2018.

Globalfoundries Fab8 in NY, USA
In September 2016, GF announced plans to develop its own 7nm FinFET technology leveraging the company’s unmatched heritage of manufacturing high-performance chips. Thanks to additional improvements at both the transistor and process levels, the 7LP technology is exceeding initial performance targets and expected to deliver greater than 40 percent more processing power and twice the area scaling than the previous 14nm FinFET technology. The technology is now ready for customer designs at the company’s leading-edge Fab 8 facility in Saratoga County, N.Y.

Semi reports a historic highs in fab spending for 2017 and 2018

Semi reports a historic highs in fab spending for 2017 and 2018 equipment spending alone: US$49 billion in 2017 and $54 billion in 2018.

Source: Semi LINK

Learn more about the SEMI fab databases at:

Linde and Praxair confirm merger

Gas companies Linde AG and Praxair Inc have confirmed that the companies will come together under a new holding company through an all-stock merger of equals transaction. Linde and Praxair expect the transaction to close in the second half of 2018, subject to customary closing conditions.The companies say that the value of the merger is driven by approximately US$1.2 billion  in annual synergies and cost reductions with combined pro forma revenues of approximately US$29 billion (?27 billion) i...

Source: Materials Today LINK

BB&T Securities LLC Has $430,000 Position in Versum Materials Inc.

BB&T Securities LLC decreased its position in shares of Versum Materials Inc. (NYSE:VSM) by 43.5% during the first quarter, according to its most recent 13F filing with the Securities and Exchange Commission. The firm owned 14,055 shares of the basic materials company's stock after selling 10,802 shares during the period. BB&T Securities LLC's holdings in [...]

Source: Zolmax News LINK

Qualcomm reportedly dropped Samsung to work with TSMC on new 7nm Snapdragon platform

Qualcomm reportedly dropped Samsung to work with TSMC on new 7nm Snapdragon platform. Qualcomm's breakup with the Korean electronics giant marks the second major partner loss for Samsung in the past few months.

Source: Malaysia HardwareZone LINK

Monday, June 12, 2017

Atomic Layer Deposition Market Set to Cross USD 5 Billion by 2022 at a CAGR of 31.27%

According to the new report, “Atomic Layer Deposition Market - By Type (Equipment & Materials); By Application (Gate Dielectrics, Gate Electrodes, Metal Interconnects, Diffusion Barriers, Memory Chips, Multilayer Capacitors, OLED Layers, Solar Cells, Fuel Cells, MEMS and Others); By Geography – Forecast (2016-2022)”, published by IndustryARC, the atomic layer deposition market to cross USD 5 Billion by 2022 at a high CAGR.

Atomic Layer Deposition in increasingly being used in manufacturing of electronic products where thickness of the film is absolutely imperative such as; smart phones, printers, data storage devices, displays, different types of small electronic components and many others products. It is mainly responsible for semiconductor fabrication and nanomaterial synthesis. Growing application of thin film coatings is the major driving factor for atomic layer deposition market. Through atomic layer deposition, ultra-thin films can be created in a sequential and self-limiting way depending on the material or product, which needs the layer to be applied on. Atomic layer Deposition process is especially favored because of its ability to control the film thickness in nanometer thickness regime. Atomic layer deposition is a perfect deposition method for applications where the surface area of the base material is very small.

According to a recent study from IndustryARC the global market value of atomic layer deposition was $910 million in 2015. Atomic layer deposition instruments are expensive as compared to conventional techniques such as MOCVD and PVD, consequently the equipment used for atomic layer deposition accounted for more than 60% of the global market revenue share.

Inquiry before Buying Report @

Thursday, June 8, 2017

TSMC orders equipment for >USD100 million

DIGITIMES Reports that TSMC (June 5, 2017) disclosed a total of about NT$3.09 billion (US$102.8 million) spent on machinery equipment from ASML, NuFlare Technology and Applied Materials. In two separate purchases of machinery equipment since June for a total of NT$1.12 billion from Lam Research International and Tokyo Electron.

Previously in May, according to DIGITIMES, TSMC purchased equipment and facilities for a total of about NT$11.3 billion including NT$2.23 billion worth of equipment for TSMC (Nanjing) from Advanced Ion Beam Technology, Applied Materials, ASML, Daifuku, Delta Electronics, Murata Machinery, Renchong Interior Decoration (Shanghai), Screen Semiconductor Solutions, Tokyo Electron and TEL FSI.


Tuesday, June 6, 2017

SEMI reports record Q1/2017 spending for Semiconductor Equipment in Korea, Japan and China

Today SEMI reported that worldwide semiconductor manufacturing equipment billings reached US$13.1 billion for the first quarter of 2017. That is a very strong quarter with the month of March reaching an all time monthly record at $5.6 billion. Not since 2000 the quarterly billing has been this high. Most interestingly, South Korea has replaced Taiwan as the largest semiconductor equipment market.

Three markets are showing exceptional growth and that is South Korea (Samsung & SK Hynix), China and Japan (Toshiba & Micron), which must be related to investments in 3D-NAND and DRAM Fab equipment. This is in line with the statement made by VLSI Research at the recent CMC2017 conference in Dallas, saying that they are updating their equipment forecast for 2017 based on increased spending in Memory and especially DRAM this year.

For memory ALD process has been a crucial tool in HVM since 2004 when Samsung started production of 90 nm DRAM with an ALD HfO2/Al2O3 dual stack and since then many, many more ALD process passes has been added to both DRAM and 3D-NAND, for instance in multiple patterning and Tungsten ALD for 3D-NAND gates and Al2O3 blocking oxide in those deep trenches. That is why we can assume that the ALD OEMs should all show record revenue for their ALD business units in 2017. Obviously also PECVD and Etch will benefit from this spending.

Please find the SEMI press release here : LINK

Monday, June 5, 2017

TSMC to sttart production of embedded MRAM and RRAM memory

TSMC will enter into production of embedded versions of the next generation memory technologies according to DIGITIMES (LINK)

TSMC plans to enter risk production of its eMRAM (embedded Magnetoresistive Random Access Memory) chips in 2018 and eRRAM (embedded Resistive RAM) products in 2019 using a 22 nm production node, said the report, citing TSMC CTO Jack Sun.

Embedded memory (DRAM, MRAM, RRAM FRAM) is typically integrated in the vias of the Cu interconnects in a BEOL process. There are opportunities also in the FEOL like the IBM embedded deep trench capacitors used for a long time in gaming consoles or the recent development in ferroelectric non-volatile FETs by Globalfoundries & Co. (FeFETs).

MRAM does not mean a huge opportunity for ALD other than possibly a diffusion barrier of some sort. However, the RRAM cel is very similar to a MIM capacitor used for DRAM and one can expect the use of high-k dielectrics (HfO2, Ta2O5 etc.) as well as metal and metal nitrides (e.g. TiN).

Sk Hynix is developing 96- and 128-Layer 3D NAND

3D-NAND Flash is scaling vertically since some time and there has been a recent cross over in production from "normal" 2D-NAND to 3D-NAND in terms of >50% of all wafer starts now is for the 3D-version. This has boosted sales in CVD, ALD and Etch 300 mm wafer processing equipment.

Now the media reports are busy covering the saving of the Japanese chip giant Toshiba. However meanwhile SK Hynix has announced production of a 72 layer 3D-NAND and now most recently SK Hynix reports that it has 96 and 128 layers coming after, with up to 1Tbit die capacity.

Source: Tom's Hardware LINK

Sunday, June 4, 2017

IBM, Samsung and Globalfoundries shows off first 5nm GAAFET technology with EUV

IBM together with Samsung and Globalfoundries shows off the world´s first 5 nm logic chip with horizontal Gate All Around Field Effect Transistors also referred to as GAAFETs. GAAFETs are a evolutionary development out of FInFETS that were fisrt introduced at 22 nm by Intel. It is predicted that 7nm will be the last FinFET node and that GAAFETs has to be introduced by then.

Source: IBM LINK

 TEM cross section of 5nm GAAFETs by IBM, Samsung and Globalfoundries (Source IBM)

The GAAFETs are manufactued by deposition stacks of epitaxial silicon and silicon germanium (Si/SiGe Epi). Then by using a combination of EUV lithography and reportedly (LINK) Atomic Layer Etching (ALE) trenches are etched to separate the stack into fins and then afterwards to individual nanowires (or nano sheets as IBM calls them) of Si resp SiGe forming the channels stacked on top of each other. Later the high-k / metal gate (HKMG) stack is deposited in by a sequence of ALD processes conformally covering the nanowire channels.

In the nano sheet FETs, the wires are much wider and thicker presumably giving the nano sheet FETs better electrostatics and drive current

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