Monday, May 20, 2019

TSMC obtains orders for 5G modem from fabless companies

TSMC has grabbed orders for all the 5G modem chips that have been introduced by fabless chipmakers, such as Qualcomm's Snapdragon X50 and HiSilicon's Balong series. TSMC has kicked off volume production for 5G modem chips for Qualcomm and HiSilicon and is gearing up for production for MediaTek's Helio M70 5G modem in the second half of 2019. All their first 5G modem solutions will be built using TSMC's 7nm process technology. Samsung Electronics announced recently that its 5G communication solutions are in mass production for the latest premium mobile devices. Those include Samsung's first 5G modem solution, the Exynos Modem 5100, which uses Samsung's 10nm LPP process.

Source: Digi Times LINK 

By Abhishekkumar Thakur

Thursday, May 16, 2019

Highlights of Samsung Foundry Forum 2019, Santa Clara, California, USA

3nm Gate-All-Around (GAA) process, 3GAE, development is on track. Process Design Kit (PDK) version 0.1 for 3GAE has been released in April to help customers get an early start on the design work and enable improved design competitiveness along with reduced turnaround time (TAT).

Compared to 7nm technology, Samsung’s 3GAE process is designed to provide up to a 45 percent reduction in chip area with 50 percent lower power consumption or 35 percent higher performance.

Samsung Electronics launched the Samsung Advanced Foundry Ecosystem Cloud (SAFE™-Cloud) program. It will provide customers with a more flexible design environment through collaboration with major public cloud service providers, such as Amazon Web Services (AWS) and Microsoft Azure, as well as leading Electronic Design Automation (EDA) companies, including Cadence and Synopsys.

Samsung’s roadmap includes four FinFET-based processes from 7nm down to 4nm that leverage extreme ultraviolet (EUV) technology as well as 3nm GAA, or MBCFET™. In the 2H of this year, Samsung is scheduled to start the mass production of 6nm process devices and complete the development of 4nm process. The product design of Samsung’s 5nm FinFET process, which was developed in April, is expected to be completed in the 2H of this year and go under mass production in the 1H of 2020.

While FinFET structures must modulate the number of fins in a discrete way, MBCFET™ provides greater design flexibility by controlling the nanosheet width. In addition, MBCFET™’s compatibility with FinFET processes means the two can share the same manufacturing technology and equipment, which accelerates process development and production ramp-up. (
Development of the successor to the 28FDS process, 18FDS, and eMRAM with 1Gb capacity will be finished this year.

Source: Samsung (LINK)

By Abishekkumar Thakur and Jonas Sundqvist

Wednesday, May 15, 2019

TSMC board approves nearly US$4 billion for advanced-node manufacturing

The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of US$3.98 billion for the purpose of upgrading and expanding capacity for advanced-node manufacturing, as well as the conversion of certain logic capacity to specialty technologies, and R&D capital investments and sustaining capital expenditures for third-quarter 2019.

Sunday, May 12, 2019

TSMC begins production of 5 nanometre chips

The Taiwan Semiconductor Manufacturing Company, or TSMC, has begun risk production of 5 nanometre (nm) chipsets that would be featured in future super-efficient flagship smartphones and expects to be ready to start mass production in the first half of 2020. The mass production of the new standard is scheduled for 2020 if everything goes as planned. This process will introduce chips that will have up to 45 percent area reduction, also bringing a performance gain up to 15 percent compared to the current 7 nm chipsets. For chipsets coming out later this year, TSMC has the 7 nm+ process ready. It should offer a 6-12% reduction in power consumption and a 20 percent higher transistor density compared to the current 7 nm process.
Source: LiveMint (LINK)
By Abhishekkumar Thakur

Intermolecular to be acquired by Merck KGaA Darmstadt

SAN JOSE, Calif., May 6, 2019 (PRNewswire) has signed a definitive agreement pursuant to which a wholly owned subsidiary of Merck KGaA, Darmstadt, Germany, a leading science and technology company, will acquire Intermolecular for $1.20 per share in an all cash transaction, representing an equity value of Intermolecular of approximately $62 million. The acquisition has been unanimously approved by Intermolecular's Board of Directors and the Executive Board of Merck KGaA, Darmstadt, Germany.
"We are pleased to become an integral part of Merck KGaA, Darmstadt, Germany's leading electronic materials business and look forward to all of the new and exciting opportunities we see for our customers and employees. We believe our technology expertise is very complementary and creates a unique offering that will continue to shape the innovations of tomorrow," said Chris Kramer, President and Chief Executive Officer of Intermolecular.

"Intermolecular's unique capabilities in rapid material screening, in combination with the R&D pipeline of Merck KGaA, Darmstadt, Germany, will allow us to offer our customers faster materials innovation, through parallel composition experiment and full performance testing and characterization," said Kai Beckmann, member of the Merck KGaA, Darmstadt, Germany, Executive Board and CEO of Performance Materials. "We are excited to join forces with Intermolecular and bring significant advantages to our customers compared to conventional materials R&D."

The transaction is expected to close in the second half of 2019, subject to the approval of Intermolecular's stockholders, clearance by the Committee on Foreign Investment in the United States (CFIUS) and the satisfaction of other customary closing conditions.

Merck KGaA, Darmstadt, Germany, will acquire Intermolecular through its wholly owned subsidiary EMD Group Holding II, Inc.

As a result of this transaction, Intermolecular will not be holding its previously scheduled conference call on May 14, 2019.

Saturday, May 11, 2019

2019 Investor Meeting: 7 nm Product in 2021

Intel held its 2019 investor meeting May 8, 2019 (LINK), it's first since 2017, and CEO Bob Swan announced that Intel would launch its 7 nm process in 2021 to challenge TSMC's 5 nm products.

Intel's Xe graphics will be the leading 7 nm product, which will come on the heels of Intel's first discrete 10 nm GPU that arrives in 2020. The company also unveiled its first block diagram of the Ice Lake architecture and announced that its new 10nm Tiger Lake processors will come to market in 2020.
Source: Tom´s Hardware LINK


By Abhishekkumar Thakur

Tuesday, May 7, 2019

Demand for ALD equipment and Lumineq displays grows at Beneq

Beneq invests in R&D and production at the Home of ALD

Beneq®, a leading supplier of Atomic Layer Deposition (ALD) equipment and coating services, and the world’s premier manufacturer of thin film electroluminescent displays, has introduced a new investment plan to support growth in new industrial ALD solutions and the transparent display business. 

Following the agreement about the acquisition of Beneq Oy in September 2018, it was announced today that the new owners of Beneq have approved an investment program that allows Beneq to grow faster in its strategic focus areas, such as ALD solutions for the emerging semiconductor applications and transparent vehicle displays. 
Together with the new owners’ earlier investments in 2018 to improve Beneq’s equity ratio and working capital, the announced development programs result in a total investment of over 20 million euros. 

“When we invested in Beneq, we invested in people, technology know-how and innovation. The new growth plan will help us to realize the potential and achieve the ambitious growth targets we have set for Beneq,” commented Kong Jun, Chairman of Beneq.

New high-volume ALD manufacturing solutions for More-than-Moore applications

For the Atomic Layer Deposition business unit, the new growth program means major investments in new ALD solutions for the emerging semiconductor ALD business applications in the area of the so called More-than-Moore applications, such as MEMS, image sensors, power semiconductors and RF components needed for the future 5G and IoT solutions.

“Emerging semiconductor ALD and the diversified More-than-Moore applications are an extremely promising growth area for us. We have already had success in these areas with our latest flexible ALD cluster tools for high volume manufacturing. The new investment plan will allow us to fast-track our product development and services in these markets,” said Tommi Vainio, Vice President, Atomic Layer Deposition of Beneq.

Transparent displays for the automotive and transportation industries

For Lumineq Displays, the display business unit of Beneq, the investment plan allows both acceleration of product development in the area of transparent and in-glass displays, and improvements in Beneq’s display factory in Espoo, Finland.

“We have seen great interest in our transparent in-glass displays, especially in the transportation and automotive industries. The window-like transparency of Lumineq displays has helped our customers to build vehicles with improved safety and user experience and will serve as an important differentiation factor in their products,” said Petri Schroderus, Vice President, Lumineq Displays.

A recruitment campaign to support future growth

To enable future growth, Beneq has a continuous program to attract new talent. With the investment plan now approved, the company will start the next large recruitment campaign for building the talent pool. Most of the new positions will be in Espoo, Finland, but the plan also includes recruitment for Beneq’s international teams.

Monday, May 6, 2019

Applied Materials - The AI Era is Driving Innovations in Memory

[Applied Materials Blog] Industries from transportation and healthcare to retail and entertainment will be transformed by the Internet of Things, Big Data and Artificial Intelligence (AI), which Applied Materials collectively calls the AI Era of Computing.

The previous computing eras—Mainframe/Minicomputer, PC/Server and Smartphone/Tablet—all benefitted from advances in Moore’s Law whereby 2D scaling was accompanied by simultaneous improvements in performance, power and area/cost—also called “PPAC.”

While AI Era applications are booming, Moore’s Law is slowing; as a result, the industry needs breakthroughs beyond 2D scaling to drive PPAC in new ways. Specifically, we need new computing architectures, new materials, new structures—especially area-saving 3D structures—and advanced packaging for die stacking and heterogeneous designs.

The AI Era is Driving a Renaissance in Semiconductor Innovation (Applied Materials Blog)
AI Era architectural changes are influencing both logic and memory. Machine learning algorithms make heavy use of matrix multiplication operations that are cumbersome in general-purpose logic, and this is driving a move to accelerators and their memories. AI compute includes two distinct memory tasks: first, storing the intermediate results of calculations; and second, storing the weights associated with trained models.

Performance and power are important in the cloud and in the edge, and innovations in memory can help. One approach using existing memory technologies is “near memories” whereby large amounts of working memory are condensed, placed in close physical proximity to logic, and connected via high-speed interfaces. As examples, 3D stacking and through-silicon vias are gaining traction. One major drawback of SRAM and DRAM as “working memories” in these applications is that they are volatile and need a constant supply of power to retain data—such as weights.

To reduce power in the cloud and edge, designers are evaluating new memories that combine high performance with non-volatility so that power is only needed during active read and write operations. Three of the leading new memory candidates are magnetic random-access memory (MRAM), phase-change RAM (PCRAM) and resistive RAM (ReRAM). 

Full article: Applied Materials Blog LINK
Additional read: Manufacturing Requirements of New Memories LINK

Air Liquide and STMicroelectronics to collaborate on digital transformation

Paris and Geneva, May 6 2019 - Air Liquide and STMicroelectronics intend to engage in a collaborative initiative to accelerate the development of digital solutions for industrial applications. Through this initiative, ST anticipates supporting Air Liquide in its digital transformation, providing guidance and solutions while Air Liquide anticipates working with ST in developing technologies and solutions for industrial applications. This cooperation will extend the long-standing business relationship established over the past decades between both companies. 
By Getfunky - Flickr: Paris, CC BY 2.0,

The parties anticipate collaborating to identify cases where ST's technologies would best fit industrial and logistics needs, and then prototype the selected digital solutions and test them in Air Liquide's operating environments. By creating a fertile ground of exchange among experts and adopting a collaborative approach, Air Liquide and ST intend to accelerate digital innovation of industrial use-cases. The parties have already identified a selection of projects and ideas in domains such as asset tracking and management, predictive maintenance and the cybersecurity of industrial assets.

This cooperation will extend the trusted and long-standing business relationship established over the past decades between Air Liquide and ST. Air Liquide supplies gas, materials and equipment to ST's manufacturing sites located in France, Italy, Malta, Morocco, the Philippines and Singapore.

Joël Hartmann, Executive Vice President for Digital & Smart Power Technology and Digital Front-End Manufacturing of STMicroelectronics, said: "Building on the strong and mutually beneficial relationship established over many years, ST and Air Liquide are moving to further enrich this expedition. Our goal is to support the digital transformation of Air Liquide, one of our major and strategic suppliers, by providing state of the art solutions leveraging our products and technologies portfolio to successfully accelerate their program in this domain."

Guy Salzgeber, Executive Vice-President and member of the Air Liquide group's Executive Committee supervising industrial activities in Europe, said: "We are confident that this additional cooperation with ST, a long-time strategic customer of the Group, will enable a further acceleration of our digital transformation while helping ST in better addressing the technological needs in the field of Industrial Internet of Things. This initiative is a further illustration of our open-innovation strategy partnering with customers, academics, suppliers and start-ups."

TSMC 5nm will improve logic density by 1.8X over 7nm

[Hexus] In the wake of the recently published Q1 2019 results, TSMC's Vice Chairman & CEO C. C. Wei provided information about TSMC's progress, in an earnings call. TSMC is ploughing on with its 6nm and 5nm plans. TSMC refers to its 7nm process as N7, and 6nm and 5nm processes as N6 and N5, respectively.
N5 will be a large and long-lasting node at TSMC concluded:
  • customers would need some time to get up to speed for N5, while moving from N7 to N6 requires only "a very minimal effort".
  • TSMC 5nm will improve logic density by 1.8X over 7nm
"Our N5 technology development is well on track. N5 has entered risk production in first quarter, and we expect customer tape-outs starting this quarter and volume production ramp in first half of 2020. With 1.8 times logic density and 15% speed gain and an ARM A72 core compared with 7-nanometer, we believe our N5 technology is the most competitive in the industry. With the best density performance, power and the best transistor technology, we expect most of our customers who are using 7-nanometer today will adopt 5-nanometer. With N5, we are expanding our customer product portfolio and increasing our addressable market. Thus, we are confident that 5-nanometer will also be a large and long-lasting node for TSMC." [Seeking Alpha, Transcript LINK]
C. C. Wei – Chief Executive Officer

Source: Hexus Hexus

Future AMD Ryzen CPUs Built on TSMC's 5nm Process Node Can Be Up To 80% More Denser Than 7nm Ryzen 3000

Future AMD Ryzen series processors can feature a major density uplift with TSMC’s 5nm process node compared to upcoming 7nm based Ryzen 3000 series chips. The details of the TSMC 5nm or N5 process node were released last month and give us an insight into what to expect from future generations of Ryzen processors and how they would stack up against the competition versus the Intel lineup.
Source: WCCFtech LINK

Sunday, May 5, 2019

Samsung Electronics to build new foundry in Pyeongtaek

Samsung Electronics recently announced its "Semiconductor Vision 2030". As part of it, they will construct a new foundry in Pyeongtaek, Gyeonggi-do. The present foundry fab, located in Giheung and Hwasung, will expand to Pyeongtaek, which is the world's most extensive semiconductor production base. Until now, Samsung Electronics' Pyeongtaek campus had only a memory production for DRAM and NAND, but with this investment decision, the Pyeongtaek will become a base for foundry logic as well. Currently, Samsung Electronics has a foundry fab that produces system semiconductors in Austin, Texas, USA, and in Giheung, Hwaseong, Gyeonggi-do.

Samsung refers to GAA as a 4-dimensional technology in their marketing pitch. (News 1 Korea)
The "Semiconductor Vision 2030" goal for Samsung Electronics is to become the world's No. 1 semiconductor maker in 2030, and investment in the foundry market will be in full swing to secure economies of scale.

The cost (more than 20 trillion won) to build this new EUV fab equals to building three Incheon airports according to Samsung Electronics and will be ramped with a 3 nm process. Whereas the new Hwasung fab new plant is scheduled to start operation 2020 ramping 7 nm, 5 nm, and 4 nm. As of 5 nm, the transistor architecture will be transferring from current FinFET technology GAA-FETs (Gate-All-Around FETs). 
Source: News1 Korea (LINK)

Tuesday, April 30, 2019

Q1/19 Gross Margin and Earnings exceed Expectations / 2019 Full-year Guidance confirmed

Orders and revenues in line with forecast / Positive exchange rate effects and improved product costs offset expected countervailing margin effects

Herzogenrath/Germany, April 30, 2019 - AIXTRON SE (FSE: AIXA), a leading provider of deposition equipment to the semiconductor industry, today announced its financial results for the first quarter 2019. 
  • Revenues increased to EUR 68.7 million (+10%) compared to previous year
  • Order intake reduced year-on-year to EUR 53.6 million (-32%)
  • Gross profit of EUR 26.7 million stable compared to previous year
  • Operating result (EBIT) up onprevious year to EUR 9.7 million (+23%)
  • Operating expenses down further year-on-year (-10%) 

AIXTRON SE (AIXA.DE) XETRA - XETRA Delayed Price. Currency in EUR (30APR2019,
Business Development

The first quarter of 2019 was mainly influenced by the expected reluctance of customers to invest in the expansion of their production capacities. However, the prospects for our core optoelectronics and power electronics business are intact.

AIXTRON continues to anticipate an increasing demand for lasers in these areas due to increasing applications in 3D sensor technology, security infrastructure or optical data transmission as well as the increasing use of LEDs and special LEDs in display and other applications. In addition, the company expects an increased use of gallium nitride or silicon carbide-based devices for energy-efficient communication and energy management in automobiles, consumer electronics and mobile devices.

In organic electronics, the Group took a further step towards OVPD technology qualification during the first quarter of 2019 with the commissioning of the Gen2 OLED system on a customer pilot production line. In the coming months, the facility is expected to deliver test results that will serve as the customer's decision basis, support the customer's decision-making process, and further advance the development of the technology.

Monday, April 29, 2019

TSMC Will Manufacture 3D Stacked WoW Chips In 2021

TSMC’s Joint-CEO Wei Zhejia Announces Mass Production of 5nm WoW Built Chips In 2021 After Completing World’s Frist 3D IC Package. This shift will allow its customers to ‘stack’ multiple CPUs or GPUs on one another inside a single package – effectively doubling the number of transistors. To achieve this, TSMC will connect the two different die wafers using TSVs (Through Silicon Vias). TSVs are essentially 10-micron holes that facilitate transfer between the two stacked chips. TSMC has developed the technology in a partnership with California based Cadence Design Systems, and the technology is an extension of the company’s InFO (Integrated Fan-out) and CoWoS (Chip-on-Wafer-on-Substrate) 3D chip production techniques.

Source: LINK

by Abhishekkumar Thakur

Sunday, April 28, 2019

Samsung Electronics will maintain its DRAM production volume

Samsung Electronics will maintain its production volume without reducing memory semiconductors such as DRAMs. This is a different strategy than the second and third largest memory semiconductor makers SK Hynix and Micron announced their plans to cut production. According to Samsung Electronics, the semiconductor market is expected to improve from the second half of the year as early as 3Q, and it has been said that it does not cut production for preemptive countermeasures.
  • SK Hynix, the second-ranked maker, also announced that it will reduce its NAND flash wafer input this year by more than 10 percent from its 1Q earnings release. 
  • Micron has announce that it will cut DRAM and NAND flash by 5% each to resolve supply-demand imbalances and inventory problems last month. 
Source: LINK
Samsung Electronics also announced last week that it will invest 133 trillion won in memory and non-memory semiconductors by 2030 (LINK). 
The investment plan is expected to help the company to reach its goal of becoming the world leader in not only memory semiconductors but also logic chips by 2030. The company also plans to create 15,000 jobs in R&D and production to bolster its technological prowess. (Source: Samsung)

Tokyo Electron defend strong position in ALD equipment, down 4% Market share

As reported earlier (LINK), Japanese companies were especially successful in 2018 in capturing a more significant chunk of the semiconductor fab investments in wafer processing equipment. According to the recent Toyko Electron FY2019 report (LINK), they defend their strong position in ALD equipment at around 30%, down somewhat from 31% 2017 to 27% in 2018. It is unclear which companies has gained from TEL and more information will be available at the 7 May 2019 Webcast.

As before, this segment should include all wafer based ALD platforms. However, some companies hide their ALD revenue in the CVD segments so you can not know for sure if you don´t know the data in detail. The segments are:
  • ALD Tube - Large batch furnaces, typically loading 100 or more wafers
  • Single wafer platforms
  • Multi-wafer platforms, spatial or multi-station

Tokyo Electron market shares based on Gartner data (Tokyo Electron based on Gartner 24 April 2019 reporting)

ASM beats first-quarter targets, sees market outperformance in 2019

Dutch semiconductor supplier ASM International on Wednesday reported first-quarter revenue of 249 million euros ($278.5 million) and an order intake of 235 million euros, both exceeding its own expectations.
Source: Reuters LINK
In the 1Q/2019 Investor presentation (LINK) ASMI reports a strong long term growth prospects:
  • ALD market expected to be a key growth market, ASMI has leadership position in ALD
  • Driving structurally higher sales in the other product lines
  • Solid momentum in the first part of 2019 driven by ASMI’s strong position in logic/foundry
ASMI has leading positions in ALD
  • ASMI has strongest position in logic/foundry. 
  • Logic/foundry ALD market more than doubled from 14nm/16nm to 7nm
  • ALD continued to account for more than half of ASM’s equipment revenue in 2018
  • Strong focus on increasing our addressable market within single wafer ALD
Strong market outlook ALD
  • The CAGR of the single wafer ALD segment is expected to be the highest within the deposition equipment market in the next years
Solid growth expected for the ALD market
  • ASMI expect the single wafer ALD market to reach a size of approx. US$1.5 billion by ‘20-’21
  • Focus on expanding their addressable market within the single wafer ALD space
  • ASMI outperformed WFE in 2018 and expects to outperform WFE in 2019
  • Launch of new XP8 QCM tool in January 2019, offering substantial improvement in productivity for advanced applications. The XP8 QCM is already in high-volume manufacturing at multiple customers
More than 50% of ASM´s revenue 2018 came from the top 3 semiconductor equipment spenders, i.e., Samsung, TSMC and Intel.

ATI's tariff exclusion request denied

The U.S. Department of Commerce has denied Pittsburgh-based Allegheny Technologies Inc.’s (NYSE: ATI) Section 232 tariff exclusion request Wednesday, according to a news release.

The Pittsburgh-based manufacturer’s stainless joint venture, which imports semi-finished stainless slab products from Indonesia, applied for the exclusion.

“While we are disappointed that the U.S. Department of Commerce denied the JV’s Section 232 tariff exclusion request, it does not change our strategy of returning ATI’s Flat Rolled Products segment to sustained profitability,” ATI CEO Robert Wetherbee said in a prepared statement. “Although we believe the unique status of the North American stainless steel industry warranted approval of our exclusion, we are committed to meeting our customers’ needs and delivering value to our shareholders.”
Source: The Business Journals LINK

Intel cuts forecast as China data centre sales remain weak

Chipmaker Intel Corp on Thursday cut its full-year revenue forecast and missed analysts' estimates for first-quarter sales for its higher-margin data centre business, sending its shares down as much as 7.5%. 
Source: Reuters LINK

SK Hynix confident of memory chip recovery after quarterly profit drop

SK Hynix Inc said on Thursday it was confident of a recovery in memory chips later this year due to rising demand from data centres, after the South Korean chipmaker posted its smallest quarterly profit in more than two years.
Source: Reuters LINK

Saturday, April 20, 2019

SK Hynix completes expanded DRAM fab in Wuxi China

CET News reports that SK Hynix has completed an expanded fabrication plant (C2F) in Wuxi, China. C2F is an expansion of the existing DRAM production line, C2, in Wuxi. The Company decided to expand its production line in 2016 to solve the shortage of production space due to technology migration.

Source: CET News LINK

Texas Instruments to build 2nd 300 mm analog chip fab for $3.1 billion in Richardson Texas

Dallas News reports that Texas Instruments has chosen Richardson as the site for a $3.1 billion semiconductor facility that's expected to create more than 488 jobs. The 870,000 square-foot plant will be built on W. Renner Road, between Custer Parkway and Alma Road. It will boost Texas Instruments' chip production for a broad range of uses, such as smartphones, connected cars, and industrial machinery. The company is already the biggest maker of analog semiconductors. Texas Instruments plans to produce its more cost-effective 300-millimeter wafers at the facility. Each wafer is cut into numerous analog chips. The 300-millimeter wafers can yield twice as many chips as the company's 200-millimeter product.

Source: Dallas News LINK

 Announcement on

Tuesday, April 16, 2019

Applied Materials' Business Halt Has Limited Impact on Sanan Optoelectronics, Says Sanan

After China's biggest LED chip manufacturer Sanan Optoelectronics was named in the US red-flag list of "unverified" entities last week the equipment supplier Applied Materials reportedly stopped business with Sanan Optoelectronics.
  • According to Sanan Optoelectronics, Applied Materials has limited impact on Sanan’s business operation since the US company is not an exclusive equipment provider for the chip maker. 
  • Sanan claims to have alternatives from domestic Chinese equipment supplier for production expansion.
  • Sanan has sent a team to the US to clarify the reason for being red-flagged and applied for being removed from the “unverified” list.
  • According LEDinside, Applied Materials’ business halt may have impact on Sanan’s semiconductor business such as GaAs and GaN products for 5G communication, which may be the real US government concern, i.e., nit LEDs.

Source: LEDinside LINK

TSMC Unveils 6-nanometer Process

7-nanometer Enhancement Combines Performance/Cost Advantage with Fast Time-to-Market

Hsinchu, Taiwan, R.O.C. – April 16, 2019 - TSMC (TWSE: 2330, NYSE: TSM) today announced its 6-nanometer (N6) process, which provides a significant enhancement of its industry-leading N7 technology and offers customers a highly competitive performance-to-cost advantage as well as fast time-to-market with direct migration from N7-based designs.

By leveraging the new capabilities in extreme ultraviolet (EUV) lithography gained from the N7+ technology currently in risk production, TSMC’s N6 process delivers 18% higher logic density over the N7 process. At the same time, its design rules are fully compatible with TSMC’s proven N7 technology, allowing its comprehensive design ecosystem to be reused. As a result, it offers a seamless migration path with a fast design cycle time with very limited engineering resources for customers to achieve the product benefits from the new technology offering. 

Photo released by Taiwan Semiconductor Manufacturing Co., Ltd.
Scheduled for risk production in the first quarter of 2020, TSMC’s N6 technology provides customers with additional cost-effective benefits while extending the industry-leading power and performance from the 7nm family for a broad array of applications, ranging from high-to-mid end mobile, consumer applications, AI, networking, 5G infrastructure, GPU, and high-performance computing.

“TSMC N6 technology will further extend our leadership in delivering product benefits with higher performance and cost advantage beyond the current N7,” said Dr. Kevin Zhang, TSMC Vice President of Business Development. “Building upon the broad success of our 7nm technology, we’re confident that our customers will be able to quickly extract even higher product value from the new offering by leveraging a well-established design ecosystem today.”

Friday, April 12, 2019

Versum Materials: Merck KGaA to buy Versum in all-cash deal valued at 5.8 billion euros

Merck KGaA said Friday it has signed a definitive agreement to acquire Versum Materials Inc. in a deal with an enterprise value of 5.8 billion euros ($6.6 billion). Merck will pay $53 per Versum share in cash to create a top supplier of high-purity process chemicals, gases and equipment for semiconductor manufacturing, the company said in a statement. 
The deal is expected to immediately boost Merck's per-share earnings and to close in the second half. Versum's board has terminated its merger agreement with Entegris Inc. on the grounds that the Merck offer is superior. The deal will be financed with cash on hand and debt via a facilities agreement with Bank of America Merrill Lynch, BNP Paribas Fortis and Deutsche Bank AG. 
Merck is determined to maintain its strong investment grade rating, it said in a statement. Versum shares were slightly higher premarket, but have gained 38% in the past 12 months, while the S&P 500 has gained 8%.Market Pulse Stories are Rapid-fire, short news bursts on stocks and markets as they move. Visit for more information on this news.
Source: MarketWatch LINK

BASF to boost alkylethanolamines capacity at Verbund site

With more than 300 different amines in a diverse portfolio, German chemical company BASF is a world-leading amine supplier. The company produces alkyl-, alkanol- and alkoxyalkylamines, heterocyclic and aromatic and specialty amines. To adapt to ever-increasing demand for its alkylethanolamine (AEOA) range, BASF announced on 10 April 2019 an increase in its annual production capacity.

Source: Fuels + Lubes Online LINK

Wednesday, April 10, 2019

TSMC starts working on 5nm Apple A14 chip infrastructure

Taiwan Semiconductor Manufacturing Company (TSMC) has announced the release of its 5nm chip design infrastructure. With the shrinking size, the company is touting improved processor performance as well as improved battery life and thermal management. It's noteworthy that TSMC has been Apple's only supplier for the company's A-series chipsets since 2016.

TSMC is now expected to continue being the only supplier for Apple for its future iPhone models. This could mean that Apple can move forward with producing 5nm A-series chipset for the future iPhone models and we could see it in as early as 2020 iPhones.

The 5nm process is already said to be in preliminary risk production and the chipmaker is planning to invest around $25 billion towards volume production by 2020. As for the iPhone models launching this year, reports indicate that the company will be using a new A13 processor, which will be manufactured using the 7nm+ process.

Source: Gizmochina LINK

Gelest Inc. recruits Jim Whitlock as COO

Gelest Inc, which is backed by New Mountain Capital, has named Jim Whitlock as chief operations officer. Previously, he worked at Honeywell where he was vice president of integrated supply chain for their performance materials and technology business group. Morrisville, Pennsylvania-based Gelest is a maker of supplier of silicones, organosilanes and metal-organics for advanced technology end markets.

Source: PE Hub Network LINK

Monday, April 8, 2019

TSMC Ramps Volume Manufacturing For 7nm Using EUV Scanners, Expects 5nm By 2020.

TSMC has started volume manufacturing of high-performance 7nm parts according to a report by DigiTimes. Among TSMC's 7nm chip clients, HiSilicon and AMD have been ramping up their wafer starts aggressively.

By Abhishekkumar Thakur

Friday, April 5, 2019

Amtech Systems plans to divest its solar businesses

Amtech Systems, a manufacturer of capital equipment and consumables used in fabricating semiconductor devices, LEDs, SiC and silicon power chips ans well as solar cells, is planning to sell its solar businesses.
Source: Evertiq LINK

ASML celebrate 35 years and bringing EUV lithography to HVM

Decades of enormous hard work and innovation at ASML in transforming a prototype (shown in the thumbnail) into the giant NXE:3400B EUV lithography tool that is running in the leading edge fabs.


By Abhishekkumar Thakur

Samsung doubles investment in EUV line at Hwaseong plant

Samsung is preparing to double its previous investment in a contract related to its new EUV lines at the company's Hwaseong facilities. Samsung announced construction plans for Hwaseong in 2017, and broke ground in 2018 with completion scheduled for 2020. Samsung added 739 billion won to the original 723 billion won contract, signed back in September 2018, bringing its total value to around $1.29 billion. The work for this particular line is expected to be completed by April 2020.

Source: Techspot LINK
Bay Abhishekkumar Thakur

Thursday, April 4, 2019

TSMC today announced delivery of the complete version of its 5 nm design infrastructure

Hsinchu, Taiwan, R.O.C., April 3, 2019—TSMC today announced delivery of the complete version of its 5 nanometer (nm) design infrastructure within the Open Innovation Platform® (OIP). This full release enables 5nm systems-on-chip (SoC) designs in next-generation advanced mobile and high-performance computing (HPC) applications, targeting high-growth 5G and artificial intelligence markets. Leading Electronic Design Automation (EDA) and IP vendors collaborated with TSMC to develop and validate the complete design infrastructure, including technology files, process design kits (PDKs), tools, flows and IP, through multiple silicon test vehicles.
TSMC’s 5nm process is already in risk production and offers IC designers a new level of performance and power optimization targeted at the next generation of high-end mobile and HPC applications. Compared with TSMC’s 7nm process, its innovative scaling features deliver 1.8X logic density and 15% speed gain on an ARM® Cortex®-A72 core, along with superior SRAM and analog area reduction enabled by the process architecture. The 5nm process enjoys the benefits of process simplification provided by EUV lithography, and is making excellent progress in yield learning, achieving the best technology maturity at the same corresponding stage as compared to TSMC's previous nodes.

TSMC’s comprehensive 5nm design infrastructure includes the full versions of the 5nm Design Rule Manual (DRM), SPICE model, process design kits (PDKs) and silicon-validated foundation and interface IP, and also supports a full range of certified EDA tools and design flows. Backed by the resources of the largest design ecosystem in the industry, TSMC’s Open Innovation Platform®, customers have already started intensive design engagements, paving the way for product tape-outs, pilot activities and early sampling.

“TSMC’s 5-nanometer technology offers our customers the industry’s most advanced logic process to address the exponentially growing demand for computing power driven by AI and 5G,” said Cliff Hou, Vice President of Research & Development/Technology Development at TSMC. “5-nanometer technology requires deeper design-technology co-optimization. Therefore, we collaborate seamlessly with our ecosystem partners to ensure we deliver silicon-validated IP blocks and EDA tools ready for customer use. As always, we are committed to helping customers achieve first-time silicon success and faster time-to-market.”

Press release : LINK

Applied Optoelectronics orders MOCVD technology from AIXTRON

Photonics manufacturer expands production into growing laser business with multiple AIX 2800G4 systems

Herzogenrath/Germany, 2 April, 2019 – AIXTRON SE (FSE: AIXA), a worldwide leading provider of deposition equipment to the semiconductor industry, today announced the delivery of multiple AIX 2800G4 systems to US-based photonic maker Applied Optoelectronics, Inc. (AOI) which focuses on the design, development, and manufacturing of advanced optical devices, packaged optical components, optical subsystems, laser transmitters, and fiber optic transceivers. The delivered tools feature a 12x4-inch configuration.

AIX 2800G4-TM

The AIX 2800G4 platform has established itself as the market-leading tool for high-volume production of vertical-cavity surface-emitting lasers (VCSEL) for 3D sensors and other diode lasers due to the matchless performance of the Planetary Reactor® concept with respect to thickness and wavelength uniformity control of epitaxial layers. The system provides incomparably high efficiency in handling the expensive chemicals used for MOCVD processes while delivering maximum production yield of premium level laser devices. In addition to the excellent reproducibility of each individual system, customers also appreciate the very good repeatability amongst systems.

Dr. Klaus Anselm, Vice President of Semiconductor Products at AOI, comments: "Following our good experience with AIXTRON systems in the past, we will also utilize the proven Planetary® technology from Germany for our production expansion. The AIX 2800G4 has convinced us in all test phases, so that we are now looking forward to use the system for launching volume production of our next generation of optoelectronic components."

"We are very pleased that AOI has added our market-leading AIX 2800G4 tool to its existing manufacturing equipment. A system that has acquired a reputation over the past few years as the tool of record for the production of high-quality laser devices in the semiconductor industry. We are looking forward to the collaboration with AOI," says Dr. Bernd Schulte, President of AIXTRON SE.

Wednesday, April 3, 2019

Ionbond Equipment Division integrated into IHI Hauzer Techno Coating

Ionbond is pleased to announce the sale of its equipment division to fellow IHI Group company Hauzer Techno Coating.

Under Hauzer, which produces physical vapor deposition (PVD) equipment for the tribological, tool and decorative market, the equipment division will continue as an indpendent company under the name IHI Bernex. IHI Bernex will continue to work closely with the Ionbond group on key projects and developments. 

Maximize strength by expansion
Dave Doerwald, Hauzer CEO: “The Bernex portfolio is an excellent complement to the Hauzer portfolio, allowing the two companies to serve more customers together. We are both equipment manufacturers and speak the same language when it comes to doing business.” Dr. Michael Auger, Bernex CEO, adds: “Bernex is profitable and growing, and we are looking forward to the synergies that will come from working with Hauzer. Both companies have a lot to offer.”

The integration of the Ionbond equipment division into Hauzer is in line with the aim of the IHI Group to maximize synergies by aligning equipment production activities. “  Bernex will be an independent company within the Hauzer group, with the same people and the same business location in Olten, Switzerland. 

Leader in CVD Solutions
Bernex CVD systems set the industry standard in CVD enhancement of wear, friction and temperature protection of tools and components. Bernex machines are renowned for their reliability and have proven themselves in hundreds of installations worldwide. The company has over 45 years of experience with developing technology, equipment and recipes for CVD coatings. Auger: “CVD is in our DNA. We have expanded CVD technology to include CVA (for aluminum coatings) and CVI (for coating the internal surfaces of porous materials such as carbon fiber bodies). Our expertise in developing proprietary coatings for specific customer applications sets Bernex apart in the field.”

Bernex Expanding Production Capacity
Bernex engineering and manufacturing will remain in Olten, where it is expanding its production capacity. The Bernex Service Center Asia will remain in Kunshan, China.

For more information, see the new Bernex website:

VEECO Demonstrates Thought Leadership at Technical Conferences in 2Q/2019

Company’s Technologists to Present Innovations that Drive Industrial Scaling of Technology Megatrends in Big Data, Artificial Intelligence, Communications, Autonomous Vehicles, Displays and More

PLAINVIEW, New York, April 2, 2019—Veeco Instruments Inc. (Nasdaq: VECO) today announced its leading technologists are scheduled to speak at seven technical events throughout Q2 2019. The forthcoming presentations, which follow several notable appearances in Q1, highlight Veeco’s depth and breadth of expertise in working with customers to break through production-scale barriers that will ultimately lead to the wide adoption of game-changing trends in big-data, high-speed communications, artificial intelligence, autonomous vehicles, high resolution displays and more.

Veeco exhibiting and presenting at EFDS ALD for Industry (March 19-20; Berlin, Germany) “Atomic Layer Deposition Use for Decorative Applications” Ganesh Sundaram, Ph.D., vice president of Applied Technology, Veeco CNT. (Photo by Martin Knaut LINK)

Through these papers, Veeco explains how it solves tough materials engineering challenges with advances in its deposition, etch, lithography and wet processing technologies used in applications such as next-generation advanced packaging, photonics, sensors, MEMS, micro-LEDs, power electronics, high bandwidth memory and related devices. Presentations in the second quarter include:

  • MRS Spring Meeting & Exhibit (April 22-26; Phoenix, AZ)—Tania Henry, process development engineer, will present “Influence of Intermixing on Perpendicular Magnetic Anisotropy of Ion-Beam-Deposited CoFeB MTJs for STT-RAM,” on April 25 during the annual meeting focused on the future of materials science
  • Critical Materials Council Conference (April 25-26; Saratoga Springs, NY)—Drew Hanser, vice president of technology, will present at the fourth annual forum for discussing actionable information related to semiconductor fab materials. Hanser’s talk, “Material Integration Challenges for GaN on Si for Power and RF Devices,” takes place on April 25 during Session II: Immediate Challenges of Materials & Manufacturing
  • Society of Vacuum Coaters TechCon (April 27-May 2; Long Beach, CA)—At one of the world’s leading vacuum coating technology conferences, senior research scientist Binyamin Rubin will discuss “Monochromatic and Broadband Optical Monitoring for Deposition of Band Pass Filters,” on April 29. The Veeco team will also be exhibiting its latest advances in ion beam deposition systems for optical coatings at booth #229
  • CS ManTech (April 29-May 2; Minneapolis, MN)—Phillip Tyler, process development engineer, will present “Development of Advanced Lift Off Processes for 5G and VCSEL Applications.” Stop by Veeco’s booth #609 to learn more about the company’s latest innovations in compound semiconductor and wet processing technologies
  • ECTC (May 28-31; Las Vegas, NV)—Dr. Ajit Paranjpe, chief technology officer, will co-author a presentation on “High-Yield Precision Transfer and Assembly of Gallium Nitride (GaN) Micro-LEDs Using Laser Assisted Micro Transfer Printing,” with experts from the University of California, Los Angeles
  • EUVL Workshop (June 10-13; Berkeley, CA)—At this year’s workshop focused on the fundamental science of EUV lithography and its continued extension to support Moore’s Law, Sandeep Kohli, principal research scientist, will present “Ion Beam Technology Roadmap for EUV Mask Deposition and Absorber Etch Processes”
  • TechConnect World Innovation Conference and Expo (June 17-19; Boston, MA)—Dr. Ganesh Sundaram, vice president of applied technology, will present “Atomic Layer Deposition for Life Science Applications” on June 17 at the Nanomedicine Symposium
Veeco scientists also presented research at a number of key technical conferences in Q1, including:
  • SPIE Advanced Lithography (Feb. 24-28; San Jose, CA)
    • “Ion Beam Etching of Advanced Absorber Materials for Sub-5nm EUV Masks”
    • “Intra-field Stress Impact on Global Wafer Deformation” (alongside ASML and imec)
  • EFDS ALD for Industry (March 19-20; Berlin, Germany)
    • “Atomic Layer Deposition Use for Decorative Applications”
  • CS International (March 26-27; Brussels, Belgium)
    • “Accelerating Photonics Growth through Advances in High-Performance Arsenic/Phosphide (As/P) MOCVD and Wet Processing Technology”
“Veeco builds production-scale fab solutions that solve tough materials engineering problems for our customers,” said Ajit Paranjpe, Ph.D., chief technology officer. “Our technical contributions to these prestigious and peer-reviewed conferences demonstrate Veeco’s commitment to remaining at the forefront of technological advances, which ultimately have a positive impact on society through life-improving applications.”

About Veeco

Veeco (NASDAQ: VECO) is a leading manufacturer of innovative semiconductor process equipment. Our proven MOCVD, lithography, laser annealing, ion beam and single wafer etch and clean technologies play an integral role in producing LEDs for solid-state lighting and displays, and in the fabrication of advanced semiconductor devices. With equipment designed to maximize performance, yield and cost of ownership, Veeco holds technology leadership positions in all these served markets. To learn more about Veeco's innovative equipment and services, visit

Sunday, March 31, 2019

Semiconductor Foundry Landscape

The semiconductor foundry landscape changed in 2018 when GLOBALFOUNDRIES and Intel paused their leading edge foundry efforts. Intel quietly told partners they would no longer pursue the foundry business and GF publicly shut down their 7nm process development and pivoted towards existing process nodes while trimming headcount and repositioning assets.

"Today there are only two leading edge foundries left, TSMC and Samsung. TSMC is currently the foundry market leader and I see that increasing when mature CMOS process nodes that have second, third, and even fourth sources become obsolete and the unclonable FinFET processes take over the mature nodes."
Countinue reading: LINK 

Friday, March 29, 2019

Meyer Burger takes major stake in Oxford PV

Solar cell equipment maker Meyer Burger Technology has bought 18 per cent of Oxford PV, the leading perovskite solar cell maker.The deal makes Meyer Burger the largest shareholder in Oxford PV, which has so far raised $101m in backing and set up a pilot manufacturing line in Germany. Hans Brändle, CEO of Meyer Burger, will become a member of the Board of Directors of Oxford PV.Meyer Burger has been restructuring its business, selling off its wafer business. At the same time as taking the Oxford PV stake, the company is issuing over 62m shares.
Source: EE News Power LINK

Air Liquide inaugurates its new Tokyo Innovation Campus

Today, Air Liquide (Paris:AI) inaugurates its Tokyo Innovation Campus in Yokosuka, Japan. This newest Campus for Air Liquide illustrates the Group's open innovation approach, with a focus on energy transition environment, healthcare, and digital transformation. The facility house Air Liquide's Research Development teams as well as digital and process specialists in a state-of-the art new 8,000-square-meter site with 8 laboratories and 6 pilot platforms.

The Tokyo InnovationCampus, which represents an investment of 50 million euros, will gather nearly 200 employees, including researchers, digital specialists, experts in customer applications, as well as teams dedicated to exploring new markets.

In particular, the new Campus will focus on developing advanced materials, especially for the manufacture of'next generation' semiconductors, flexible displays, energy storage and distribution. It will also accelerate the development of solutions to improve energy efficiency, reduce carbon footprint, and develop new energies, such as hydrogen energy and biomethane.

Source: FinanzNachrichten LINK

Wednesday, March 27, 2019

SK hynix wins nod to build semiconductor cluster near Seoul valued at 120 trillion won ($136 billion)

SK hynix on March 27 won approval for its plan to build a semiconductor cluster in the Seoul metropolitan area as the government decided to lift development regulations in the region. The update on the project, valued at 120 trillion won ($136 billion) came after the Ministry of Trade, Industry and Energy requested the Ministry of Land, Infrastructure and Transport last month to ease regulations that limit the total size of industrial zones in the area.

Source: The Korea Herald LINK

Saturday, March 23, 2019

Oxford Instruments wins contract to supply cryogenic systems to The Institute of Physics-Chinese Academy of Sciences

Oxford Instruments PLC (LON:OXIG) has fought off competition from around the world to supply its cryogenic and superconducting magnet systems to a renowned Chinese research institute. Multiple systems will be installed at the Institute of Physics-Chinese Academy of Sciences' new facility in Beijing through 2020 and 2021. The technology will allow researchers to test materials at extremely low temperatures and different magnetic field strengths. 
Oxford returns to annual profit Oxford, which was spun out from the University of Oxford back in the 60s, has previously supplied several bits of its technology to IOP-CAS's other labs. "This is an excellent example of the growth we are seeing from customers involved in Physical Science Research and Quantum Technologies where our key enabling technologies and advanced solutions enable fundamental research and accelerate our customers applied R&D," said chief executive Ian Barkshire. "We are delighted to be the provider of choice to the renowned Institute of Physics in Beijing. This underlines Oxford Instruments' status as a world leader in state-of-the art technology solutions that create unique environments and enable measurements down to the molecular and atomic level." Shares were unmoved on Friday morning at 1,020p.
Source: Proactive Investors LINK

Foundry ranking 1Q/2019

[BeSan Inc.] "Based on the recent report from TrendForce, modification of pure foundry ranking has been made assuming 40% and 82% of Samsung and Globalfoundries revenues comes from external customers, respectively. UMC starts losing money since Q4, 2018 and GloFo never made profit since its inception. Therefore, it would be interesting to see how they are making turn around during this downturn in 2019. In case of Samsung, it has certain limitation as a pure foundry player due to potential conflict of interest with foundry customers (for example, Apple vs. Samsung case). So, there is no doubt that TSMC will keep its #1 position for a while. Foundry is obviously "Winner-Takes-All-Market" and accordingly there are "NO Fast Followers.""

Source BeSang Inc. LINK


Apple plans to launch the 5nm EUV SoC A14 through TSMC in 2020

Over the past year, Apple launched the Bionic A12 processor chip, which is based on the first TSMC 7nm manufacturing process. This year, the company plans to launch a new A13 chip that is also based on the 7nm process, but will be better optimized. The A13 chip is expected to have a 20% increase in chip density and 6-12% energy savings over the previous generation. Therefore, it can be said that the performance of the iPhone 2019 generation will not have major breakthroughs compared to the current iPhone XS. iPhone 2018 set itself apart from the competition with the performance of its 7nm A12 bionic chips. During this year TSMC, Apple’s supplier will use Extreme Ultraviolet Lithography (EUV) to produce the 7nm A13 chips and next year make the transition to 5nm with SOC A14.
Source: OptoCrypto  LINK

Aledia Taps Veeco's Compound Semiconductor Expertise, Citing High-Quality Gallium Nitride Epitaxial Film Performance

Display Technology Innovator Expands Portfolio of Veeco Thin Film Process Technologies to Advance Next-Generation 3D Micro-LEDs

PLAINVIEW, New York, — Veeco Instruments Inc. (Nasdaq: VECO) announced today that Aledia, a developer and manufacturer of next-generation 3D LEDs for display applications, has expanded its portfolio of Veeco thin film process equipment to support the development and production of advanced 3D micro-LEDs. Aledia cited Veeco’s proven leadership in compound semiconductor applications, GaN-on-silicon growth performance, and capability to grow a full range of high-quality epitaxial films as key factors influencing its decision. 
Veeco’s Propel™ Power GaN MOCVD system is designed specifically for the power electronics industry. Featuring a single-wafer reactor platform, capable of processing six- and eight-inch wafers, the system deposits high-quality GaN films for the production of highly efficient power electronic devices.

“We have been impressed with the performance of Veeco’s Propel™ GaN MOCVD platform for large-wafer 3D LED production, and naturally turned to Veeco again to support our advanced LED development,” said Philippe Gilet, co-founder and CTO of Aledia. “Veeco’s solutions meet our rigorous material quality and system delivery requirements along with unmatched material flux stability and repeatability. We are excited to take the next step with them in producing next-generation 3D micro-LEDs.”

The collaboration between Aledia and Veeco reflects the immense promise of micro-LEDs and other advanced LEDs for the future of displays. Micro-LEDs offer high efficiency, brightness and reliability benefits with shorter response time, enabling lighter, thinner and flexible displays with energy saving advantages for applications such as wearables, smartphones, automotive, signage/large TVs, augmented reality/virtual reality, etc. According to a recent Yole Développement report, there have been close to 1,500 patents filed related to micro-LED display from 125 different companies, with the bulk of activity occurring after 2012.

“With the significant shift toward exploration of micro-LEDs for use in next-generation displays, leaders like Aledia are turning to Veeco,” said Gerry Blumenstock, senior vice president and general manager of Veeco’s compound semiconductor business unit. “Veeco’s proven materials engineering expertise puts us in a unique position to offer innovative thin film deposition technologies for customers tackling tough compound semiconductor research, development and production challenges.”

Veeco will exhibit and present at the CS International Conference, March 26-27, 2019 in Brussels, Belgium. Mark McKee, director of product marketing for Veeco’s MOCVD business unit, will present “Accelerating Photonics Growth through Advances in High Performance As/P MOCVD and Wet Processing Technology,” on March 27, 2019 at 9:50 a.m. CET.

Saturday, March 16, 2019

Aixtron full-year revenue up 40% organically to €268.8m

[Semiconductor Today] For fourth-quarter 2018, deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany has reported revenue of €87.9m, up 39% on €63.4m last quarter and up 62.5% on €54.1m a year ago.

Full-year revenue was €268.8m in 2018 (exceeding the guidance of €260m). This is up 17% on €230.4m in 2017, or up 40% organically excluding the €38.8m from the atomic layer deposition/chemical vapor deposition (ALD/CVD) product line (for memory chip applications) that was divested at the end of 2017.

In particular, equipment revenue grew by 18% from €188m to €221.8m (remaining 82% of total revenue), while sales of spare parts & services rose by 11% from €42.4m to €47.1m (18% of total revenue).

Of equipment revenue, the proportion from metal-organic chemical vapor deposition (MOCVD) systems for manufacturing optoelectronic components (i.e. lasers and solar, excluding LEDs) rebounded from 25% to 66% (growing from €47.8m to €147m), driven by strong demand for vertical-cavity surface-emitting lasers (VCSELs). Despite continuing strong demand for red-orange-yellow (ROY) LEDs and specialty LEDs, systems for producing LEDs fell from 42% to just 16% (from €79.1m to €36m). Systems for manufacturing power electronics fell from 11% to 8% (from €20.4m to €18.2m).

Source: Semiconductor Today LINK

Friday, March 15, 2019

VLSIresearch released its list of the top Semiconductor Equipment Suppliers for 2018 shown big wins for Japanese OEMs

VLSI Research report well above average growth for ASML (NL), Tokyo Electron (JPN), Advantest (JPN), Kokusai (JPN), Daifuku (JPN) and Canon (JPN) so a big win for Japan and the Netherlands last year. All Japanese companies outperform the market growth 2018!

Dan Hutchenson: "VLSIresearch released its list of the top Semiconductor Equipment Suppliers for 2018. Notable shifts were TEL passing Lam to take the top spot. Advantest past Screen for 7th with the highest growth of any chip equipment manufacturer. While ASM Pacific passed SEMES. For details, see:

Most growth is seen in Litho as for each Immersion or EUV tool that is installed a bunch of Tokyo Electron tools come as well like e.g. the TEL Track platform.

With respect to ALD, judging by ASMI, TEL and Kokusai it seems that ALD was able to capture all of the growth in 2018 and maybe a bit more. In April the Japanese companies start their 2018 annual reporting so then we will know more for now we have the ASMI report to study (LINK).