KLA-Tencor has announced it is expanding its integrated circuit (IC) packaging portfolio with two new defect inspection products designed to address a wide variety of IC packaging challenges: KronosTM 1080 and ICOS™ F160. The two new inspection systems join KLA-Tencor’s portfolio of defect inspection, metrology and data analysis systems that help accelerate packaging yield and increase die sort accuracy. You may find the official release here;
- Kronos 1080 – offers production-worthy, high sensitivity wafer inspection for advanced packaging, providing key information for process control and material disposition.
- ICOS F160 – examines packages after wafers have been diced, delivering fast, accurate die sort based on detection of key defect types—including sidewall cracks, a new defect type affecting the yield of high-end packages.
Kronos™ 1080 and ICOS™ F160 (Image shared by KLA-Tencor)