Monday, November 11, 2019

ASM International launches A400(TM) Duo vertical furnace system with dual reactor chambers

New system addresses 200mm applications with high productivity and low cost of ownership

Munich - ASM International N.V. (Euronext Amsterdam: ASM LINK) today introduced the A400™ DUO vertical furnace system with dual reactor chambers for wafer sizes of 200mm and smaller. The system’s DUAL Boat reactors produce high throughput, increasing reactor utilization to a very high percentage, while ensuring low capex.

“The new A400™ DUO reactor ensures that ASM will extend its position as a leader in the market for Power, Analog, RF, and MEMS applications,” said Hichem M’Saad, ASM Executive Vice President, Global Products. “As 200mm manufacturing began its renaissance, driven by growth in for instance IoT devices, it became clear that our existing furnace technology could still achieve industry-leading results. Combining our technology with the latest innovations in robotics and controls has significantly enhanced the system’s manufacturing capabilities to meet today’s production targets.”



The new DUO is compatible with the original A400™, so existing process recipes can be easily transferred, accelerating system ramp. The system has secured production qualification from multiple customers in Europe, the United States and Asia, including several leaders in power, RF, and MEMS device manufacturing. To date over 20 reactors have been shipped, with a healthy outlook for further shipments.

ASM’s original A400™ vertical furnace system has a proven track record of more than 1000 reactors shipped to customers worldwide and over 25 years of maturity in semiconductor manufacturing. The new system has been modernized to support a variety of growing markets including silicon power, wide band gap semiconductor power, analog, RF and MEMS devices. With its updated control system, software with an intuitive graphical user interface, predictive maintenance by advanced control diagnostics, new robot, and plug-and-play installation, customers can count on the A400™ DUO delivering increased reliability with production output that achieves better repeatability, productivity, and time utilization.

Like its predecessor, the A400™ DUO offers a comprehensive portfolio of process applications including low pressure chemical vapor deposition (LPCVD) processes like doped silicon and silicon nitride films, diffusion processes such as wet oxidation and anneal processes.

Sunday, November 3, 2019

Global MEMS and Sensors Fab Capacity to Grow 25 Percent Through 2023, SEMI Reports

MILPITAS, Calif., Oct. 29, 2019 /PRNewswire/ -- Total worldwide installed capacity for MEMS and sensors fabs is forecast to grow 25 percent to 4.7 million wafers* per month from 2018 to 2023, driven by explosive demand across communications, transportation, medical, mobile, industrial and other Internet of Things (IoT) applications, according to the new MEMS & Sensors Fab Report to 2023 published by SEMI.


Listing more than 230 companies with over 400 facilities, the report is the first of its kind focused on MEMS and sensors front end facilities. The report, spanning the 12 years starting in 2012, predicts that MEMS fabs will account for 46 percent of all MEMS and sensors facilities by 2023. Image sensors fabs will represent 40 percent of the total, and other fabs – those producing both MEMS and image sensors – the remaining 14 percent.

Japan led the world in MEMS and sensors capacity in 2018, followed by Taiwan, the Americas, and Europe/Mideast. China is on track to rise from the sixth position this year to the third largest region in installed capacity by 2023. Japan and Taiwan are expected to maintain the top two positions through 2023.

The MEMS and Sensors Fab Report to 2023 shows fab equipment investments hovering at about US$4 billion per year from 2018 to 2023, with most of the spending – an estimated 70 percent – devoted to fabs for image sensors made on 300mm wafer sizes. During the same period, Japan's fab equipment investment is expected to peak at nearly US$2 billion in 2020, with Taiwan topping out at US$1.6 billion in 2023.

All told, 14 new device volume fabs will be added from 2018 to 2023** for MEMS and sensors made on wafers ranging from 8 inches to 12 inches in size. China shows the largest increase in new volume fabs followed by Japan, Taiwan and Europe.

The MEMS & Sensors Fab Report to 2023 includes details on individual fabs such as location, technologies and products, as well as quarterly data from 2012 to 2023 for the following:
Construction and equipment investments
Installed capacities
Wafer sizes
Process nodes

SEMI Industry Research and Statistics developed the MEMS & Sensors Fab Report to 2023 in collaboration with the MEMS & Sensors Industry Group, a SEMI Strategic Association Partner. To learn more about the MEMS & Sensors Fab Report to 2023, click here.

*200mm equivalent capacity – excludes R&D, Pilot and EPI lines
**Excludes R&D, Pilot and EPI lines and fabs with low probabilities of being built

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: mhall@semi.org