Thursday, January 16, 2020

2020-03 ALD Financial News Brief

ASM International announces Q4 2019 orders substantially above guidance

Reflecting stronger than expected market conditions, order intake in Q4 2019 came in slightly above €370 million, substantially above the range of €290-310 million that ASMI guided for with the publication of the Q3 2019 results on October 30, 2019. Based on preliminary numbers, sales in Q4 2019 slightly exceeded the high end of the guidance of €310-330 million.

Both Q4 orders and preliminary sales mentioned above, as well as previous Q4 guidance,, do not include the earlier announced proceeds of US$61 million (approximately €56 million) related to the settlement of the arbitration proceeding with Kokusai Electric Corporation.

ASMI will report fourth quarter and full-year 2019 financial results on February 25, 2020.

Picosun's ALD Technology Enables 3D Silicon-Integrated Microcapacitors With Unprecedented Performance

Picosun Group, a global provider of leading AGILE ALD® (Atomic Layer Deposition) thin-film coating solutions, reports record performance of silicon-integrated, three-dimensional deep trench micro capacitors manufactured using its ALD technology. Increasing efficiency and performance demands of portable and wearable electronics, along with their shrinking size in accordance with the Moore's law, set new challenges to the power management of these devices as well. A solution is the further integration of the devices' key components into so-called SiP (systems-in-package) or SoC (systems-on-chip) architectures, where everything, including the energy storage such as batteries or capacitors, is packed close to each other into one compact, microscale-miniaturized assembly. The post Picosun's ALD Technology Enables 3D Silicon-Integrated Microcapacitors With Unprecedented Performance appeared first on Semiconductor Digest. 

Metal mask coating by ALD for reliable plasma process in PECVD

NCD has steadily developed large area and high throughput ALD equipment and technology. The applications for display, solar cell, and semiconductor fields have been already commercialized, and also NCD has worked hard to find use in special markets like excellent plasma protective coating on metal masks. NCD will aggressively respond to the development and then supply of ALD equipment, which customers would need for various industries in the future.

TSMC is being pressured to make chips in the US because of security concerns

The United States has increased its pressure on the Taiwan Semiconductor Manufacturing Company, aka TSMC, for producing its military-use chips in the country. This is being done to ensure that the world's biggest contract chipmaker can manufacture the high-security components free from potential Chinese interference. 
The post TSMC is being pressured to make chips in the US because of security concerns appeared first on Gizmochina. 

Friday, January 10, 2020

Advanced Energy Announces Grand Opening of State-of-the-Art Advanced Materials Processing Showcase Lab Near Frankfurt

Global leader in power solutions for advanced thin film development to unveil new German hub for critical plasma deposition applications and materials characterization to serve clients from around the world

FORT COLLINS, Colo.--(BUSINESS WIRE)--Dec. 10, 2019-- Advanced Energy Industries, Inc. (Nasdaq: AEIS) – a global leader in highly engineered, precision power conversion, measurement and control solutions – is pleased to announce the grand opening of its Advanced Materials Processing (AMP) Showcase Lab near Frankfurt, Germany. Located in Karlstein am Main, the state-of-the-art facility includes office space and lab space for plasma deposition and materials characterization. The lab will serve as a central hub for AE product demonstrations and customers’ plasma deposition research and development activities, providing a superior experience for thin film developers.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20191210005367/en/


AE’s plasma lab multi-chamber inline coater showing substrate carrier and vacuum load lock in the foreground and with various gas handling cabinets and AE’s power supplies in racks in the background. This equipment includes but is not limited to planar and rotatable dual magnetron sputtering (DMS), and has plasma etch pre-cleaning capability. Various substrate sizes from small experimental coupons (e.g. glass, sapphire, silicon and more) up to 500x600 mm2 rectangular sheets (e.g. glass, plexiglass, plastic, metal and more) can be utilized. (Photo: Business Wire)

Saturday, January 4, 2020

AMD is gaining on Intel rapidly

WCCFTech reports (LINK) that in a survey report of machines running PassMark (Australian CPU benchmarking company), the company reported AMD's market share increasing to 40% for the first time in a very long time. Lats time Intel and AMD were close were in 2005 when AMD was still operating its Fab in Dresden, Germany.

AMD has since then moved to fabricate its processors first at Globalfoundires and then moved over to TSMC. The current Zen 2 based processors are made using TSMC 7 nm while Intel runs its own 14 and 10 nm technology. Intel 10 nm and TSMC 7 nm are roughly comparable when it comes to scaling dimensions.

This graph counts the baselines submitted to PassMark during the period and therefore is representative of CPUs in use rather than CPUs purchased (PassMark).

TSMC to soon start production of 5nm node based Apple A14 SoC

TSMC will be the sole foundry making 5 nm process technology based Apple A14 chipsets for the 2020 iPhone models and the production will start in the second quarter of this year in preparation for the traditional end of Q3 launch. The A14 will be made using TSMC’s new 5 nm process and Apple’s order will take up two thirds of the foundry’s capacity. There’s a chance the iPhone 12 phones will be the first to hit the market with a 5nm chipset.

Source: GSM Arena (LINK)
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By Abhishekkumar Thakur