Sunday, February 11, 2018

Apple, LG, Valve bet on OLED microdisplays technology, invest $10 million in eMagin

TechObserver reports : Maker of OLED microdisplays eMagin is getting attention from tech giants such as Apple and LG as they bet big on VR and AR for future growth. According to documents filed with the US Securities and Exchange Commission Apple, LG and Valve have made $10 million investment in eMagin.

eMagin is New York-based company that makes microdisplays used in the military, medical and industrial fields, but it has recently turned its attention to companies building consumer headsets. "We entered into strategic agreements with multiple Tier One consumer product companies for the design and development of microdisplays for consumer head mounted devices and, together with these companies, negotiated with mass production manufacturers for higher volume production capabilities," eMagin said in its filing.

Article: LINK

The company's flagship product is a 2K display with a resolution of 2,048x2,048 pixels and a 70 percent fill factor, the percentage of each pixel that can be used to gather light. (Picture from OLED-Info LINK)

Friday, February 9, 2018

Cases Closed: Veeco, AMEC, and SGL Settle Patent Litigation


Veeco Instruments Inc., Advanced Micro-Fabrication Equipment Inc. (AMEC), and SGL Carbon SE (SGL), today announced that they have mutually agreed to settle the pending litigation among the parties and to amicably resolve all pending disputes, including AMEC's lawsuit against Veeco before the Fujian High Court in China and Veeco's lawsuit against SGL before the U.S. District Court for the Eastern District of New York.

Source: LEDinside LINK

Monday, February 5, 2018

GlobalFoundries to Soon Pilot 7nm and EUV Production

GlobalFoundries is pushing ahead with a plan to pilot EUV and 7nm production. We recently got a chance to sit down with the company and talk about its plans for the future.


Source: ExtremeTech LINK

SK Hynix ramps up eSSDs with 72-Layer 3D NAND Flash

SK Hynix Inc. (or 'the Company', www.skhynix.com) today announced that the Company recently completed developing an enterprise SATA Solid State Drive (or 'eSSD'). With its 72-Layer 512Gb (Gigabits) 3D NAND Flash chips, the Company is paving the way for its full-fledged entrance to the high value-added eSSD market.

 
SK Hynix combined the 72-Layer 512Gb 3D NAND Flash with its in-house firmware and controller to provide the maximum density of 4TB (Terabytes). SK Hynix makes the most of its 72-Layer 512Gb 3D NAND chips to double the biggest density of the SSD of the same size with 256Gb NAND chips.

Source: EPS News  LINK

Thursday, February 1, 2018

SMIC obtains government fund for advanced 14 nm node technology development

DigiTimes reports: China-based pure-play foundry Semiconductor Manufacturing International (SMIC) has obtained financial support from the government to accelerate the development of its 14nm and more advanced process technologies.

SMIC announced recently China's National Semiconductor Industry Investment Fund (known as the Big Fund) and Shanghai Integrated Circuit Investment Fund (SICIF) have made capital investments in subsidiary Semiconductor Manufacturing South China (SMSC), which will become a joint venture between the parties. The stake in SMSC held collectively by SMIC Shanghai and SMIC Holdings has therefore reduced to 50.1% from 100%, SMIC added.

SMSC was founded at the end of 2016 with a capital base of only US$210 million, SMIC disclosed. With the Big Fund and SICIF becoming SMSC's new shareholders, SMSC is able to expand its registered capital to US$3.5 billion, with the Big Fund and SICIF holding 27.04% and 22.86%, respectively, of the JV company.

Full article: LINK
 
This should mean a lot of ALD equipment invest for self aligned multiple pattering (SAMP) and high-k / metal gate stack, which if all goes like elsewhere should be open for a large amount of ASM International single wafer tools. In addition, Applied Materials Olympia may be in for a match in SAMP processing according to my understanding of the FEOL Logic market.  
 
 
Fab startegy from SMIC company presentation (LINK)
 
Established in 2000, Semiconductor Manufacturing International Corporation ("SMIC") is one of the leading dedicated semiconductor foundries in the world and the largest and most advanced foundry in Mainland China. SMIC has the following wafer fabs (www.smics.com)
 
Shanghai: one 300mm wafer fab; one 200mm wafer fab
Beijing: two 300mm wafer fabs
Tianjin: one 200mm wafer fab
Shenzhen: one 200mm fab
Italy: one 200mm wafer fab

Monday, January 29, 2018

Apple chip maker TSMC plans 5-nanometer chips for 2020, 3-nanometer in 2022


Apple’s chip manufacturer TSMC today broke ground on its first 5-nanometer fabrication facility in Taiwan, promising that 5-nanometer chips will be commercially available in 2020, with 3-nanometer chips planned for 2022. The tiny new processors will guarantee that future smartphones continue to shrink while offering superior performance and battery life to today’s models.

First shown in physical form by IBM and Samsung last June, the 5-nanometer chip process is capable of squeezing 30 billion transistors — digital on-off switches — into fingernail-sized chips, doubling or tripling the transistor counts of 10-nanometer chips. TSMC’s 5-nanometer process uses extreme ultraviolet lithography, requiring an expensive super-fine laser that has only recently become commercially viable.


Source: VentureBeat LINK

EXALOS orders Veeco's Propel GaN MOCVD platform for R&D on SLEDs


Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA says that EXALOS AG of Schlieren, Switzerland has ordered a Propel gallium nitride (GaN) metal-organic chemical vapor deposition (MOCVD) system (for delivery in third-quarter 2018) for R&D on broadband superluminescent light-emitting diodes (SLEDs).

As a hybrid between LEDs (which emit broadband light from a surface in all directions) and laser diodes (which emit narrowband light from a waveguide with a well-defined laser beam), superluminescent LEDs emit broadband light in a highly directional beam through electrical current injection, and are used in medical and industrial imaging, motion control detectors, navigation, optical sensing and metrology applications.


Source: Semiconductor Today LINK

Friday, January 26, 2018

Sino IP Office Rules in Favor of AMEC by Rendering Veeco Instruments' Susceptorless Reactor Patent Invalid

AMEC
SHANGHAI, Jan. 26, 2018 /PRNewswire/ -- Advanced Micro-Fabrication Equipment Inc. (AMEC) today announced that the Patent Re-examination Board (PRB) of the State Intellectual Property Office (SIPO) in China, ruled on Jan. 23 that all patent claims relating to patent number ZL 01822507.1 held by Veeco Instruments Inc. (Veeco U.S.), and titled "Susceptorless reactor for growing epitaxial layers on wafers by chemical vapor deposition", are invalid. The court cited "lack of novelty and non-obviousness" for its decision.

The patent ruled invalid is the Chinese counterpart of the patents (U.S. 6506252 and U.S. 6726769) asserted by Veeco U.S. in an infringement action taken last year against AMEC's wafer carrier supplier, and filed in the U.S. District Court for the Eastern District of New York.

TSMC Orders Equipment Worth T$2.7 Bln From Tokyo Electron & Applied Materials

Jan 24 (Reuters) - Taiwan Semiconductor Manufacturing Co Ltd :  BRIEF-TSMC Orders Equipment Worth T$2.7 Bln From Tokyo Electron, Applied Materials South East Asia

Source: Reuters

Read full article >

TSMC To Create First 5nm & 3nm SoCs In 2019/2020

According to recent reports cited by Taiwanese media outlets, chipmaker TSMC is planning to start producing of its first 5nm chipsets in 2019, and by 2020 the company intends on manufacturing its first 3nm solution. By the end of the month the tech giant will reportedly start building a new factory in the Southern Taiwan [...]The post Report: TSMC To Create First 5nm & 3nm SoCs In 2019/2020 appeared first on AndroidHeadlines.com |.

Source: AndroidHeadlines

Read full article

TSMC 

Chip maker SK Hynix's 4Q net profit doubles to record high

SEOUL, South Korea (AP) — SK Hynix said Thursday its fourth quarter net profit doubled from a year earlier to a record high and forecast that robust demand for chips would continue this year.
South Korea’s second-largest chipmaker said its October-December earnings jumped to 3.2 trillion won ($3 billion) from 1.6 trillion won a year earlier. Its quarterly sales and operating profit were also at the highest levels in the company’s history. Quarterly sales surged 69 percent to 9 trillion won ($8.5 billion) while operating profit more than doubled to 4.5 trillion won ($4.2 billion).

Read full article








Saturday, January 20, 2018

Alkane - Hafnium product breakthrough consolidates Dubbo Project business case

Alkane - Hafnium product breakthrough consolidates Dubbo Project business case.

Summary
  • Alkane’s wholly owned subsidiary, Australian Strategic Materials Ltd (ASM), has developed high‐purity hafnium dioxide products tailored to meet market requirements.
  • Hafnium oxide exceeding 99.8% HfO2, and 99.9% (Hf+Zr)O2, has been produced using a proprietary process to separate hafnium from zirconium at the demonstration pilot plant at ANSTO.
  • Over the past 12 months, ASM has consulted extensively with industry to confirm growing market demand for high‐purity hafnium, which currently depends on supply from the production of zirconium metal for specialty alloys and the nuclear industry.
  • Global shortage of hafnium anticipated as demand is poised to outstrip current supply.
  • Hafnium metal for super alloys is currently trading in a US$800 ‐ $900/kg range. The ASM business case assumes a conservative product price of US$500/kg for its oxide.
  • ASM will initially produce 25tpa hafnium to meet projected market demand, ramping up to higher quantities as required.

Download : Download (PDF, 718KB)

Development of high‐purity hafnium dioxide

Australian Strategic Materials Ltd (ASM), a wholly owned subsidiary of Alkane Resources, has successfully developed a high‐purity hafnium dioxide (HfO2) product that will be directly marketable as a feed material for a number of downstream applications and for producing metallic hafnium. The technical specifications of this material have been tailored to meet global market requirements, following extensive industry consultation over the past 12 months. 

Monday, January 15, 2018

Picosun to provide 300 mm ALD cluster tool for STMicroelectronics Power Semiconductors

ESPOO, Finland, 16th January, 2018 – Picosun Oy, a leading supplier of Atomic Layer Deposition (ALD) thin film coating technology for global industries, partners with STMicroelectronics S.r.l. to develop the next generation 300 mm production solutions for advanced power electronics.

Power electronic components are right at the heart of many core elements of our society, where energy saving, sparing use of natural resources, and CO2 emission reductions are called for to provide for sustainable future. Energy production with renewables such as wind and solar, clean transportation with electric vehicles and trains, and industrial manufacturing with energy-smart power management and factory automation are key markets where the demand for advanced power components is increasing.


Most power semiconductor industries use 200 mm wafers as substrates. Transfer to 300 mm enables more efficient, ecological, and economical production through larger throughputs with relatively smaller material losses, and adaptation of novel manufacturing processes such as ALD allows smaller chip sizes with increased level of integration.

As a part of the funded project R3-POWERUP (*), Picosun’s PICOPLATFORM™ 300 ALD cluster tool will be optimized and validated for 300 mm production of power electronic components. The SEMI S2 certified PICOPLATFORM™ 300 cluster tool consists of two PICOSUN™ P-300S ALD reactors, one dedicated for high-k dielectric oxides and one for nitrides, connected together and operated under constant vacuum with a central vacuum robot substrate handling unit. The ALD reactors are equipped with Picosun’s proprietary Picoflow™ feature which enables conformal ALD depositions in high aspect ratios up to 1:2500 and even beyond. Substrate loading is realized with an EFEM with FOUP ports. The fully automated cluster tool can be integrated into the production line and connected to factory host via SECS/GEM interface.

“Our PICOPLATFORM™ 300 cluster tools have already proven their strength in conventional IC applications, so expansion to the power semiconductors is only natural. We are very pleased to work with a company such as STMicroelectronics to tailor and validate our 300 mm ALD production solutions to this rapidly growing market. This is also a prime opportunity both to contribute to the future of European semiconductor industries, and to utilize ALD to provide technological solutions to the global ecological and societal challenges such as climate change and dwindling natural resources,” summarizes Juhana Kostamo, Managing Director of Picosun.

Saturday, January 13, 2018

MPD Chemicals Acquires Specialty Chemical Manufacturer Norquay Technology

Norqay Technology, a company with more that 30 years experience in organo metallic precursors for ALD and CVD has just been acquired by MPD Chemicals. Please find press release below.

TREVOSE, Pa., Jan. 11, 2018 /PRNewswire/MPD Chemicals (MPD), a US-based manufacturer of specialty chemicals and custom synthesis solutions, announced today the expansion of its manufacturing capabilities, product portfolio and customer base with the acquisition of Norquay Technology, Inc. (Norquay). Located in Chester Pennsylvania, Norquay is the fourth acquisition to be integrated into the MPD Holdings platform, an Addison Capital portfolio company; existing MPD businesses include Monomer Polymer & Dajac Labs, Silar, and IsoSciences.

Norquay is a specialty chemical manufacturer with over 30 years of expertise in providing the scale-up and production of advanced proprietary custom materials, including organometallic, inorganic and organic molecules. Norquay’s product line includes chromic, electronic, catalyst, ligand, medical adhesive and UV performance products, with a customer base that ranges from startups to large multi-national corporations.

Tuesday, January 9, 2018

Osram orders multi-reactor Propel HM and K475i MOCVD systems from Veeco for high-volume photonics and LED applications

Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA says that Osram Opto Semiconductors GmbH of Regensburg, Germany has ordered a multi-reactor Propel High-Volume Manufacturing (HVM) gallium nitride (GaN) metal-organic chemical vapor deposition (MOCVD) system, as well as K475i MOCVD systems. 

The K475i system incorporates Veeco’s Uniform FlowFlange technology, producing films with very high uniformity and improved within-wafer and wafer-to-wafer repeatability with what is claimed to be the industry’s lowest particle generation for demanding applications like photonics and advanced LEDs.  

Source: Semiconductor Today LINK

Saturday, January 6, 2018

Fabless IC Company Sales Top $100 Billion for First Time Ever

Fabless IC Company Sales Top $100 Billion for First Time Ever.

Lam Research and Tokyo Electron took market shares in 2017

Currently the fabs are running hot and expanding and 2018 is expected to continue to grow according to OEMs and market research companies like o VLSI Research (CEO Dan Hutcheson, see below). Solid State Technology reports, based on recent market research by The Information Network (LINK) that Market leader Applied Materials lost market shares in 2017 to the main competitor Tokyo Electron and Lam Research.

"Applied Materials 1.3 share points, dropping from 28.2% in 2016 to 26.9% YTD (year to date). Gaining share are Tokyo Electron Ltd. (TEL), which gained 2.4 share points while rising from 17.0% in 2016 to 19.4% in 2017 YTD. Lam Research gained 1.6 share points and growing from a 19.0% share in 2016 to a 20.6% share in 2017 YTD."

The three companies compete in the following areas with huge growth due to the memory boom in 2017 (3DNAND and DRAM):

  • conductor and dielectric etch equipment
  • deposition equipment - single/multiwafer ALD and CVD
CVD equipment share is roughly 3X that of ALD and ALD passed PVD in 2015 (according to VLSI Research). Furnace ALD and CVD is dominated by Tokyo Electron and Kokusai, however it is a smaller segment as compared to single and multi wafer ALD and CVD. ASMI, the leader in ALD single wafer equipment does not seem to have been able to grow with memory, down from 2.0% to 1.7%.

Please find the full article here: LINK

 

Friday, January 5, 2018

Memory chips led the way in 2017 boosting a 22% record semiconductor growth in revenue

Memory chips (DRAM & FLASH) led the way in 2017 boosting a 22% record semiconductor growth in revenue. Samsung Electronics became the number 1 in overall semiconductor sales for the first time, displacing Intel, which had held the top spot in sales every year since 1992. 



EE Times reports : Semiconductor sales grew by 22 percent to reach a record $419.7 billion — with memory chips leading the way — according to a preliminary estimate by market research firm Gartner.

Gartner (Stamford, Conn.) estimates that increased sales of memory chips due to shortages of NAND flash and DRAM accounted for about two-thirds of overall chip market growth in 2017. Memory also become the single largest semiconductor products category last year, according to the firm.

Full story: LINK


Gartener 2016 to 2017 revenue change for Top 10 Semiconductor companies [replotted]

Tuesday, January 2, 2018

Get back to work - SEMI projects continued boom in fab equipment spending for 2018

MILPITAS, Calif. ─ January 2, 2018 ─ The year-end update to the SEMI World Fab Forecast report reveals 2017 spending on fab equipment investments will reach an all-time high of $57 billion. High chip demand, strong pricing for memory, and fierce competition are driving the high-level of fab investments, with many companies investing at previously unseen levels for new fab construction and fab equipment. See figure 1.
World Fab Forecast Figure 1
Figure 1


The SEMI World Fab Forecast data shows fab equipment spending in 2017 totaling US$57 billion, an increase of 41 percent year-over-year (YoY). In 2018, spending is expected to increase 11 percent to US$63 billion.

While many companies, including Intel, Micron, Toshiba (and Western Digital), and GLOBALFOUNDRIES increased fab investments for 2017 and 2018, the strong increase reflects spending by just two companies and primarily one region.

ALD NanoSolutions Prepares particle coating CVR for Factory Installation

Here is some ALD news for Boulder Colorado just before the Holiday Season (teaken from their excellent e-mail News letter) - Merry Christmas and Happy New Year to the ALD experts in Boulder and elsewhere! 

  • ALD NanoSolutions Prepares CVR for Factory Installation
  • ALD Nano’s Coated Materials were on the International Space StationInternational
  • Organization for Standardization (ISO) Compliance for ALD-Coated Commercial Powders 
As reported in a previous edition of the ALD NanoSolutions Enews (see ALD Nano Enews: Vol. 2, Issue 3), the company announced commercial-scale validation of its continuous ALD reactor system equipment for particles. 

ALD NanoSolutions Prepares CVR for Factory Installation

As reported in a previous edition of the ALD NanoSolutions Enews (see ALD Nano Enews: Vol. 2, Issue 3), the company announced commercial-scale validation of its continuous ALD reactor system equipment for particles. The key aspects of that article are in italics below:

The scientific, process development and engineering teams at ALD Nano have spent considerable resources over the past few years rapidly developing this first-of-its-kind technology from research scale, bench-top to the current commercial-scale systems. A continuous vibrating reactor, or CVR, provides ALD coating capacity of more than three tons per day and 1,200 tons per year of particle materials. These techniques gained from equipment development open up new pathways for ALD Nano's growth. The CVR is a spatial ALD reactor system and can also be utilized for MLD techniques, run at atmospheric or pressurized conditions, and fitted with various features such as plasma.

The company is scheduled to install the first of its CVR reactor systems, second-generation design, in a commercial advanced materials coating production facility in the US in Q1 2018. An important milestone to compliment this type of state-of-the-art progress at the ALD Nano facility in Broomfield, Colorado. Additional CVR reactor systems are to be installed in other commercial materials production facilities over the next few years. Let us know if you have an ALD coating need for advanced materials that requires this level of scale.

Aveni extends copper interconnects to 5nm and below for BEOL integration employing ALD TaN & CVD Co barrier/seed

Recently at IEDM 2017 IBM announced that copper is here to stay and can continue to be scaled for the future back end of line (BEOL) interconnects - 20 Years of Cu BEOL in Manufacturing, and its Future Prospects (Invited), D. Edelstein, IBM TJ Watson Research Center (LINK)

Before the actual copper plating process, the advanced dual-damascene structures for interconnects employ two very important conformal deposition processes :
  • an atomic layer deposition tantalum nitride (ALD TaN) copper diffusion barrier
  • a thin chemical vapor deposition cobalt (CVD Co) liner
More detailed information on Cobalt CVD for barrier/seed and selective encapsulation of copper from the leader Applied Materials can be found here (LINK).

According to a press release below (LINK), Aveni has announced it has obtained results that support the continued use of copper in the BEOL for advanced interconnects, at and beyond the 5nm technology node. Aveni is a French developer and manufacturer of wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging. The company was originally founded in 2001 as a spinoff from the Commissariat à l’énergie atomique et aux énergies alternatives (CEA) to develop and market groundbreaking nanometric deposition technologies for a variety of electronic applications.  

MASSY, France – Dec. 12, 2017 – aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node.

HHV launch ALD System based on technology transferred from IIT Bombay

Hind High Vacuum Co. Pvt. Ltd. (HHV), a vacuum science and technology company with major clients like HAL, ISRO, BARC, Titan etc, announced the launch of its first indigenously developed Atomic Layer Deposition (ALD) System based on technology transferred from IIT Bombay. This tool was developed entirely by HHV’s Thin Film Technology Division out of its Bengaluru facility as a part of the company’s on-going ‘Make in India’ initiative.


A picture of the ALD 150 system, which seems to be a top loaded tool very similar in layout to e.g. a CNT Savannah. Judging by the name this is a 150 mm system (picture from HHV webpage)

Full story: HHV develops Atomic Layer Deposition System based on technology transferred from IIT Bombay

Press release: LINK

Link to HHV ALD product page: LINK

General Motors and Forge Nano has co-developed ALD technology for lithium batteries

According to recent news releases General Motors and Forge Nano has co-developed and been rewarded for ALD for lithium battery technology featuring:
  • ultrathin (thickness < 5nm) multifunctional hybrid coatings and processes.
  • solutions to critical issues involved with gas generation, manganese dissolution induced capacity loss and safety issue associated with polymeric separators.
  • scale-up production and commercialization of this innovation for both automotive and non-automotive applications.
  • semi-continuous ALD systems (the tall pilot-scale stack, as well as the large single-cycle stack), have the production capacity of more than 1 MT/day, making it possible to implement the advanced surface coating technologies into the next generation of lithium ion batteries.
 
Background information:

LOUISVILLE, CO - Forge Nano, Louisville, Colorado, recently won a 2017 R&D 100 Award as co-developer with General Motors for the development of the Ultrathin Multifunctional Hybrid Coatings and Processes. The R&D 100 Awards have served as an innovation awards program for the past 55 years, honoring great R&D pioneers and their revolutionary ideas in science and technology.

“Forge Nano was founded with a vision to deploy precision nano-coatings to make many other technologies safer, less expensive and more efficient. That vision is now a reality, and it is extremely gratifying to be honored by the R&D 100 Awards for introducing one of 2017’s most innovative and influential technology solutions,” said Forge Nano Founder and CEO Dr. Paul Lichty, who accepted the award at the R&D 100 Conference in Orlando, Florida.

Forge Nano launched in 2013 with breakthrough technology that makes nano-coatings fast, affordable and scalable in manufacturing. The company specializes in nano-coatings and atomic film deposition, serving functions from corrosion resistance to electrical insulation or conduction. As demands for next-generation materials become more and more extreme, nano-engineered surface coatings can fulfill the need for enhanced properties and precise characteristics.


The R&D 100 Award - Ultrathin multifunctional hybrid coatings and processes (LINK)

The majority of battery failure initiates from active material surfaces in the electrodes. Surface coatings, as an effective mitigating strategy, have been widely applied into battery material manufacturing process to protect active materials. Conventional coating technologies, such as chemical vapor deposition, physical vapor deposition and wet chemistry, typically generate non-uniform coating particularly on nano-sized particles. The thickness control becomes difficult, and the thicker coating typically induce high much impedance. To tackle this challenge, General Motors—a pioneer in applying surface coating using the Atomic Layer Deposition (ALD) technique—has developed several Ultrathin multifunctional hybrid coatings and processes. These ultrathin (thickness < 5nm) multifunctional coatings solve critical issues involved with gas generation, manganese dissolution induced capacity loss and safety issue associated with polymeric separators. Forge Nano has developed the technologies that enable scale-up production and commercialization of this innovation for both automotive and non-automotive applications. Their semi-continuous ALD systems (the tall pilot-scale stack, as well as the large single-cycle stack), have the production capacity of more than 1 MT/day, making it possible to implement the advanced surface coating technologies into the next generation of lithium ion batteries.

Thursday, December 14, 2017

Amtech Announces Follow-On Order for Next Generation Solar ALD for PERC Cell Line

TEMPE, Ariz., Dec. 14, 2017 /PRNewswire/ -- Amtech Systems, Inc. (NASDAQ: ASYS), a global supplier of production equipment and related supplies for the solar, semiconductor, and LED markets, today announced its solar subsidiary, SoLayTec B.V., has received a follow-on order for three next generation solar Atomic Layer Deposition (ALD) systems. The order is expected to ship and be installed in this fiscal year. As a leading ALD supplier in the market, SoLayTec has booked a total of 25 ALD system orders since its inception, of which 15 will be used in mass production.

Depending on the capacity levels that are needed, SoLayTec offers three types of InPassion ALD. The main difference is the number of deposition units modules added in such a system. The basic three products offered are 4, 6 or 8 deposition units, which result in 2,400 wph, 3,600 wph or 4,500 wph respectively. (www.solaytec.com)
Fokko Pentinga, CEO and President of Amtech, commented, "This follow-on order brings the total ALD tools ordered by this specific customer to seven. Four systems have been put in production of PERC solar cells in the second half of fiscal 2017. The orders SoLayTec has received from this particular customer represent a total of 1GW of PERC production capacity. This follow-on order validates our customer's confidence in the performance capabilities of our spatial ALD system in high-volume production of PERC solar cells. There is a high level of enthusiasm in the PV marketplace for PERC solutions and this manufacturing platform supports our customers' goals to improve the total cost of ownership by increasing cell efficiency."

Sunday, December 10, 2017

KKR Completes Tender Offer for Hitachi Kokusai

TOKYO--(BUSINESS WIRE)--Global investment firm KKR and Hitachi Kokusai Electric Inc. (“Hitachi Kokusai” or the “Company”; TSE stock code 6756) today announced the completion of a tender offer by HKE Holdings G.K. (the "Offeror"), an entity owned by KKR investment funds, for the common shares of Hitachi Kokusai (excluding the 51.67% of its shares that are owned by Hitachi, Ltd. (“Hitachi”). Approximately 25.55% of the common shares have been tendered through the tender offer and will be acquired by the Offeror.

In connection with the tender offer, the Offeror has entered into an agreement (the “Agreement”) with Hitachi, the lead shareholder in Hitachi Kokusai, and HVJ Holdings Co., Ltd., (“HVJ”), an entity backed by funds managed/ serviced by Japan Industrial Partners, Inc. (“JIP”). Under the terms of the Agreement, following a share consolidation after the tender offer, Hitachi Kokusai will acquire Hitachi’s 51.67% holding of Hitachi Kokusai’s common shares in a share repurchase. Thereafter, Hitachi Kokusai will conduct an absorption-type company split pursuant to which the Offeror will succeed to 100% of the Company’s Thin-Film Process Solutions business. Subsequently, the Offeror will transfer 20% of the shares of Hitachi Kokusai to each of Hitachi and HVJ, resulting in 60%, 20%, and 20% ownership of Hitachi Kokusai’s Video and Communication Solutions business for the Offeror, Hitachi and HVJ, respectively.

Wednesday, December 6, 2017

Picosun Oy and Ushio Inc. start collaboration in Japan

ESPOO, Finland, and TOKYO, Japan, 6th December, 2017 – Picosun Oy, a leading supplier of advanced Atomic Layer Deposition (ALD) thin film coating solutions, and Ushio Inc., a leading manufacturer of light sources and optical equipment, have started collaboration to boost the sales of Picosun’s ALD technology in the Japanese market.

Japan has long been one of Picosun’s most important market areas, where the demand for industrial ALD solutions is constantly increasing. In order to always guarantee first-class service to the esteemed customers in the area, Picosun Japan Co. Ltd was established as Picosun’s local subsidiary. Now, to extend this sales and service network even further, Picosun has decided to collaborate with Ushio, with Ushio working as its sales representative. Ushio is a well-known, well-established supplier of a wide variety of manufacturing equipment to the global semiconductor market, and Picosun’s fully automated, SEMI-compliant, and production line compatible industrial ALD systems will be a key addition to their portfolio.

China's Focus Lightings orders Veeco EPIK 868 MOCVD systems for LED production

Epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has received an order for multiple TurboDisc EPIK 868 gallium nitride (GaN) metal-organic chemical vapor deposition (MOCVD) systems, to be shipped to the manufacturing facility in Suzhou, China of Focus Lightings Tech Co Ltd for the production of high-volume light-emitting diodes for general lighting and display applications (adding to its existing installed base of Veeco systems).
 
Source: Semiconductor Today LINK
 

Tuesday, November 28, 2017

Picosun provide ALD Cluster Tool to Swedish MEMS Foundry Silex Microsystems

ESPOO, Finland, 29th November, 2017 – Picosun Oy (Finland), Silex Microsystems AB (Sweden), and Pegasus Chemicals Ltd (UK) have joined forces to develop and provide novel ALD (Atomic Layer Deposition) solutions and processes for MEMS (MicroElectroMechanical Systems) industries. The aim of the collaboration is to realize emerging, advanced MEMS structures that would not be possible to manufacture by any other thin film deposition methods.


Today, MEMS are crucial components in several everyday applications such as mobile phones, cars and in various sensor systems. In addition to these already vast markets, the rapidly spreading Internet-of-Things with its billions of independently communicating electronic devices is a huge driving force to accelerate MEMS industry’s exponential growth in the very near future. 

This is Silex Microsystems (Promotion Viedo from Youtube)
In the Picosun-Silex-Pegasus collaboration, a PICOSUN™ ALD cluster platform is installed at Silex’s MEMS foundry in Järfälla, Sweden. The platform consists of a fully automated, factory integrated cassette-to-cassette vacuum robot for substrate handling and a PICOSUN™ P-300F ALD reactor capable of coating up to 25 pcs 8” wafers in a batch. The installed reactor can deposit various metal oxides, metal nitrides, and pure metals on up to tens of thousands of wafers per month (*). Pegasus develops and manufactures the precursor chemicals required for the ALD processes and provides the technical support and delivery options for individual applications. The cluster platform can be later upgraded with two additional ALD reactors. In the collaboration, engineers and scientists from all three partners work together to solve existing problems in MEMS processing, as well as to develop completely new openings on how to realize novel MEMS devices.

“We have been working with Picosun since 2010 and now with this project we can bring our collaboration to a completely new level. We are very excited to have the PICOSUN™ ALD cluster platform in our cleanroom. It enables us to develop novel, production-proven ALD solutions for our customers in advanced MEMS applications,” says Dr. Niklas Svedin, Vice President of Engineering at Silex Microsystems. 
“This is a valuable project for us, as the use of ALD in MEMS processing is increasing very fast. We have already strong presence in the MEMS market, but new applications come up weekly and we want to keep our spearheading position in this development. Now in the SALADIN project we have partners with whom we can also test and develop new ideas of our own how ALD could be implemented in the MEMS process flow,” continues Mr. Juhana Kostamo, Managing Director of Picosun. 
“The MEMS industry is a fast-growing market and it is very interesting for us to be involved in the process of introducing the groundbreaking ALD cluster platform to it. We are eager to be in the frontline of the chemical development for this field and focusing on advanced MEMS applications,” summarises Dr. Paul Williams, Technical Director of Pegasus Chemicals. 
Picosun Oy (LINK)
Silex Microsystems (LINK)  
Pegasus Chemicals (LINK)

(*) Throughput calculated for 10 nm Al2O3, 90% system uptime.

Friday, November 24, 2017

The 7nm race by TSMC and Samsung - EUV or not EUV

According to industry sources on October 19, Samsung Electronics is considering a plan to purchase 10 extreme ultraviolet (EUV) lithography tools from the Netherlands-based ASML, the biggest semiconductor equipment maker in the world. To put tha in perspective - ASML believes that it can produce about 12 EUV lithography tools this year. It is the only company that manufactures EUV lithography tools in the world.

Sales in ALD and Etch equipment have been boosted by multiple patterning technologies based on Immersion lithography, both for Logic/Foundry and Memory. Maybe as much as 1/3 of the single/multi wafer ALD equipment market is patterning related. The last two years or so analyst have been busy trying to figure out the impact on deposition and etch equipment sales if/when EUV is introduced. Here is a recent take down by Seeking Alpha (LINK). My view is that scaling is based on symbiotic use of the latest technologies and multiple patterning and EUV will co-exist and keeping the scaling path alive. In addition, scaling opens new opportunities for ALD, ALEtch and future use of selective growth technologies with atomic scale precision. According to recent reports the ALEtch market segment is now considerd an actual segment by itself and has entered HVM (LINK).
Fudzilla reports: Korean based ETNews has mentioned that Qualcomm 7nm manufacturing has been a big win for TSMC while two other US and China customers chose Samsung’s 7nm. TSMC traditionially have dibs on Nvidia and MediaTek according to the report.

Qualcomm and Broadcom, according to the report are designing their next generation chips with TSMC’s7-nano PDK. The reason why Qualcomm went with 7nm with TSMC is the fact that the fab uses normal steppers while Samsung wants to make its 7nm with more bold and riskier EUV (Extreme Ultraviolet) photolithography technology.

View of Samsung Electronics’ Hwasung 17 line. It is expected that Samsung Electronics will build a new 7-nano plant on a nearby site according to ETNews.

Samsung is expected to be later to the 7nm game and early adopters had to go with TSMC. EUV is still technology that is not entirely ready for the mass market and there is a disagreement weather you should need to use Extreme Ultraviolet light manufacturing with 7nm or first with 5nm. Obviously the two main fabs disagree while GlobalFoundries cooperates and shares technology with Samsung, and will have Samsung to rely upon for 7nm.

Full article: Qualcomm 7nm made by TSMC [LINK]
ETNews original source: Samsung Electronics Close to Securing Two New Customers for Its 7-Nano Foundry[LINK]
Business Korea: Keeping Leadership in 7-nano Era Samsung Electronics Seeks to Buy Up Next-gen Semiconductor Mfg Equipment

Sunday, November 19, 2017

Atomic Layer Etching is entering HVM for 14, 10 and 7 nm Logic

After years in R&D, several fab tool vendors last year finally began to ship systems based a next-generation technology called atomic layer etch (ALE).

ALE is is moving into 16/14nm, but it will play a big role at 10/7nm and beyond. The industry also is working on the next wave of ALE technology for advanced logic and memory production.

Used by chipmakers for years, traditional etch systems remove materials on a continuous basis in devices. Considered a next-generation etch technology, ALE selectively removes targeted materials at the atomic scale without damaging other parts of the structure. For example, ALE can be used to remove materials in a structure to form trenches with gaps on the order of 10 to 15 angstroms or 5 atoms wide. (An angstrom is 0.1nm.)

 
Applied Materials Centris Sym3 is one of the Applied Materials offering for ALE. It can be configured to handle plasma ALE for anisotropic etch applications, such as self-align contacts and spacer-based patterning.

Applied Materials, Hitachi High-Technologies, Lam Research and TEL are among the suppliers of ALE tools in the market. Today, ALE represents a tiny percentage of the overall etch market. In total, the worldwide dry etch business is projected to reach $9.6 billion in 2017, up from $7.2 billion in 2016, according to Gartner.

Full article :  "What’s Next For Atomic Layer Etch?" by Mark Lapedus, Semiconductor Engineering (LINK)


Saturday, November 18, 2017

Arradiance and InRedox team up to offer ALD Functionalized Nanomaterials

SUDBURY, Mass., Nov. 17, 2017 —Arradiance’s formidable Atomic Layer Deposition (ALD) foundry service and InRedox’s world-class manufacturing of nanoporous anodic aluminum oxide (AAO) and nanotubular anodic titanium oxide (ATO) will provide new ALD-functionalized Nanoceramics for life sciences, nanotechnology, filtration and separation, energy generation and storage, analytical equipment and many other applications.

Arradiance LLC, manufacturer of the popular GEMStar family of professional, research grade Atomic Layer Deposition (ALD) systems and provider of nanofilm foundry services, today announced a partnership with InRedox LLC (Longmont, Colorado) to provide nanotechnology researchers with ALD-functionalized nanostructured materials (wafers, membranes and nanotemplates).

“InRedox’s innovative AAO / ATO wafers and templates have demonstrated utility at leading commercial, academic and government research institutions across a broad range of technology areas,” said Arradiance CEO Michael Trotter. “I am certain that the combination of Arradiance’s ALD nanofilms with InRedox’s powerful nanofabrication technology platform will spur exciting new developments,” explained Mr. Trotter.

“InRedox is excited by the potential of ALD functionalized nanoporous ceramics,” stated Dmitri Routkevitch, InRedox President and CTO, “and we look forward to working with Arradiance to continue to expand the range of nanomaterials that inspire and enable our customers in their pursuit of scientific breakthroughs or new products.”

Aixtron complete sale of ALD/CVD memory product line to Eugene Technology

AIXTRON SE (FSE: AIXA), one of the world’s leading providers of deposition equipment to the semiconductor industry, announced today that the sale of AIXTRON’s ALD and CVD memory product line to Eugene Technology Inc., a wholly owned U.S. subsidiary of Eugene Technology Co., Ltd, South Korea was completed as of November 15, 2017. 

The QXP-8300 Atomic Layer Deposition (ALD) mini-batch system suitable for e.g. high-k oxide films in advanced memory applications including 3D structure devices (aixtron.com)

AIXTRON will receive c. USD 60 million for the assets being transferred and c. USD 11 million for open supplier orders for which it retains the liability to pay.

AIXTRON, Inc., the U.S. subsidiary of AIXTRON SE situated in Santa Clara, California, will continue to provide sales and support for its continuing businesses.

Monday, November 13, 2017

Veeco's Q3 revenue growth driven by continued recovery in MOCVD market

For third-fiscal 2017, epitaxial deposition and process equipment maker Veeco Instruments Inc of Plainview, NY, USA has reported revenue of $131.9m, up 15% on $115.1m last quarter and up 54% on $85.5m a year ago, marking the first full quarter of combined results for Veeco and Ultratech Inc of San Jose, CA, USA (which designs and makes lithography, laser-processing and inspection systems for the advanced packaging, front-end semiconductor and LED markets), which was acquired on 26 May.

Source: Semiconductor Today LINK

Versum Materials Inc. (VSM) Issues Quarterly Earnings Results

Versum Materials Inc. (NYSE:VSM) posted its quarterly earnings data on Thursday. The basic materials company reported $0.47 EPS for the quarter, meeting the Thomson Reuters' consensus estimate of $0.47, Bloomberg Earnings reports. The firm had revenue of $294.50 million during the quarter, compared to analyst estimates of $281.39 million. 

Source: Zolmax News LINK

Versum Materials Slide Deck:  LINK

Friday, November 10, 2017

Picosun Oy shows record growth in ALD for fiscal year 2016/2017

Picosun is one of the leading suppliers of ALD thin film deposition technology for semiconductor, lightning, MEMS as well as for other industries and research. This week I had the chance to meet with Kustaa Poutiainen himself, Chairman and Chief Executive Officer of Picosun Oy. in Dresden. We had a very interesting meeting discussing recent developments in ALD Technology announced by Picosun as welal as discussing the past and future outlook of ALD.   

Mr Poutiainen was in Germany to meet with customers and overseeing Picosuns activities and expansion in Germany. In the European perspective Germany is the biggest market for ALD Technology and Equipment. For those of you who do not know, Picosuns ALD equipment portfolio in detail it ranges from fully automated ALD batch and cluster systems for high volume manufacturing to smaller scale R&D and pre-pilot production tools (see below). 

A snapshot of the Picosun products - more information here.
Picosun has recently opened a branch office in Germany - Picosun Europe GmbH, headed by General Manager Dr. Christoph Hossbach, serving its growing install base of ALD equipment on the German market, both at leading research institutes within Fraunhofer and other research organizations and wafer fabs. According to previous press releases made we know that they have an number of high value customers in Germany including Bosch Sensortech and Osram

Mr Poutiainen was very excited over the development of Picosun as a company and informed me that it ended its Fiscal year 2016/2017 in September by a record turnover growth of 27% landing at just above 21 million EUR for 2016/2017 and more details will be released soon. The company is constantly investing to develop it operations further globally adding new local teams and having a strong focus on R&D. Mr Poutiainen did also let me know that Picosuns R&D expenses are at about 20% of the actual turnover, which is considerable. Quoting Mr Poutiainen: “The most awarding proof of success of the company is to hire new members. We are looking to hire more than 30 new employees in the next expansion phase”.
Next you have a chance to meet Picosun at SEMICON Europa in Minich. Picosun is exhibiting as well as sponsoring the ALD Lab Saxony Symposium on the 14th of November.
ALD Lab Saxony Symposium : LINK
 



Saturday, November 4, 2017

Veeco wins preliminary patent infringement lawsuit with Chinese competitor AMEC

Veeco Instruments announced today that the United States District Court for the Eastern District of New York granted Veeco's motion for a preliminary injunction against SGL Carbon, LLC, a supplier of wafer carriers to Advanced Micro-Fabrication Equipment Inc. (AMEC). The injunction prohibits the sale of wafer carriers by SGL for use in susceptorless Metal Organic Chemical Vapor Deposition (MOCVD) systems using Veeco's patented technology, including wafer carriers designed for AMEC MOCVD systems.

Source: LEDinside LINK


AMEC was founded in 2004 and is based in Shanghai, China. AMEC manufactures and markets micro-fabrication equipment to semiconductor manufacturers and high-tech sectors including MOCVD equipment.

Solid State Laser manufacturer Lasertel Inc. purchases Oxford Instruments ICPCVD

Oxford Instruments Plasma Technology announce that Lasertel Inc of Arizona, US have recently purchased one of their advanced inductively coupled plasma chemical vapour deposition (ICPCVD) systems for the manufacture of Solid State Lasers (SSL).

Source: AZoM LINK

Thursday, November 2, 2017

SK Hynix to expand DRAM production capacity in China

SK Hynix recently struck a deal with China's city government of Wuxi to set up a new DRAM fab locally with total investment estimated at US$8.6 billion, according to China's local media reports. The new facility will be capable of processing 200,000 wafers built using 1Xnm technology when it becomes operational.

Source: DIGITIMES LINK


Wednesday, November 1, 2017

Veeco and ALLOS form Dresden, Germany demo 200mm GaN-on-Si wafers for blue/green micro-LED adoption

Veeco Instruments Inc of Plainview, NY, USA has completed a strategic initiative with technology engineering & IP licensing firm ALLOS Semiconductors GmbH of Dresden, Germany to demonstrate 200mm gallium nitride on silicon (GaN-on-Si) wafers for blue/green micro-LED production. Veeco teamed up to transfer ALLOS’ proprietary epitaxy technology onto its Propel single-wafer metal-organic chemical vapor deposition (MOCVD) system to enable micro-LED production on existing silicon production lines. 

Source: Semiconductor Today
LINK

Backgound on ALLOS GmbH:

Newly founded ALLOS Semiconductors offers AZZURRO patents and technology
Dresden, Germany – 15th December 2014 – GaN-on-Si technology expert ALLOS Semiconductors, founded little more than six months ago, announced today that it has acquired the exclusive ownership of all technology, know-how and intellectual property of former AZZURRO Semiconductors.



ASM International NV reports 3Q 2017 results - solid growth in ALD continues



Almere, The Netherlands October 31, 2017ASM INTERNATIONAL N.V. REPORTSTHIRD QUARTER 2017 RESULTS ASM International N.V. (Euronext Amsterdam: ASM) today reports its third quarter 2017 operating results.

· New orders at €160 million were 22% below the Q2 2017 level and 31% above last year's Q3 level.
· Net sales for the third quarter 2017 were €185 million, a decrease of 8% compared to the previous quarter. Year-on-year net sales increased with 28%.
· Operating result decreased to €26 million. This reduction is mainly related to the newly introduced products which are temporarily impacting the gross margin and had an effect of €9 million in Q3.
· Normalized net earnings for the third quarter 2017 decreased by €8 million compared to the second quarter 2017. The financing result included €8 million negative effects from currencies compared to €11 million negative effects in the second quarter. The result from investments increased with €1 million.



Commenting on the results, Chuck del Prado, President and Chief Executive Officer of ASM International said:

"In Q3, we realized sales of €185 million and an order intake of €160 million, well in line with our guidance. The sales included several deliveries of Intrepid Epitaxy and new PECVD applications. The initial margin on these newly introduced products is relatively low, as earlier indicated, and impacted our gross margin in the quarter with 5 percentage points. We expect our gross margin to normalize again in the course of 2018."

Source: FinanzNachrichten
LINK

According to the Investor presentation released by ASMI ALD is a key growth market as always:
  • ALD market expected to grow by double digits from ’15 to ’20-’21
  • ASMI has leadership position in ALD

ALD has been outperforming in 2011-2016
  • Sales grown at a CAGR of 11% in last six years, outperforming broader equipment market
  • Single wafer ALD market on track for a clear improvement in 2017 

ASM see solid growth expected for the ALD market for 2017 they expect a clear improvement in
the single wafer ALD market and they expect the single wafer ALD market to reach a size of approx. US$1.5 billion by 2020 to 2021

3Q 2017 Investor presentation: http://www.asm.com/Downloads/2017_Q3_Investor_presentation_.pdf

Wednesday, October 25, 2017

Aixtron's sale of ALD/CVD Product Line to Eugene Technology in South Korea gets US approval

Aixtron SE (AIXG), announced Tuesday that the Committee on Foreign Investment in the United States or CFIUS has approved the sale of ALD and CVD memory product line. 
Eugene Technology CEO Eom Pyeong-yong (left) and Aixtron CEO Kim Schindelhauer pose for a photo holding their contract. (Picture credit: Pulse by Maeil Business Newspaper & mk.co.kr LINK)
The company noted that the investigation by the CFIUS of the sale of AIXTRON's ALD and CVD memory product line to Eugene Technology in South Korea resulted in a determination that there are no unresolved U.S. national security concerns from CFIUS' perspective.
Full report: LINK

Monday, October 23, 2017

Picosun’s ALD technology improves lifetime and reliability of electronic circuit boards

ESPOO, Finland, 24th October, 2017 – Picosun Oy, leading provider of advanced Atomic Layer Deposition (ALD) solutions for global industries, has invented an ALD-based method(*) with which the operational lifetime and reliability of printed circuit board assemblies (PCBA) can be efficiently improved.

Metal whisker formation and corrosion are some key factors that cause PCBA performance degradation over time. Metal whiskers are thin filaments or threads growing out from solders, components, and interconnects on the PCBA, and they can cause short-circuiting that leads to a system failure. This is particularly fatal in several sensitive applications such as medical, automotive, space, aviation, military, and industrial control electronics. 
Previously, lead has been added to solder alloys to prevent whisker formation, but the current environmental regulations prohibit its use. This is why novel methods, such as the ALD-based surface protection technique developed and now industrially enabled by Picosun are very much sought after amongst the electronics manufacturers. In Picosun’s approach, application-specifically tailored ALD nanolaminate forms a dense, conformal, and hermetic seal on the PCBA. This seal protects the PCBA components from the corrosion caused by moisture and impurities in the ambient air and blocks the metal whisker propagation. As ultra-thin films, ALD coatings have the additional benefit of allowing postprocessing of the PCBA, and they do not increase its mass or dimensions. Furthermore, as a gas-phased technique, ALD is gentle to the surface, it can be applied at moderate temperatures, and it is environmentally friendly.



“Our PCBA protection technology has gained lots of interest amongst our clients both in industries and in R&D, and many are eager to start applying it in their manufacturing processes. Electronic circuit board industry is a vast, global market, where we are happy to utilize our ALD knowhow to enable products of extended lifetime and improved safety and reliability. Our comprehensive selection of industrial ALD systems guarantees an optimal solution to every customer, allowing fast and economic processing of even large area PCBAs in just one process run,” states Juhana Kostamo, Managing Director of Picosun.
(*) Pat. pending

AMEC Celebrates 100-Chamber Shipment Milestone For Prismo A7 MOCVD System Used To Manufacture LEDs

SHANGHAI, Oct. 23, 2017 /PRNewswire/ -- Marking a milestone for its Metal Organic Chemical Vapor Deposition (MOCVD) business, Advanced Micro-Fabrication Equipment Inc. (AMEC) today announced that it has shipped 100 Prismo A7™ MOCVD tool chambers since the product's introduction last year.  It is AMEC's second-generation MOCVD tool, and is used by customers to manufacture gallium nitride-based (GaN) Light Emitting Diodes (LEDs) for solid-state lighting products, and other applications. Each Prismo A7 system contains up to four chambers. Production throughput is more than twice as high as AMEC's first-generation MOCVD tool, the Prismo D-BLUE. 
 
 
The products are installed at customer facilities in China, where the majority of the world's LED devices are produced. Customers include leading Chinese LED manufacturers, San'an Optoelectronics and HC SemiTek Corporation. Since its introduction, AMEC has received multi-tool orders, as well as repeat orders for the system. Sales momentum is brisk, and by the end of this year, the company expects to record shipments of approximately 120 chambers.


Source: PR Newswire LINK

Thursday, October 19, 2017

ALD FOR INDUSTRY, MARCH 21 – 22, 2018 – DRESDEN

ALD FOR INDUSTRY, MARCH 21 – 22, 2018 – DRESDEN: Following the succes of ALD for Industry 2017 with 100 participants we will continue to organize this event. This time we have extended the Workshop with half a day to a full 2 day event and the ALD Exhhibition will also be open for the public! In addition, the part of the workshop will be a HERALD Event so please contact us for more details on that.

Conference Chairs: Jonas Sundqvist, Fraunhofer IKTS and Christoph Hossbach, Picosun Germany
Tutorial Chair: Colin Georgi, Fraunhofer ENAS

Committee: Bernd Hintze (invited speaker), Globalfoundries and Henry Bernhardt, Infineon


Background: A topical workshop with focus on industrialization and commercialization of ALD for current and emerging markets Atomic Layer Deposition (ALD) is used to deposit ultrathin and highly conformal thin films. ALD is unique in the sense that it employs sequential self-limiting surface reactions for growth in the monolayer thickness regime. 

ALD in Germany: According to market estimates the equipment market alone is currently at an annual revenue of US$ 1.5 - 1.7 billion (2017) and it is expected to double in the next 4- 5 years. In a European context ALD was invented independently twice in Europe (Russia & Finland) and since the last 15 years Germany has grown to become one of the strongest European markets for ALD in R&D, chemicals, equipment and end users. Here, Dresden and Saxony isa unique ALD hotspot due to a strong semiconductor and equipment industry.

The Event will focus on the current markets for ALD, besides the leading edge semiconductor industry, applications in MEMS and Sensors, Display, Lightning, Barriers and Photovoltaics will be addressed.

 
Sponsors (signed so far):

CONTACT:
Dr. Katrin Ferse
Europäische Forschungsgesellschaft Dünne Schichten e. V.
Gostritzer Str. 63, 01217 Dresden, Tel. +49 351 871 8374, Fax: +49 351 8718431
E-Mail: ferse@efds.org, web: www.efds.org
 
Dr. Jonas Sundqvist 

Fraunhofer IKTS, Dünnschicht-Technologien | Thin-Film Technologies, Winterbergstraße 28, 01277 Dresden, Germany
Telefon +49 351 2553 7693, Mobile +49 173 4394 239
E-Mail: jonas.sundqvist@ikts.fraunhofer.de
www.ikts.fraunhofer.de