Friday, September 22, 2017

Globalfoundries to roll out 12nm FinFET technology for high-performance devices

Globalfoundries has announced plans to introduce a new 12nm leading-performance (12LP) FinFET semiconductor manufacturing process. The technology is expected to deliver better density and a performance boost over Globalfoundries' current-generation 14nm FinFET offering, satisfying the processing needs of the most demanding compute-intensive applications from artificial intelligence and virtual reality to high-end smartphones and networking infrastructure.
 
Source: DIGITIMES LINK



Accordig to a press release by Global foundries besides transistor-level enhancements, the 12LP platform will include new market-focused features specifically designed for automotive electronics and RF/analog applications—two of the fastest-growing segments in the industry.
  • Emerging automotive applications in vehicle safety and automated driving require a combination of processing power and extreme reliability. The 12LP platform delivers both, with plans for Automotive Grade 2 qualification at Fab 8 by Q4 2017.
  • A new RF offering extends the 12LP platform for RF/analog applications such as premium-tier transceivers in sub-6GHz wireless networks. 12LP offers the best scaling in both logic and memory for RF chip architectures with primarily digital and less RF/analog content.

Thursday, September 21, 2017

Toshiba confirmed it has agreed to sell its flash-memory chip business for $18 billion

Japanese technology giant Toshiba Corp. confirmed Wednesday morning it has agreed to sell its flash-memory chip business for $18 billion to a consortium of bidders that includes Apple, Dell and Seagate.

Full Stories:
Reuters
Asia Nikkei

Wednesday, September 20, 2017

Swedish-American glō Orders G5+ MOCVD System for Micro-LED Production

This summer Google announced that it has invested 15 million USD for a 13 percent stake in Glo, a Swedish Lund University spin-out focused on creating nanowire-based LED-displays for mobile phones and smart watches as well as AR- and VR-applications (LINK). 

 
Now Aixtron Reports: AIXTRON SE (FSE: AIXA), a worldwide leading provider of deposition equipment to the semiconductor industry, announced today that it has received an order for an AIX G5+ platform from Swedish-American company glō-USA, Inc. The group focuses on the commercialization of micro-LED (mLED) products based on their proprietary defect-free GaN nanowires technology. Such 3D structures enable the growth of mLEDs while maintaining the reliability of an inorganic material system. AIXTRON’s AIX G5+ Planetary Reactor® system was selected in the scope of glō’s strategic expansion and will be delivered with an 8x150 mm configuration in the course of Q4/2017.

Monday, September 18, 2017

UK based IQE Extends Production with Multiple AIX 2800G4-TM Systems from AIXTRON

As sreported by LED Inside: AIXTRON SE, a worldwide provider of deposition equipment to the semiconductor industry, received a multiple MOCVD system order from IQE plc, the British supplier of advanced wafer products and wafer services to the semiconductor industry. The AIX 2800G4-TM automated Planetary reactors® expected to be deployed for the growth of gallium arsenide-based (GaAs) epi-wafers on 6-inch substrates for the production of VCSEL (vertical-cavity surface-emitting laser) for a range of photonic applications. 

Image from Aixtron.com

Thursday, September 14, 2017

ALD Nano today announced Wayne Simmons as CEO

ALD Nano today announced that its Board of Directors has appointed Wayne Simmons as Chief Executive Officer effective September 2017. Dr. Simmons was also elected to the Board of Directors. He will replace Founding CEO, Mike Masterson, who will assume the role of Executive Chairman with an added advisory role for key markets and will continue to serve as Chairman of ALD Nano's Board. The company has also announced that Joe Spencer was elevated to Vice President of Engineering and that its employee base continues to expand with new hires in areas including engineering, science and business development.
“This is the right time for Wayne Simmons to become ALD Nano's next CEO. We've selected a successful leader at a time when ALD Nano’s global leadership in ALD on particles is growing in existing and new markets ,” said ALD Nano Chairman Mike Masterson. “I joined ALD Nano because I wanted to be a part of a company that is solving important challenges for advanced materials that are transforming industries," said Wayne Simmons. “This company has built over a decade of ALD expertise with all of its business and scientific founders still active. Together, additional expertise has been added over the years that creates a wealth of institutional ALD knowledge to deploy into commercial markets."
Full story and Source: ALD Nanosulution Newsletter LINK

Wednesday, September 13, 2017

Dow and DuPont announces successful completion of merger

The Dow Chemical Company and E.I. du Pont de Nemours & Company (DuPont) report that they have successfully completed their merger. The combined entity is now operating as a holding company under the name DowDuPont with three divisions - agriculture, materials science and specialty products, trading on the New York Stock Exchange under the stock ticker symbol DWDP.'Today marks a significant milestone in the storied histories of our two companies,' said Andrew Liveris, executive chairman of DowDuPont. 

Source: Materials Today LINK


NCD supplied Full Automation for Lucida GS Series to Tongwei Solar

NCD has recently supplied Full Automation System to Chinese Tongwei Solar for solar cell manufacturing ALD equipment. This is Full Automation System including pitch changer to supply wafers automatically to Lucida GS ALD Series which had already installed in the customer site for high quality Al2O3 thin film deposition. The connection of ALD and Full Automation System to handle wafers automatically will make faster and more convenient ALD process.

In the future, the sales of Full Automation System along with ALD equipment will be increasing because most customers will need more productivity and more efficiency of work. 
Lucida™ GS Series + Automation

Tuesday, September 12, 2017

Entegris Expands Its Taiwan Technology Center To Add New Microcontamination Analysis And Technology Development Capacity

BILLERICA, Mass., Sept. 12, 2017 /PRNewswire/ -- Entegris Inc. (NASDAQ: ENTG), a leading specialty materials provider, today announced the expansion of its Taiwan Technology Center for Research and Development (TTC) in Hsinchu, Taiwan. The expansion adds a new Microcontamination Control Lab (MCL) that focuses on filtration media development and is home to the company's relocated Asia Applications and Development Labs (AADL) for trace metal, organic contaminant, and nanoparticle analysis. This addition to the Center's existing R&D, formulation scale-up, and pilot production capabilities also creates a single, off-site collaboration location for our customers' specialty chemical, CMP and liquid filtration needs.
 
 
Key facts for the $8.5 million USD investment:
  • Class 1000 cleanroom
  • 5x increase in lab space
  • Facility renovations and equipment upgrades
"Interactions and dependencies between process materials and equipment are at a critical evolution point as device scaling continues to be a leading driver for efficient construction of today's devices. Bringing the industry's brightest minds together in a state-of-the-art facility enhances Entegris' unique ability to meet these needs," offered Entegris Chief Operations Officer, Todd Edlund. "By expanding the MCL facility, we bring together core-competencies in liquid filtration, specialty chemicals, and CMP to create more holistic analytical services and technology development solutions designed to meet our customer's Logic, DRAM, and 3D NAND device manufacturing challenges."

Friday, September 8, 2017

Entegris & Hubei Jingxing Sign Manufacturing Agreement For TEOS Supply In China

Entegris recently announced that it has signed an agreement with Hubei Jingxing Science & Technology, Incorporated, Co., Ltd. (Hubei Jingxing), a specialty chemical manufacturer in Suizhou (Hubei Province), China to manufacture Entegris high-purity deposition products. These high-purity deposition products include TEOS (tetraethyl orthosilicate), a material particularly critical to enabling 3D NAND technology which is used in semiconductor manufacturing to produce leading-edge, faster storage, and memory.



"Our partnership with Hubei Jingxing enables us to expand capability for Entegris in China and shorten the deposition materials supply chain for Chinese customers," stated Entegris Senior Vice President and General Manager of Specialty Chemicals and Engineered Materials, Stuart Tison. "We are proud to become the first international company to establish high-volume TEOS manufacturing capacity in China, Entegris UltraPur™ TEOS , which is critical for the manufacture of 3D NAND and supports the overall growth of the semiconductor industry in the country."

"Our partnership with Entegris allows us to further expand our competencies in high-purity materials manufacturing," said Hubei Jinxing General Manager, Ye Gang. "Additionally, we will adopt manufacturing processes to match existing Entegris processes, as well as employ their quality control system to produce the most consistent results."
TECHCET ANALYSIS: China continues to invest to support the 2D-NAND to 3D-NAND transition tracked by TECHCET in terms of wafer starts and materials, equipment and delivery equipment. According to TECHCET's Critical Materials Report on advanced dielectric precursors, the materials market (ALD, CVD and SOD) was roughly US$365M in 2016, should break $400M in 2017, and is estimated to reach $560M for 2021 by a forecasted CAGR of 11% over the period as a whole. TEOS is a versatile CVD precursor in semiconductor manufacturing, is used across all nodes for STI and gap-fill with demand estimated at almost $30M, and should out-grow wafer starts due to new applications on the horizon. Growth is clearly driven by dielectric Plasma ALD deposition in multiple patterning, and by dielectric CVD in the 3D-NAND dielectric layer stack (48-72 layers today). 

More information on Dielectric Precursors : LINK

Thursday, September 7, 2017

ALD Enabled Battery Materials, Methods and Products IP Roll-up by Forge Nano

Forge Nano is pleased to announce the completion of its Intellectual Property roll-up initiative for Atomic Layer Deposition (ALD) enabled battery materials, methods of manufacturing, and products.

Through a series of patent filings, acquisitions, and licenses, Forge Nano is pleased to offer its customers and partners a comprehensive IP portfolio to incorporate the benefits of ALD surface modification coatings into battery products for enhanced safety, lifetime and end-use performance. Forge Nano is currently accepting licensing offers for this portfolio, with the anticipation of closing on a first round of field-limited agreements by the end of 2017. 

The cornerstone of Forge Nano’s ALD-enabled battery materials IP protects lithium-containing cathode and anode materials with coatings of up to two nanometers in thickness (US 9,570,734):

Claim 1: An electrode comprising a plurality of particles having a diameter of maximally 60 μm, wherein the particles are coated with a protective layer having a uniform thickness of about 2 nm or less, wherein the protective layer of the particles is obtained by atomic layer deposition, and wherein the particles are lithium-containing particles.

Monday, September 4, 2017

Taiwan top-3 foundries combined revenues to rise 13% in 3Q17

Combined revenues of Taiwan's top-3 foundries - Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) - are estimated at US$9.61 billion in the third quarter of 2017, up 13.3% sequentially but down 0.1% on year, according to Digitimes Research.

Source: DIGITIMES LINK

Friday, September 1, 2017

Samsung to Invest $7 Billion in China Fab

Reuters reports: Samsung Electronics Co Ltd expects to invest $7 billion over the next three years to expand its NAND memory chip production in China’s northwestern city of Xi‘an, the South Korean tech giant said on Monday. In a regulatory filing Samsung said it approved $2.3 billion of the expected investment of $7 billion on Monday.In early July, when Samsung announced an investment of $18.6 billion in South Korea, it said it would add a production line at its NAND plant in Xi‘an, but did not set an investment amount.

Reuters LINK

 
Samsung current Xian F1x1 fab for VNAND production having a 100,000 wafers starts per month capacity (picture from samsung.com)
 

Fab Tool Sales Show Signs of Coming Back to Earth

EE Tines reports: SAN FRANCISCO — Billings for North American semiconductor manufacturing equipment firms increased on a year-over-year basis for the 10th consecutive month in July, but declined on a sequential basis, according to the SEMI trade association.

EE Times LINK 

Thursday, August 31, 2017

ASM INTERNATIONAL N.V. PUBLISHES STATUTORY INTERIM FINANCIAL REPORT

Almere, The Netherlands August 31, 2017ASM International N.V. (Euronext Amsterdam: ASM) today published its Interim Financial Report for the six month period ended June 30, 2017.This report includes an Interim Management Board Report, and Consolidated condensed interim financial statements prepared in accordance with IAS 34 (Interim Financial Reporting). The Interim Financial Report comprises regulated information within the meaning of the Dutch Financial Markets Supervision Act.
 
Source: Benzinga LINK
 

Lam Research Completes Acquisition of Coventor

FREMONT, Calif., Aug. 31, 2017 (GLOBE NEWSWIRE) -- Lam Research Corporation (Nasdaq:LRCX), a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry, today announced that it has completed the acquisition of Coventor, Inc., a leading provider of simulation and modeling solutions for semiconductor process technology, micro-electromechanical systems (MEMS), and the Internet of Things (IoT). The combination of Lam and Coventor supports Lam's advanced process control vision and is expected to accelerate process integration simulation to increase the value of virtual processing, further enabling chipmakers to address some of their most significant technical challenges.
 
"We see a strong synergy between our modeling capability and Lam's desire to enable virtual experimentation of process development for customers and within its business units," said Mike Jamiolkowski, president and CEO of Coventor. "We believe that our combination will increase the value we can deliver to our customers by providing more capability and improving their time to market."

The 6th ALD Lab Saxony Symposium at the SEMICON Europa 2017 in Munich, Germany

As usual ALD Lab Saxony is organizing an ALD Symposium at SEMICON Europa. This time we are back in Munich and for the first time co-located with Productronica which may open new exsiting oppertunities for ALD!

Confirmed speakers from: Picosun Oy, Fraunhofer IMS Fraunhofer IKTS, and TECHCET LLC

More iformation will be available momentairly and the event is open for sponsoring

Please contact Jonas Sundqvist for more information: jonas.sundqvist@ikts.fraunhofer.de




Picosun reports repeat sales of ALD 200 mm Batch tools to major Asian discrete device manufacturers

ESPOO, Finland, 31st August, 2017 – Picosun Oy, leading supplier of high-quality Atomic Layer Deposition (ALD) solutions for industrial production, reports of repeat sales of automated P-300BV vacuum batch production systems to major Asian discrete device manufacturers. 
The PICOSUN™ P-300BV ALD system is specially designed for production of LEDs, discrete devices, and MEMS devices such as print heads, sensors, and microphones. (picosun.com)
Even if the 300 mm wafer size is the current state-of-the-art in many key semiconductor applications, and efforts have been made to increase this size even to 450 mm, the 200 mm market is very much alive and showing no signs of tailing off. One main factor supporting this steadfast longevity is the increasing usage of substrate materials such as GaN, SiC, and sapphire, where the wafer size is limited to 200 mm, or even smaller. These substrates have many benefits over traditional silicon and they allow manufacturing of components that are central in several technologies affecting our everyday life and the modern society. Examples are LED lighting, car and transport automation, power conversion, wireless communication and remote sensing. A prime example of the last two is the rapidly spreading Internet-of-Things with the billions of sensors forming its core. All of these applications ensure that the demand for 200 mm semiconductor production equipment stays at constant high and even increases.

Friday, August 25, 2017

Applied Materials Collaborating on Advanced Ceramics and Coatings

Collaborating on Advanced Ceramics and Coatings

Applied Materials recently joined the United States Advanced Ceramics Association to deepen our connection with suppliers and application developers, and explore potential areas where our materials engineering leadership can help enable the next major technology inflections.Read moreSend to ALL languages: Unseen label

Source: Applied Materials Blog LINK
 
 

Wednesday, August 23, 2017

Semiconductor boom lead by Samsung

Semiconductor Insight reports: The quarterly results of major semiconductor companies are in and Intel is no more the largest semiconductor company. Helped by the overheated memory market, Samsung has added more than 5B$ in quarterly revenue in just four quarters. This is more than 27% of all the 18.5B$ semiconductor revenue added from Q2-16 to Q2-17. Even in a favourable market, this is a tremendous gain not seen before in the industry. The revenue gain is larger than the revenue of Samsungs key competitor Micron.

Source : Semiconductor Insight LINK

 

Monday, August 21, 2017

Alkane Resources reports that zirconium oxychloride (ZOC) prices are up 40% since January 2017

Alkane Resources reports that zirconium oxychloride (ZOC) prices up 40% since January 2017, which are the highest prices for 4-5 years.

ZOC pricing hike during 2017 (Alkane Resources, Twitter). Alkane is developing the Dubbo Project in NSW Australia, based on a large in-ground resource of zirconium, hafnium, niobium and rare earths, with operations scheduled for 2018.

In contrast to hafnium, zirconium is practically transparent to thermal neutrons, and it is commonly used for the metal components of nuclear reactors – especially the claddings of their nuclear fuel rods. This property makes it crucial to the expanding Chinese nuclear supply chain industry and is one of the main reasons for the current upward price trend.

Besides the use of ALD deposited ZrO2 in DRAM memory cell capacitors, the leading end users of zirconia (ZrO2) are for ceramics, foundry sand (for metal sandcasting, over 70% of all metal castings are produced via sand casting process), opacifiers in glass, and refractories for material must withstand extremely high temperatures (e.g. furnaces). Other end uses of zircon include abrasives, chemicals (predominantly, zirconium oxychloride octohydrate and zirconium basic sulfate as intermediate chemicals), metal alloys, and welding rod coatings.

ZOC is also the main source for the >50 tonnes global demand of hafnium of which about 2 tonnes is heading for the electronics and semiconductor industry. In semiconductor manufacturing hafnium is mainly employed as hafnium oxide in leading edge CMOC Logic for smartphones, laptops, tablets and servers. The ultra thin HfO2 (about 2 nm) is deposited by an ALD process using solid HfCl4 evaporated from an highly advanced solid source evaporator directly integrated next to the ALD process chamber. Since the introduction in 2007 by the Intel 45nm technology ASM International has totally dominated the high-k gate oxide market with its Pulsar 3000 ALD chambers.

Today about half of all hafnium metal manufactured is produced as a by-product of zirconium refinement and the end product of the separation is HfCl4. HfCl4 hcan be processed further by the so called Kroll process (reduction with Mg at 1100 °C) to extract metallic hafnium metal sponge according to:

HfCl4 + 2 Mg -->  2 MgCl2 + Hf 

Please contact TECHCET for more deeper insigths into the high-k metal precursr supply chain : 


(Solid State Technology) Precursors tracked by TECHCET for ALD/CVD of metal and high-k dielectric films on IC wafers include sources of aluminum, cobalt, hafnium, tantalum, titanium, tungsten, and zirconium. The total market for 2017 is now estimated to be US$435M, growing to US$638M in 2021. The top-2 suppliers are estimated to hold more than half of the total available market, with many players competing to supply the next enabling molecule. In particular, cobalt precursor demand is forecasted to reach >$80M in 2021 as foundries transition to below 14nm-node processing. As a potential conflict mineral, TECHCET tracks the sub-suppliers of cobalt.

“Metal precursors have had double-digit growth over an extended period of time, and we expect that to continue as the IC industry transitions to 10nm- and 7nm-node logic and 3D-NAND fabrication, with an average long term CAGR of 11% over 2013 to 2021,” says Dr. Jonas Sundqvist, lead author of the report, senior technology analyst with TECHCET and researcher with Fraunhofer IKTS. “Dielectric precursors growth today is clearly driven by dielectric PEALD deposition in multiple patterning, and by dielectric CVD in 3D-NAND.”

ALD & CVD High-k and Metal Critical Material Report (LINK)

 

Hynix looking to acquire Toshiba

Hynix is looking to acquire Toshiba's memory business, says a study from the Korea Institute for Industrial Economics and Trade (KIET) as reported by the Korea JoongAng Daily newspaper. Hynix is part of the INCJ/Bain consortium bidding for Toshiba, but it has always said it was only looking to provide finance. However it did transpire ...This story continues at Hynix looking to acquire Toshiba says Korean report.Or just read more coverage at Electronics Weekly

Source: Electronics Weekly LINK

Saturday, August 19, 2017

OSRAM Opto Semiconductor Acquires MOCVD Systems from AIXTRON

AIXTRON announced that OSRAM Opto Semiconductors has purchased the company's AIX 2800G4-TM Planetary system for the manufacturing of mainly infrared-based high power lasers and LEDs based on gallium arsenide (GaAs).

Source: LEDinside LINK
 
 
Photo credit: Aixtron (www.aixtron.com)
 
From Aixtron Press release: “We are very pleased that OSRAM Opto Semiconductors has selected our AIX 2800G4-TM platform for the production of high power laser and infrared LED devices. Their trust in our AIX 2800G4-TM system confirms our strategy to focus on solutions for the most demanding applications, where superior process performance is mandatory to meet our customer’s requirements. Following the recent qualification of our AIX G5 C platform and achieving this key milestone also with the AIX 2800G4-TM, we are looking forward to further deepen our partnership with one of the most innovative semiconductor manufacturers worldwide”, explains Dr. Frank Schulte, Vice President AIXTRON Europe.
 

Wednesday, August 16, 2017

BALD News - Don´t miss any atomic level processing news!

Here is a service provided by BALD Engineering that you can order your own personalized e-mail news service for the two News Blogs operated by BALD Engineering. The feed can also be integrated into any feed reader you may be using or if you like to provide the news feed on your website. You´re welcome to do so - it is for free! 

There is a obvious unsubscribe link at the beginning of each e-mail so when ever you´re feeling fully saturated just click on the link to unsubscribe ;-)

This is especially convenient for those of you in countries were LinkedIn is currently blocked, which is typically the way of getting the news otherwise. Just click on the links below and you can set it up as you like (two examples as screendumps below).

BALD News Blog: http://feeds.feedburner.com/AldNewsBlog-BaldEngineering

BALD Financials: http://feeds.feedburner.com/BaldFinancials



Tuesday, August 15, 2017

Oxford Instruments Plasma Technology announces a new partner in Korea

Oxford Instruments Plasma Technology is delighted to announce that it has signed an Agent Agreement with Woowon Technology Co. Ltd. in Korea. Woowon, established in 1990, are experts in the semiconductor industry, offering a wealth of experience to customers engaged in the development and manufacture of Semiconductor, LED, Solar Energy and MEMS devices.

Source : Nanotechnology Now (LINK)


Wonik IPS looks promising on increased demands for semicon equipment

As reported by Pulse: According to Seoul-based market data provider FnGuide, Wonik IPS’s operating profit for the second quarter ended June is estimated to have been a record-high of 42.1 billion won ($37.4 million). Sales and operating profit for full 2017 are also expected to reach 581.1 billion won and 123.1 billion won, respectively, versus 244.1 billion won and 28.7 billion won last year, according to the data provider. Market analysts forecast the corresponding figures could go higher to 660.8 billion won and 144 billion won next year. 



Wonik IPS, separated from Wonik Holdings in April 2016, runs two mainstay operations. Its semiconductor business manufactures plasma-enhanced chemical vapor deposition (PECVD) and atomic layer deposition (ALD) equipment, while display business is responsible for supplying in-factory delivery equipment. As of last year, sales from its semiconductor business accounted for 70.6 percent of its entire sales while display business for the remainder. 

Thursday, August 10, 2017

Dow & DuPont Set Aug. 31 for Closing of Historic Chemical Merger

Bloomberg reports that: Dow Chemical Co. and DuPont Co., the two largest U.S. chemical makers, have received all the regulatory approvals needed to close their historic merger.

The deal will be completed after the stock market closes on Aug. 31, the companies said in a statement Friday. Shares of DowDuPont Inc. will begin trading Sept. 1 under the ticker DWDP.

KKR puts planned buyout of Hitachi Kokusai on hold

TOKYO (Reuters) - U.S. buyout firm KKR has put on hold a planned acquisition of Hitachi Ltd's chip making equipment and video solution business, the companies said, citing issues over the terms of the deal.

KKR in April agreed to buy Hitachi Kokusai Electric in a deal valuing the company at about $2.3 billion and was due to buy up to 48.33 percent of the company at 2,503 yen per share through a tender offer as a first step in the process. The tender offer was due to start as early as Thursday. 


But a third-party committee reported to board of directors at Hitachi Kokusai Electric that it no longer supported the terms of the planned transaction which could be disadvantageous to minority shareholders of Hitachi Kokusai.

On April 26, when KKR announced the deal, Hitachi Kokusai shares closed at 2,675 yen, 6.9 percent higher than the KKR's offer price. The stock has since risen above that level and closed at 2,894 yen on Wednesday.

KKR said the third-party committee "finds it difficult at the current time to maintain its opinion that the legitimacy and propriety of the tender offer price and share repurchase price are ensured..."

As part of the deal, Hitachi Kokusai was also planning to buy a 51.67 percent stake held by its parent Hitachi at 1,710 yen a share and then cancel the shares.

KKR is also planning to sell a 40 percent stake in Hitachi Kokusai's video solutions business to Hitachi and a Japanese investment fund, Japan Industrial Partners Inc.

KKR said that it would continue discussions with Hitachi Kokusai, Hitachi and Japan Industrial Partners on its plans regarding the tender offer, whether to go ahead with it and its possible timing.

Tuesday, August 8, 2017

Silicon Wafer Shortage Starts in 2018

TECHCET's model shows all slack soon gone from supply-chain for both 300mm and 200mm diameter

San Diego, CA, July 27, 2017:  TECHCET CA—the advisory service firm providing electronic materials information—today announced that the silicon wafer supply for semiconductor device fabrication is forecasted to appreciably lag demand starting next year, and could remain in shortage through the year 2021 despite investments in China. Silicon wafer area demand is forecasted to steadily increase at a CAGR of ~3.1% over the 2016-2021 period to reach over 13,000 million square inches (MSI). Executives of silicon wafer suppliers have stated that average selling prices have remained too low to allow for investment in 300mm expansions, as detailed in a quarterly update to the TECHCET Critical Materials Report™, “Silicon Wafers Market & Supply-Chain."

 
The silicon wafer supply-chain is dominated by two suppliers--Shin-Etsu Handotai and SUMCO--combining to capture almost two-thirds of the global wafer market in 2016, and the top five representing over 92% of total revenues. The silicon wafer market is maturing as evidenced by recent mergers and acquisitions, the two most notable being the acquisition of SunEdison Semi by GlobalWafers (Taiwan) and the assumption of majority ownership of LG Siltron by SK Holdings (Korea).

"Over the last five years, the average selling price per square inch of semiconductor-grade silicon wafers has declined by about a third and more than a half from the 2007 level," explained Michel Walden, lead author of the report and senior technology analyst with TECHCET. “However, current tightness in the supply-chain has led to greater stability and even price increases in some cases, all of which is likely needed for the long-term health of the wafer suppliers.”

Over the past few years, silicon suppliers decommissioned roughly 25% of the peak capacity for 200 mm wafers. Of the remaining 200 mm capacity, roughly 65 % of the total demand is for epitaxial (epi) wafers, and a series of epi service companies have embraced this opportunity and provide a variety of layer configurations for their customers.

Global suppliers of silicon wafers covered in this report include:
  • GlobalWafers Silicon,
  • LG Siltron,
  • National Silicon Industry Group,
  • Okmetic Ojy,
  • Siltronic,
  • Shin-Etsu Chemical Co. Ltd. (SEH),
  • SUMCO Corp.,
  • SunEdison Semiconductor,
  • Wafer Works, and
  • Zing Semiconductor.


ABOUT TECHCET:  TECHCET CA LLC is an advisory service firm focused on process materials supply-chains, electronic materials technology, and materials market analysis for the semiconductor, display, solar/PV, and LED industries. Since 2000, the company has been responsible for producing the SEMATECH Critical Material Reports, covering silicon wafers, semiconductor gases, wet chemicals, CMP consumables, Photoresists, and ALD/CVD Precursors. For additional information about these reports or CMC Fabs membership please contact Diane Scott or Michel Walden at info@cmcfabs.org  +1-480-332-8336, or go to www.techcet.com or www.cmcfabs.org  +1-480-332-8336, or go to www.techcet.com or www.cmcfabs.org
 

Friday, August 4, 2017

Semiconductor Capital Spending Is Forecast to Grow 10.2 Percent in 2017

Gartner Says Worldwide Semiconductor Capital Spending Is Forecast to Grow 10.2 Percent in 2017

(Gartner press release, August 2, 2017) Worldwide semiconductor capital spending is projected to increase 10.2 percent in 2017, to $77.7 billion, according to Gartner, Inc. This growth rate is up from the previous quarter's forecast of 1.4 percent, due to continued aggressive investment in memory and leading-edge logic which is driving spending in wafer-level equipment (see Table 1).

"Spending momentum is more concentrated in 2017 mainly due to strong manufacturing demand in memory and leading-edge logic. The NAND flash shortage was more pronounced in the first quarter of 2017 than the previous forecast, leading to over 20 percent growth of etch and chemical vapor deposition (CVD) segments in 2017 with a strong capacity ramp-up for 3D NAND,"
said Takashi Ogawa, research vice president at Gartner.

According to Gartner's latest view, the next cyclical down cycle will emerge in 2018 to 2019 in capital spending, compared with 2019 to 2020 in the previous quarter's forecast. "Spending on wafer fab equipment will follow a similar cycle with a peak in 2018. While the most likely scenario will still keep positive growth in 2018, there is a concern that the growth will turn negative if the end-user demand in key electronics applications is weaker than expected," said Mr. Ogawa.

Worldwide Semiconductor Capital Spending and Equipment Spending Forecast, 2016-2020(Millions of Dollars)
 

Thursday, August 3, 2017

Silicon wafer shortage starts in 2018

TECHCET CA, an advisory service firm providing electronic materials information, today announced that the silicon wafer supply for semiconductor device fabrication is forecasted to appreciably lag demand starting next year, and could remain in shortage through the year 2021 despite investments in China. Silicon wafer area demand is forecasted to steadily increase at a CAGR of ~3.1% over the 2016-2021 period to reach over 13,000 million square inches (MSI). Executives of silicon wafer suppliers have stated that average selling prices have remained too low to allow for investment in 300mm expansions, as detailed in a quarterly update to the TECHCET Critical Materials Report, “Silicon Wafers Market & Supply-Chain.”

Full story - Source: Solid State Technology LINK

 

Tuesday, August 1, 2017

Versum Materials Reports Third Quarter Fiscal 2017 Financial Results

TEMPE, Ariz.-(BUSINESS WIRE)-Versum Materials, Inc. (NYSE: VSM), a leading global materials and equipment supplier to the semiconductor industry, today reported results for the fiscal third quarter ended June 30, 2017. Sales of $290.8 million were up 19.8% from the same quarter a year ago, driven by robust volume growth from both business segments, Delivery Systems.

Source: Blackbird LINK


Materials:
Sales for the fiscal third quarter ended June 30, 2017 were $206.4 million, up 6.7% from the same quarter a year ago. This increase was led by strong growth in Advanced Materials with flat results in Process Materials due to capacity limitations and unfavorable price/mix. Currency contributed 1% to the increase.

Delivery Systems & Services (DS&S):
Sales for the fiscal third quarter ended June 30, 2017 were $83.5 million, up 69.7% from the same quarter a year ago, primarily driven by continued strong equipment sales growth due to robust demand from the memory market, next generation nodes and growth in China.





San’an Optoelectronics qualifies AIXTRON Showerhead Reactor for production of Deep UV LEDs

Novel process chamber design enables enhanced fabrication of high performance Deep UV LEDs

AIXTRON SE (FSE: AIXA), a worldwide leading provider of deposition equipment to the semiconductor industry, announced today that globally leading Chinese optoelectronics manufacturer San’an has successfully completed the qualification of AIXTRON’s novel Close Coupled Showerhead (CCS) process chamber designed for the production of Deep Ultra Violet (DUV) LEDs.

The new process chamber is based on AIXTRON’S well proven CCS technology. It is the first commercially available MOCVD reactor that offers the extremely high process temperatures as needed for the production of DUV LEDs. The enhanced chamber performance facilitates cost-efficient high volume manufacturing of DUV LEDs as used for water and air purification. The configuration of 19 x 2-inch wafers represents the largest capacity currently available in the market for this high end MOCVD application.

Thursday, July 27, 2017

Memory chip boom - Samsung Q2 operating profit up 73 percent

Samsung Electronics said a memory chip boom that propelled it to record profit in the second quarter is likely to continue in the third, just as revenue is widely expected to benefit from sales of OLED screens to Apple.

The world’s biggest maker of memory chips, smartphones and TVs is set to smash its annual profit record after better-than-forecast performance in its mobile business lifted April-June profit slightly above its early-July guidance, analysts said.

“Looking ahead to the third quarter, the company expects favorable semiconductor conditions to continue,” Samsung said in a statement on Thursday. “Although overall earnings may slightly decline quarter-on-quarter as earnings weaken for the display panel and mobile businesses.”

Source: VentureBeat LINK

Flexible AMOLED capacity to almost double each year until 2020

OLED-Info reports that estimates by IHS that flexible AMOLED production capacity is set to increase from 1.5 million square meters to 20.1 million square meters between 2016 and 2020, which would correspond to a compound annual growth rate of 91%.

Source: OLED-Info (LINK)


The Korean CVD & ALD OEMs stocks are travelling upwards since April 2017 (see below). Surely based on investments by Samsung and SK Hynix for Foundry, DRAM and 3D-NAND but this must also reflect order intake from Korean and Chinese AMOLED 6 Gen lines to some extent.

Recent announcments for Semi orders:

Tes signed 16.75 billion won contract with Samsung Electronics Co Ltd, to provide semiconductor manufacturing system (LINK

Eugene Technology signed a 7.36 billion won contract with SK hynix to provide semiconductor manufacturing equipments (LINK)

Tes signed a 2.8 billion won contract with SK hynix Inc to provide semiconductor manufacturing equipment . (LINK)