ALD for moisture protection
Wherever we have electronics, we have circuit boards (CB). The ever-increasing demand for higher performance of electronics in more demanding environmental conditions is pushing the limits of current circuit board packaging technologies’ performance. If the circuit boards are designed and assembled well, they should endure in the environment they are intended to work in. However, in new challenging environments, CBs may need maintenance more often than would be desirable. Usually moisture and temperature are the greatest threats to circuit boards and they accelerate failure generation.
Electrochemical migration (ECM) is one nasty phenomenon in circuit assemblies. What it needs to be manifested is moisture, electrical current and conductive residues. When an electronic product is in use, there is obviously current available for the ECM to happen. To effectively prevent ECM, one needs to either eliminate moisture or the residues.
Full article: Beneq Blog (LINK)
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