China based Yangtze Memory Technologies Co. (YMTC) has reportedly started volume production of 64-layer 3D NAND. The triple-level cell chips with 256GB capacity use the company’s proprietary Xtacking architecture for bonding two dies together. The Chinese firm has gradually increased its 3D NAND yield and will be ramping its Wuhan factory to 100,000 wafers per month in 2020; although, that could further grow to 150,000 wafers per month.
In the Xtacking architecture, the chips are manufactured on two wafers. One wafer contains the ‘periphery’ CMOS logic, and the other one has the actual 3D NAND, based on common charge trap technology. The wafers are then bonded together with a process step, with billions of what it calls metal Vertical Interconnect Accesses (VIAs). Xtacking makes YMTC’s 64-layer 3D NAND within 80-90% the density of other’s 96-layer 3D NAND, it claimed. YMTC intends to skip the 96-layer generation and move directly to 128 layers.
Source: Tom´s Hardware LINK
Yangtze Memory Technologies Co., Ltd. (“YMTC”), established in Wuhan, China in July 2016, is an IDM memory company with a focus on the design, production and sales of 3D NAND flash memory chips. Leveraging on its wholly owned subsidiary XMC’s existing 12-inch IC fab in Wuhan and the R&D capabilities developed through its international partnerships and domestic collaborations,YMTC has successfully designed and manufactured the first 3D NAND flash chips in China since 2017. With respective R&D Centers in cities such as Wuhan, Shanghai, and Beijing, YMTC is committed to becoming potentially a global leading NAND flash memory solution provider through persistent efforts and technical innovations.(http://www.ymtc.com/)
By Abhishekkumar Thakur