ASM International announces Q4 2019 orders substantially above guidance
Reflecting stronger than expected market conditions, order intake in Q4 2019 came in slightly above €370 million, substantially above the range of €290-310 million that ASMI guided for with the publication of the Q3 2019 results on October 30, 2019. Based on preliminary numbers, sales in Q4 2019 slightly exceeded the high end of the guidance of €310-330 million.
Both Q4 orders and preliminary sales mentioned above, as well as previous Q4 guidance,, do not include the earlier announced proceeds of US$61 million (approximately €56 million) related to the settlement of the arbitration proceeding with Kokusai Electric Corporation.
ASMI will report fourth quarter and full-year 2019 financial results on February 25, 2020.
Both Q4 orders and preliminary sales mentioned above, as well as previous Q4 guidance,, do not include the earlier announced proceeds of US$61 million (approximately €56 million) related to the settlement of the arbitration proceeding with Kokusai Electric Corporation.
ASMI will report fourth quarter and full-year 2019 financial results on February 25, 2020.
Picosun's ALD Technology Enables 3D Silicon-Integrated Microcapacitors With Unprecedented Performance
Picosun Group, a global provider of leading AGILE ALD® (Atomic Layer Deposition) thin-film coating solutions, reports record performance of silicon-integrated, three-dimensional deep trench micro capacitors manufactured using its ALD technology. Increasing efficiency and performance demands of portable and wearable electronics, along with their shrinking size in accordance with the Moore's law, set new challenges to the power management of these devices as well. A solution is the further integration of the devices' key components into so-called SiP (systems-in-package) or SoC (systems-on-chip) architectures, where everything, including the energy storage such as batteries or capacitors, is packed close to each other into one compact, microscale-miniaturized assembly. The post Picosun's ALD Technology Enables 3D Silicon-Integrated Microcapacitors With Unprecedented Performance appeared first on Semiconductor Digest.Metal mask coating by ALD for reliable plasma process in PECVD
NCD has steadily developed large area and high throughput ALD equipment and technology. The applications for display, solar cell, and semiconductor fields have been already commercialized, and also NCD has worked hard to find use in special markets like excellent plasma protective coating on metal masks. NCD will aggressively respond to the development and then supply of ALD equipment, which customers would need for various industries in the future.TSMC is being pressured to make chips in the US because of security concerns
The United States has increased its pressure on the Taiwan Semiconductor Manufacturing Company, aka TSMC, for producing its military-use chips in the country. This is being done to ensure that the world's biggest contract chipmaker can manufacture the high-security components free from potential Chinese interference.
The post TSMC is being pressured to make chips in the US because of security concerns appeared first on Gizmochina.
No comments:
Post a Comment