AIXTRON reaches important milestone for its silicon semiconductor manufacturing technology
AIXTRON SE (FSE: AIXA; NASDAQ: AIXG), a worldwide leading provider of advanced deposition equipment to the semiconductor industry, announced today that a major memory manufacturer has qualified its
QXP-8300 Atomic Layer Deposition (ALD) mini-batch system (www.aixtron.com)
QXP-8300 Atomic Layer Deposition (ALD) mini-batch system suitable for high-k oxide films in various advanced memory applications including 3D structure devices.
“We are delighted that our customer has completed the evaluation of our QXP-8300 ALD system for the manufacturing of the most advanced high performance memory devices. The QXP-8300 ALD system enables the manufacturing of advanced films with excellent electrical and device properties. AIXTRON is looking forward to further support its customer’s memory development plans by providing the production equipment to address the challenges of a rapidly evolving industry,” says Bill Bentinck, Vice President and General Manager of AIXTRON Inc., USA.
As the semiconductor memory cell size continues to be scaled down, manufacturers need advanced technologies for the deposition of precise layers of dielectric, metal and non-volatile memory materials. AIXTRON’s QXP-8300 ALD system includes the patented TriJet vaporizer technology integrated with the unique close coupled showerhead design that enables the use of low vapor pressure precursors as needed in making higher-k dielectrics and metal nitrides for the performance improvement.