Monday, May 29, 2017

TSMC to start 7nm production using Immersion Lithography in 2018 & EUV will follow 2019

DigiTimes Reports: Taiwan Semiconductor Manufacturing Company (TSMC) is set to move its 7nm process technology to volume production in 2018, an improved version of the 7nm process using extreme ultraviolet (EUV) will be ready for volume production a year later, according to company co-CEO CC Wei.

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