Wednesday, August 31, 2016

Eugene Tech expects upward momentum from 3-D NAND memory

Here is a very informative article in The Korea Herald on Eugene Technology, a 1.1 billion won ($978,000) Korean wafer process tool provider. Amongst many technologies Eugene supplies Phoenix plasma enhanced atomic layer deposition system to SK Hynix and Samsung and is competing with the usual suspects ASM International, Lam Research and Applied Materials in this market. I do not know but judging by the target applications (see below) I would not be surprised if they have a share of multiple patterning as well as 3DNAND ALD layers at the memory fabs in Korea and I must say that it has been a wise choice to target oxide and nitride ALD applications rather than Metal and High-k since the huge growth in this market for multiple patterning and spacers across DRAM, NAND, 3DNAND and Logic.

Established in 2000, Eugene Tech supplies chip-producing equipment and tools to the world’s leading semiconductor producers, including Samsung Electronics. Last year, it raised 94.7 billion won in total sales. Samsung and SK Hynix were the two largest customers.

Please check out the complete article : LINK

Eugene Technology PEALD Target applications

Listed target applications of the Phoenix PEALD Tool (Phoenix PEALD)

You may also find this article in Seeking Alpha interesting: Korea's Capex Holds The Key To Strong Semiconductor Equipment Sales

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