After
being pushed out since the first intended insertion at 32 nm EUV
lithography is now heading for production. ASMLs financial supporters
(Intel, TSMC and Samsung) will reportedly start using EUV at 7 nm and
are ordering additional EUV tools froma ASML.
- In Q1 EUV backlog grows to 21 systems valued at 2.3 billion euros
- Expects three NXE:3400B shipments in the second-quarter of 2017
According
to Peter Wennink, ASML's president and CEO, the 21 systems in the
backlog are heading to five different customers. One can assume that
these are Intel, Samsung, TSMC and Globalfoundries and either Micron or
Hynix. He also said that ASML has two additional potential customers for
EUV orders.
ASM Head office and engineering buildings in Veldhoven, NL (www.asml.com)
Interesting
now is to see how this all plays out for ALD tools sales since
Immersion lithography based multiple patterning spacers is one of the
biggest segments for ALD tool sales by ASMI, Jusung Engineering, Applied
Materials and Tokyo Electron. However, it is a symbiotic situation and
there are a limited number of paths forward in scaling so most probably
overall it is most beneficial for ALD that scaling continuous rather
than coming to an halt.
More details through these reports:
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