Precursors for metals and dielectrics in strong demand for finFETs and 3D-NAND
San
Diego, CA, July 11, 2017: TECHCET CA—the advisory service firm
providing electronic materials information—today announced that
specialty chemical precursor market for the deposition of dielectrics
and metals in integrated circuit (IC) fabrication is forecasted to
increase at ~10% CAGR through the year 2021. TECHCET’s proprietary Wafer
Forecast Model (WFM) shows that 3D-NAND devices are expected to grow at
a rapid pace from 2016 and become one of the top three market segments
by 2020. Logic ICs will continue to evolve, from 3D finFET devices to
Gate-All-Around Nano-Wires (GAA-NW), enabled by new critical materials
and manufacturing processes as detailed in new reports from TECHCET,
“Advanced Insulating Dielectric Precursors,” and "ALD/CVD High-k &
Metal Precursors."
Precursors
tracked by TECHCET for ALD/CVD of metal and high-k dielectric films on
IC wafers include sources of aluminum, cobalt, hafnium, tantalum,
titanium, tungsten, and zirconium. The total market for 2017 is now
estimated to be US$435M, growing to US$638M in 2021. The top-2 suppliers
are estimated to hold more than half of the total available market,
with many players competing to supply the next enabling molecule. In
particular, cobalt precursor demand is forecasted to reach >$80M in
2021 as foundries transition to below 14nm-node processing. As a
potential conflict mineral, TECHCET tracks the sub-suppliers of cobalt.
“Metal
precursors have had double-digit growth over an extended period of
time, and we expect that to continue as the IC industry transitions to
10nm- and 7nm-node logic and 3D-NAND fabrication, with an average long
term CAGR of 11% over 2013 to 2021,” says Dr. Jonas Sundqvist, lead
author of the report, senior technology analyst with TECHCET and
researcher with Fraunhofer IKTS. “Dielectric precursors growth today is
clearly driven by dielectric PEALD deposition in multiple patterning,
and by dielectric CVD in 3D-NAND.”
Precursors tracked
by TECHCET for ALD/CVD/SOD of advanced dielectric films on IC wafers
include multiple sources of silicon. The total market for 2017 is now
estimated to be just over US$400M, growing to US$560M in 2021. Current
growth over 10% is expected to slow slightly to be in the 8-10% range
over 2019-2021. Anticipated near-term developments include transitions
from CVD to ALD for several IC fab modules.
Global Suppliers of Critical Materials covered in this report include:
Adeka,
Air Liquide,
Dow Corning,
Entegris,
Epivalence,
Fujifilm,
Gelest,
H.C. Starck,
Honeywell,
Kojundo,
Merck EMD,
Nanmat Technology,
Norquay Technology,
Nova-Kem,
Nanogen Solutions,
Pegasus,
Praxair,
STREM,
TCI Chemicals,
Tanaka,
Tri-Chemical Laboratories,
Umicore,
UP Chemical,
Versum Materials,
Wonik Materials.
Purchase Reports Here:
http://techcet.com/product-category/ald-cvd-precursors/http://techcet.com/product-category/ald-cvd-precursors/
ABOUT
TECHCET: TECHCET CA LLC is an advisory service firm focused on process
materials supply-chains, electronic materials technology, and materials
market analysis for the semiconductor, display, solar/PV, and LED
industries. Since 2000, the company has been responsible for producing
the SEMATECH Critical Material Reports, covering silicon wafers,
semiconductor gases, wet chemicals, CMP consumables, Photoresists, and
ALD/CVD Precursors. For additional information about these reports or
CMC Fabs membership please contact Diane Scott or Michel Walden at
info@cmcfabs.org +1-480-332-8336, or go to
www.techcet.com or
www.cmcfabs.org +1-480-332-8336, or go to www.techcet.com or www.cmcfabs.org
