Hefei Rui-Li (transliterated from Chinese) Integrated Circuit will start making DRAM chips using 19nm process technology around the end of February 2018, according to industry sources.
Formerly named Hefei Chang Xin, Rui-Li IC will start installing equipment at its new 12-inch fab at the end of 2017 which is ahead of schedule, said the sources. Rui-Li has started negotiating with silicon wafer providers to ensure a sufficient supply.
Formerly named Hefei Chang Xin, Rui-Li IC will start installing equipment at its new 12-inch fab at the end of 2017 which is ahead of schedule, said the sources. Rui-Li has started negotiating with silicon wafer providers to ensure a sufficient supply.
Source : DIGITIMES LINK
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