Saturday, September 7, 2019

TSMC sees strong demand for 7nm node and its FinFET Plus EUV process for Huawei

[DigiTimes] The overall semiconductor market may be weak, but TSMC has seen strong demand for its 7nm manufacturing capacity, with orders, particularly those from Chinese clients, already extending to the first half of 2020, despite uncertainties arising from the US-China trade war. One of its major clients is Huawei, who is said to be releasing its Kirin 990 chip with an integrated 5G modem built using TSMC's 7nm FinFET Plus EUV process. 
While TSMC sits comfortably at the top of the foundry sector, the DRAM sector mostly sees a three-horse race between Samsung Electronics, SK Hynix and Micron Technology. And it is no surprise that a recent meeting reportedly between Micron CEO Sanjay Mehrotra and executives from China's Tsinghua Unigroup - which is keen to develop its own DRAM prowess - has sparked some speculation.
Source DigiTimes LINK
The Kirin 990 is the world's first mobile SoC with over 10 billion transistors. It is based on a 7nm EUV process that will also offer better power efficiency compared to processors with a separate 5G modem like the Kirin 980 + Balong 5000 combination. The 5G modem embedded into the mobile application processor can offer a download speeds of up to 2.3Gbps and upload speeds of 1.25Gbps. [LINK]

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