Intel is investing $1 Billion In 14nm to meet demand

According to wccftech.com [LINK] Intel 10nm is on track for HVM 2019 and they are investing an additional $1 billion in 14nm production ramp.

 

"We are clearly entering into uncharted territory as far as the x86 market goes, with demand at an all-time high, Intel struggling to get its 10nm process out and AMD as competitive as ever. Intel’s 14nm process has been seeing incredible demand and the company will be putting in an additional $1 billion to ramp production up. One key thing to note here is that hardware for 14nm and 10nm fabrication is about the same – which essentially means that there is very little opportunity cost for chasing 14nm production at this time. Simply put, this update was great news for Intel shareholders."

To address this challenge Intel will:

• Invest a record $15 billion in capital expenditures in 2018, up approximately $1 billion from the beginning of the year. We’re putting that $1 billion into our 14nm manufacturing sites in Oregon, Arizona, Ireland and Israel. This capital along with other efficiencies is increasing our supply to respond to your increased demand.
• Improve yields for 10nm and expect volume production in 2019.

VEECO Ready to Provide Solutions for Micro LED Technology

 

As one of the most important next generation display technologies, Micro LED performs excellently and can be widely applied in wearables, mobile phones, automotive displays, AR/VR, video wall (digital display), TV and others. For solving the technology bottlenecks of Micro LED, the development of technology relies on cooperation between different companies with their expertise in equipment, materials, panels and brands.

 

Aside from the performance of products, LED manufacturers also need to consider their operation cost. Veeco has been helping them to reduce the cost of ownership with its equipment and has launched two sets of equipment, Propel enLight GaN MOCVD System and EPIK 868, for optimizing the operation to meet the demands of the market. Propel enLight GaN MOCVD System produces 200mm (8-inch) wafers and EPIK 868 produces 150mm (6-inch) wafers.

Source: LEDinside LINK

GLOBALFOUNDRIES Extends FinFET Offering with New Features to Enable Tomorrow's Intelligent Systems

GLOBALFOUNDRIES Extends FinFET Offering with New Features to Enable Tomorrow's Intelligent Systems.

 

Santa Clara, Calif., September 25, 2018 – As part of the company's new focus on intensifying investment in differentiation, GLOBALFOUNDRIES announced today at its annual Global Technology Conference (GTC), plans to introduce a full set of new technology features to its 14/12nm FinFET offering. The features are designed to deliver better scalability and performance for applications in high-growth markets such as hyperscale datacenters and autonomous vehicles.

Source: Design And Reuse LINK

TSMC to set up new fab for advanced packaging

Taiwan's Environmental Protection Administration (EPA) has started its environmental impact assessment on land designated for construction of a new plant by Taiwan Semiconductor Manufacturing Company (TSMC) in Chunan, Miaoli (northern Taiwan), according to government sources locally. 

 

Source: DIGITIMESLINK

Sino-emic Chooses Oxford Instruments Plasma Technology Etch Systems for Manufacturing Facility

Optoelectronics supplier Oxford Instruments Plasma Technology (OIPT) has announced that Sino-emic has selected OIPT's Cobra plasma etch systems for their manufacturing facilities in Taizhou City, China.Sino-semic, the first all-Chinese developer and manufacturer of vertical-cavity surface-emitting lasers (VCSELs) for face recognition, noted that process capability and local support were key factors in their decision to adopt the high-performance inductively coupled plasma (ICP) etch Cobra systems.

"We chose Oxford Instruments to supply our ICP etch equipment because they offer cutting edge plasma processing systems and unrivalled process support, which will be invaluable to us during our production scheme," said Li Jun, vice general manager at Sino-semic. 

The Cobra process solutions are designed to support device applications such as lasers, radio frequency, power, and advanced LEDs."VCSEL based devices are entering another exciting phase of growth," said Richard Pollard, managing director at OIPT. "We are thrilled to be providing our VCSEL processing solutions to a pioneering production manufacturer such as Sino-semic."Oxford Instruments Plasma Technology offers flexible, configurable process tools and processes for the precise, controllable, and repeatable engineering of micro- and nano-structures.

Source: LINK

The PlasmaPro 100 range of etch and deposition tools can be fitted with a variety of substrate electrodes, enabling processes over a wide temperature range. They offer a 200mm platform with single wafer and multi-wafer batch capability. The process modules offer excellent uniformity, high throughput and high precision processes.[source Oxford Instruments LINK]

No parts from Samsung and no chips from Qualcomm found in iPhone Xs and Xs Max models

Apple  latest iPhones that go on sale around the world on September 21, featuring components made by Intel Corp (baseband processor/modem, RF transceiver), Toshiba (3DNAND), Micron (DRAM) and multiple components from STMicroelectronics among others, according to the iFixit tear down of iPhone Xs and Xs Max models.

 

 

An iPhone XS sit in beer for almost 5 hours! (iFixit teardown)

 

The flash drive from Toshiba has 64 GB of storage and 256 and 512 GB optional configurations. Rather amazing is that the breakdown listed no parts from Samsung and no chips from Qualcomm Inc. During the tear down the iPhone XS Max was also tested for its beer-proofing capabilities and survived being submerged in beer for 5 hours (above).

 

 

Western Digital and Toshiba Memory Corporation are celebrating the opening of Fab 6 and the Memory Development Center in Yokkaichi, Japan

Plessey Chooses AIX G5+ C MOCVD Tool for GaN-on-Silicon Monolithic MicroLEDs Display Innovation

AIXTRON SE (FSE: AIXA), a worldwide leading provider of deposition equipment to the semiconductor industry, has received an order from Plessey Semiconductors for the company’s AIX G5+ C Planetary Reactor®. The metal organic chemical vapor deposition (MOCVD) system will boost Plessey’s manufacturing capability of gallium nitride on silicon (GaN-on-Si) wafers targeting next-generation microLED applications.

With an automatic cassette-to-cassette (C2C) wafer transfer module, the new AIXTRON reactor will be installed and operational during Q1 of 2019 at Plessey’s 270,000 square feet fabrication facility located in Plymouth, UK. The AIX G5+ C MOCVD system has two separate chamber set-up options, which enables configurations of 8x6 inch or 5x8 inch GaN-on-Si wafers to be automatically loaded and removed from the system in an enclosed cassette environment. The system will be an addition to the company’s existing metal organic chemical vapor deposition (MOCVD) reactors, also supplied by AIXTRON, which provide configurations of 7x6 inch or 3x8 inch with manual loading.

Productivity is further enhanced by the new reactor’s automated self-cleaning technology, which helps to deliver a very low level of wafer defects by ensuring the reactor is clean on every run, significantly reducing downtime for maintenance. The new equipment also provides faster ramp and cool down along with a high susceptor unload temperature to reduce the recipe time.

Ampere Announces Availability of eMAG™ for Hyperscale Cloud Computing and Unveils Aggressive, Multi-Generation Roadmap

Partners with Lenovo to deliver Ampere eMAG server platform for high-performance memory-intensive compute systems for cloud workloads

Santa Clara, CA. (September 18, 2018) – Ampere™, which is developing an Arm®-based server platform for the future of hyperscale cloud and edge computing, today announced availability of its first generation Armv8-A 64-bit processors for data centers. Already selected by Lenovo and several ODMs, the Ampere eMAG™ processors deliver excellent total cost of ownership (TCO) value, high-performance compute, high memory capacity, and rich I/O to address cloud workloads including big data, web tier and in-memory databases. Ampere also unveiled its multi-generation roadmap, which includes building its next generation product on 7nm with multi-socket and single socket options, which will be available in 2019. 

 

Swagelok selects Solon as site of new global headquarters and innovation center

Swagelok Company, a global developer and manufacturer of fluid system solutions, announced today that its Board of Directors has approved Solon as the location of its new $30 million - $50 million Global Headquarters and Innovation Center, following a three-month competitive site selection process.

The City of Solon and JobsOhio are both partnering with Swagelok to support the company’s growth and enable Swagelok to expand in Solon. Yesterday, Solon City Council approved its economic development package. Pending Ohio Tax Credit Authority and JobsOhio approvals, the new campus will be built at Swagelok’s present location at 29500 Solon Road in Solon, where the Company has been headquartered since 1965. 

“We are thrilled with the decision to remain in Solon and continue our partnership with the city that has been instrumental in our company’s growth,” stated Arthur F. Anton, chairman and chief executive officer, Swagelok Company. “We offer deep thanks to City of Solon officials, especially Mayor Edward Kraus, and the JobsOhio team for their support and commitment to Swagelok. Their offers enable us to leverage our manufacturing infrastructure and existing investments in the area, while creating a world-class, technologically advanced facility that will support our position as an industry leader and inspire the innovation, productivity, problem solving and collaboration essential for the next phase of our company’s success story.”

The new campus is expected to encompass up to 120,000 square feet of new space and feature a state-of-the-art innovation center, customer welcome center, and business operations center to house 300 to 350 associates, with room for future job growth.

Source: LINK

Amtech Systems: Amtech Announces New N-Type Solar Technology Order

Amtech Systems Inc. a global manufacturer and supplier of advanced thermal processing and polishing equipment and related consumables to the semiconductor / electronics, power IC businesses, solar, and advanced lighting markets, announced its solar subsidiary, Tempress Systems (Tempress) received an order for its current generation of high-throughput quantum diffusion systems, to be used for high efficiency N‑type technology solar cell production. The customer is well respected in the industry as a leader in mass production of high-efficiency N-type solar cells. The order includes our latest generation of diffusion systems and is for more than $6 million. 

 

 Mr. Fokko Pentinga, Chief Executive Officer of Amtech, commented, "In competitive markets, we continue to focus on advancing our technology solutions to meet the market's objective to enhance their manufacturing processes, upgrade their production lines, increase efficiencies, and lowering the total cost of ownership. Although the environment for new solar orders has been challenging, we are pleased to report this new order as we wrap up our fiscal year 2018. As selective investments are being made by the manufacturers of solar cells, the market is recognizing our technology solutions as one of the best opportunities for meeting their goal of upgrading and expanding their capacity for higher efficiency solar cells."

Source: LINK

 

 

Beneq introduces new TFS lifecycle services for ALD tools

[Beneq, LINK] Making the most of ALD equipment with reliable maintenance - Introducing new Beneq TFS lifecycle services

Buying equipment is only the first step on the ALD journey. What matters as much as the equipment is what comes after the initial purchase. With reliable, quality maintenance, your ALD equipment life cycle can be extended and you will get the most out of your investment with reduced downtime. Below are some frequently asked questions and answers about our maintenance services.

Full article : LINK

Veeco GEN10 Automated MBE Cluster System Wins Max Planck Institute Tender, Supporting Research of Oxide-Nitride Layer Structures

Prestigious Research Institute Cited Veeco’s Expertise in MBE and the High Reliability and Customization of the GEN10™ as Key Factors in its Decision

[Veeco, LINK] PLAINVIEW, N.Y., August 14, 2018—Veeco Instruments Inc. (NASDAQ: VECO) today announced that a dual chamber GEN10™ automated molecular beam epitaxy (MBE) cluster system won the tender offer by the Max Planck Institute of Microstructure Physics, Halle (Saale), Germany (MPI-MSP) to support world-class research on complex oxides. Demand for oxide-nitride layer structures has increased due to their enormous potential in enabling next-generation energy-efficient nano-devices and advanced data storage. The department of Nano-systems from Ions, Spins and Electrons (NISE) at the MPI-MSP will leverage Veeco’s MBE technology to expand research and develop innovative applications. 

Veeco's GENxplor R&D MBE System (Veeco.com)

“Our team is highly interested in exploring the properties of atomically engineered oxide-nitride layer structures especially because of their extraordinary properties but also for their potential in paving the way to novel energy-efficient nano-devices,” said Stuart Parkin, Director of the NISE Department at the MPI-MSP and Alexander von Humboldt Professor, Martin Luther University Halle-Wittenberg, Halle. “Veeco’s reputation and expertise in MBE combined with the GEN10’s high reliability, throughput, customization and automation capabilities will help support our research into novel materials.”

This win at MPI marks the first time Veeco has provided a fully integrated solution for a concentrated ozone source. The GEN10 allows for up to three configurable, material-specific growth modules, enabling high system utilization and allowing multiple researchers use the system at the same time to perform unattended growth. By expanding its reach in the R&D sector worldwide, Veeco is leading the way in helping grow complex oxide structures.

“As our MBE systems continue to expand their footprint in the global R&D space, we are honored that Veeco’s GEN10 MBE system was selected by the highly respected Max Planck Institute of Microstructure Physics in Halle,” noted Gerry Blumenstock, vice president and general manager of MBE and ALD products at Veeco. “We are pleased with the confidence Dr. Parkin and his team placed in our MBE expertise and we look forward to supporting the MPI-MSP as it continues to lead R&D exploration and applications for complex oxides.”

Intel to outsource 14nm production due to tight supply

[DIGITIMES, LINK] Intel is encountering tight 14nm process production capacity in-house, and is looking to outsource part of its 14nm chipset production to Taiwan Semiconductor Manufacturing Company (TSMC), according to industry sources.

Intel intends to give priority to its high-margin products mainly server-use processors and chipsets amid its tight 14nm process capacity, and therefore plans to outsource the production of its entry-level H310 and several other 300 series chipsets to TSMC, the sources indicated.

Intel has seen its overall 14nm chip supply fall short of demand by as much as 50%, the sources said. Outsourcing has become the only and appropriate choice for Intel since the company is unlikely to build additional 14nm process capacity, the sources noted.

 

Veeco Announces Changes to Executive Leadership Team

PLAINVIEW, N.Y., September 4, 2018 —Veeco Instruments Inc. (NASDAQ: VECO) today announced that John Peeler, Chairman and Chief Executive Officer, will transition to the role of Executive Chairman, effective October 1, 2018. William J. Miller, currently President, will become Chief Executive Officer and will join the Company’s board of directors bringing the size of the board to eight. Additionally, Shubham (Sam) Maheshwari will be named Chief Operating Officer and will continue in his role as Chief Financial Officer. 

Peeler joined Veeco in 2007 as Chief Executive Officer and became Chairman of the Board in 2012. As Executive Chairman, Peeler will work closely with Miller and the Board to ensure an effective transition of management.

“With his impressive background and track record of notable achievements across strategic, product development and operational assignments, there is no one better suited than Bill to take over the helm as Veeco looks forward to its next chapter,” stated Peeler. “Bill and the executive team have the industry experience to execute Veeco’s vision while remaining committed to enabling tomorrow’s technology breakthroughs.”