No parts from Samsung and no chips from Qualcomm found in iPhone Xs and Xs Max models

Apple  latest iPhones that go on sale around the world on September 21, featuring components made by Intel Corp (baseband processor/modem, RF transceiver), Toshiba (3DNAND), Micron (DRAM) and multiple components from STMicroelectronics among others, according to the iFixit tear down of iPhone Xs and Xs Max models.

 

 

An iPhone XS sit in beer for almost 5 hours! (iFixit teardown)

 

The flash drive from Toshiba has 64 GB of storage and 256 and 512 GB optional configurations. Rather amazing is that the breakdown listed no parts from Samsung and no chips from Qualcomm Inc. During the tear down the iPhone XS Max was also tested for its beer-proofing capabilities and survived being submerged in beer for 5 hours (above).