KLA-Tencor has announced it is
expanding its integrated circuit (IC) packaging portfolio with two new
defect inspection products designed to address a wide variety of IC
packaging challenges: KronosTM 1080 and ICOS™ F160. The two new
inspection systems join KLA-Tencor’s portfolio of defect inspection,
metrology and data analysis systems that help accelerate packaging yield
and increase die sort accuracy. You may find the official release here;
Highlights:
Highlights:
- Kronos 1080 – offers production-worthy, high sensitivity wafer inspection for advanced packaging, providing key information for process control and material disposition.
- ICOS F160 – examines packages after wafers have been diced, delivering fast, accurate die sort based on detection of key defect types—including sidewall cracks, a new defect type affecting the yield of high-end packages.
![](https://blogger.googleusercontent.com/img/b/R29vZ2xl/AVvXsEj7Dvk5gvTWe4Rq5lb_ZEy4gxp5_cMcUxMiZfD0hb1PSCUNp8O4n7siNIXvQsGwongidXuQ1eTHVqRpZvBvhttTggupGHeIRjsJQsg1Fidy5n6XJQt347nKY3-rTb9_Dd7ru1F6j9uBk8Y/s640/KLA-Tencor+Image+8+30+18.jpg)
Kronos™ 1080 and ICOS™ F160 (Image shared by KLA-Tencor)
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