MORRISVILLE,
Pa., July 27, 2018 — Semiconductor material Gelest Inc. has announced
the commercializing of diiodosilane to meet the global demand of the
semiconductor industry for next-generation semiconductor chips.
Diidosilane (LINK)
Gelest’s
dedicated diiodosilane plant in Morrisville is fully operational and
can produce commercial quantities of diiodosilane with purity in excess
of 99.9 percent. Diiodosilane is a key chemical precursor used by
semiconductor companies worldwide in the development and scale-up of
next-generation semiconductor chips that require high-throughput, highly
conformal silicon nitride thin films.
Diiodosilane is typically deposited by plasma-enhanced atomic layer deposition to create the silicon nitride thin film. Gelest sees a significant increase in demand for high purity diiodosilane driven by development and production of semiconductor chips requiring silicon nitride thin films at low thermal budgets.
Gelest is a manufacturer of specialty materials for the semiconductor industry.
Diiodosilane is typically deposited by plasma-enhanced atomic layer deposition to create the silicon nitride thin film. Gelest sees a significant increase in demand for high purity diiodosilane driven by development and production of semiconductor chips requiring silicon nitride thin films at low thermal budgets.
Gelest is a manufacturer of specialty materials for the semiconductor industry.
Source : Photonics LINK
Gelest is sponsoring and exhibiting at the AVS ALD2018 conference currently taking place in South Korea (LINK)
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