Globalfoundries has announced plans to introduce a new 12nm leading-performance (12LP) FinFET semiconductor manufacturing process. The technology is expected to deliver better density and a performance boost over Globalfoundries' current-generation 14nm FinFET offering, satisfying the processing needs of the most demanding compute-intensive applications from artificial intelligence and virtual reality to high-end smartphones and networking infrastructure.
Source: DIGITIMES LINK
Accordig to a press release by Global foundries besides transistor-level enhancements, the 12LP platform will include new market-focused features specifically designed for automotive electronics and RF/analog applications—two of the fastest-growing segments in the industry.
Accordig to a press release by Global foundries besides transistor-level enhancements, the 12LP platform will include new market-focused features specifically designed for automotive electronics and RF/analog applications—two of the fastest-growing segments in the industry.
- Emerging automotive applications in vehicle safety and automated driving require a combination of processing power and extreme reliability. The 12LP platform delivers both, with plans for Automotive Grade 2 qualification at Fab 8 by Q4 2017.
- A new RF offering extends the 12LP platform for RF/analog applications such as premium-tier transceivers in sub-6GHz wireless networks. 12LP offers the best scaling in both logic and memory for RF chip architectures with primarily digital and less RF/analog content.
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