TSMC has grabbed orders for all the 5G modem chips that have been introduced by fabless chipmakers, such as Qualcomm's Snapdragon X50 and HiSilicon's Balong series. TSMC has kicked off volume production for 5G modem chips for Qualcomm and HiSilicon and is gearing up for production for MediaTek's Helio M70 5G modem in the second half of 2019. All their first 5G modem solutions will be built using TSMC's 7nm process technology. Samsung Electronics announced recently that its 5G communication solutions are in mass production for the latest premium mobile devices. Those include Samsung's first 5G modem solution, the Exynos Modem 5100, which uses Samsung's 10nm LPP process.
Source: Digi Times LINK
By Abhishekkumar Thakur
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