Wednesday, March 6, 2019

Chipmakers to scale up 96-layer 3D NAND flash output in 2Q19

The global output of 96-layer 3DNAND flash memory is set to expand starting the second quarter of 2019. NAND flash prices have been falling since 2018, due mainly to an increase in the supply of 64- and 72-layer 3D NAND chips. The memory prices even fell to a record low of under US$0.10 per gigabyte at the end of the year. 
Major chipmakers have moved to slow down their capacity expansion pace aiming to stop NAND flash memory prices from falling further. However, improvement in their new-generation 96-layer 3D NAND production yield rates will still result in supply-side growth. Samsung is set to enter mass production with its 96-layer 3D NAND 512GB UFS 3.0 solutions. Samsung also has plans to roll out 1TB solutions in the 2H 2019. 
Toshiba has rolled out recently its new-generation 96-layer 3D NAND SSD and UFS 3.0 solutions, while Micron has introduced a new SSD series based on 96-layer TLC 3D NAND technology and developed 96-layer QLC NAND technology for 1TB devices, with volume production slated for 2Q 2019. 
Source: DigiTimes Chipmakers to scale up 96-layer 3D NAND flash output in 2Q19 LINK
Samsung capacities up to 1TB will be available from today, with the 2TB model launching in April. Pricing for that part has not yet been announced, however it is likely to be at a similar price density per GB as the 1TB. (Anandtech LINK)

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