TAIPEI (Reuters) - Taiwan Semiconductor Manufacturing Co, the world’s largest contract chipmaker, is planning a T$400 billion ($13.50 billion) investment to expand its research and development capacity for future technologies, a company spokeswoman said on Friday.
Hsinchu serves as the company’s headquarters, a major production facility, and its research and development center, which focuses on future chip technology.
Hsinchu serves as the company’s headquarters, a major production facility, and its research and development center, which focuses on future chip technology.
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