Wednesday, August 31, 2016

Eugene Tech expects upward momentum from 3-D NAND memory

Here is a very informative article in The Korea Herald on Eugene Technology, a 1.1 billion won ($978,000) Korean wafer process tool provider. Amongst many technologies Eugene supplies Phoenix plasma enhanced atomic layer deposition system to SK Hynix and Samsung and is competing with the usual suspects ASM International, Lam Research and Applied Materials in this market. I do not know but judging by the target applications (see below) I would not be surprised if they have a share of multiple patterning as well as 3DNAND ALD layers at the memory fabs in Korea and I must say that it has been a wise choice to target oxide and nitride ALD applications rather than Metal and High-k since the huge growth in this market for multiple patterning and spacers across DRAM, NAND, 3DNAND and Logic.

Established in 2000, Eugene Tech supplies chip-producing equipment and tools to the world’s leading semiconductor producers, including Samsung Electronics. Last year, it raised 94.7 billion won in total sales. Samsung and SK Hynix were the two largest customers.

Please check out the complete article : LINK

Eugene Technology PEALD Target applications

Listed target applications of the Phoenix PEALD Tool (Phoenix PEALD)

You may also find this article in Seeking Alpha interesting: Korea's Capex Holds The Key To Strong Semiconductor Equipment Sales






NCD to deliver Lucida GD series ALD system for OLED encapsulation with Chinese display manufacturer, TIANMA

NCD reports today (8/31 2016) :The OLED market is going to prospect fast gigantic growing in the near future because OLED has the possibilities of bending, folding and various forms like circle, therefore it will be applied for flexible and wearable devices. Flexible OLEDs need excellent thin encapsulation layers in order to keep the property from the permeation of water and oxygen under the external environment using repeated bending, folding and rolling of devices. However, the current encapsulation based on PECVD is not satisfied with future flexible OLEDs, so new encapsulation technology would absolutely be required.

ASM International N.V. Financial Report for the six month period ended June 30, 2016.

ASM International N.V. (Euronext Amsterdam: ASM) today published its Interim, IFRS based, Financial Report for the six month period ended June 30, 2016.

This report includes an Interim Management Board Report, a responsibility statement and Consolidated Condensed Interim Financial Statements prepared in accordance with IAS 34 (Interim Financial Reporting). The Interim Financial Report comprises regulated information within the meaning of the Dutch Financial Markets Supervision Act (Wet op het financieel toezicht) and is available in full on our website www.asm.com.

Related Presentations & Material

 29 July 2016 Second Quarter Earnings Call:WEBCAST  
Investor presentation Q2 2016 | 0.54MB:PDF  
Investor Technology Seminar Presentation 2016 | 4.16MB:PDF  
JP Morgan Tech Conference presentation | 0.49MB:PDF  
22 April 2016 First Quarter Earnings Call | 0.00MB:WEBCAST




Friday, August 19, 2016

Applied Materials CEO: We're the materials innovation leader CNBC Interview

Applied Materials CEO: We're the materials innovation leader

Friday, 19 Aug 2016 | 11:35 AM ET
Gary Dickerson, Applied Materials CEO, discusses his company's quarterly earnings and the trends in the technology and materials spaces. VIDEO

Screendump Gary Dickerson, Applied Materials CEO, discusses his company's quarterly earnings and the trends in the technology and materials spaces in  CNCB. VIDEO

Praxair, Linde said to be discussing $60 billion merger

Praxair, Linde said to be discussing $60 billion merger (8/19/2016) by CMCFabsftp - Praxair headquarters in Burr Ridge, Illinois. Praxair Inc. is in discussions to combine with Germany’s Linde AG, people familiar with the matter said, in a major deal that would create the world’s largest industrial-gas supplier and continue a wave of consolidation in the industry. Details of the talks couldn’t be learned, and one person cautioned […]

Thursday, August 11, 2016

Mergers: Commission opens in-depth investigation into proposed merger between Dow and DuPont

Mergers: Commission opens in-depth investigation into proposed merger between Dow and DuPont (8/15/2016) by CMCFabsftp - Brussels, 11 August 2016 The European Union’s antitrust authority opened a full-blown investigation into the proposed merger of Dow Chemical Co. and DuPont Co., which could require the companies to make bigger concessions to clear their blockbuster deal. The European Commission has opened an in-depth probe to assess whether the proposed merger of Dow and […]

Tokyo Electron to Begin Accepting Orders for Triase+™ EX-II™ TiON

BALD Engineering - Born in Finland, Born to ALD: Tokyo Electron to Begin Accepting Orders for Trias...: Simultaneously as Lam Research launches Fluorine free Tungsten for 3DNAND and DRAM, Tokyo Electron is launching their newest version of the...

Wednesday, August 10, 2016

Lam Research, KLA-Tencor Say Deal Faces Regulatory Holdups

Lam Research Corp. said its $10.6 billion acquisition of KLA-Tencor Corp. is facing regulatory hurdles and probably won’t get approval before the planned closing date in October.

Tuesday, August 9, 2016

Lam Research Enables Next-Generation Memory with Industry's First ALD Process for Low-Fluorine Tungsten Fill

Lam Research Corp. , an advanced manufacturer of semiconductor equipment, today introduced an atomic layer deposition process for depositing low-fluorine-content tungsten films, the latest addition to ...

http://finance.yahoo.com/news/lam-research-enables-next-generation-200500171.html

Monday, August 1, 2016

Advanced Energy winning share in ALD market

Advanced Energy winning share in ALD market as reported by CEO Yuval Wasserman in the Q2 / 2016 Earnings call recorded by Seeking Alpha.

Advanced Energy Industries' (AEIS) CEO Yuval Wasserman on Q2 ... Aug 1, 2016 ... Good day ladies and gentlemen, and welcome to the Advanced Energy Industries Second Quarter 2016 Earnings Conference Call. At this time ...
[...]
This quarter, we again won design slots for advanced memory applications as the migration to even more advanced 3D devices continues. Another area where we are winning share is the emerging atomic layer deposition and etch market. Additionally, we’re winning designs in remote plasma source applications, including wafer processing and abatement.